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11. 发明专利

JP2013008895A Wiring board and manufacturing method of the same 审中-公开
标题翻译：接线板及其制造方法
公开(公告)号：JP2013008895A
公开(公告)日：2013-01-10
申请号：JP2011141523
申请日：2011-06-27
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MANO YASUHIKO , KATO SHINOBU , KARIYA TAKASHI
IPC分类号： H05K3/46 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a wiring board which ensures the inductor performance even if the wiring board includes a small number of layers, and to provide a manufacturing method of the wiring board.SOLUTION: A wiring board 10 includes: a base material 20 having a first surface F and a second surface S; first through hole conductors 30A, 30C, 30E and second through hole conductors 30B, 30D, 30F which penetrate through the base material 20; first conductor patterns 33B, 33C formed on the first surface F side of the base material 20 and connecting the first through hole conductors 30A, 30C, 30E with the second through hole conductors 30B, 30D, 30F; and second conductor patterns 34A, 34B, 34C formed on the second surface S side of the base material 20 and connecting the first through hole conductors 30A, 30C, 30E with the second through hole conductors 30B, 30D, 30F. The first through hole conductors, the second through hole conductors, the first conductor patterns, and the second conductor patterns form an inductor L.
摘要翻译：要解决的问题：提供即使布线板包括少量层也能确保电感器性能的布线板，并且提供布线板的制造方法。解决方案：布线板10包括：具有第一表面F和第二表面S的基材20; 穿过基材20的第一通孔导体30A，30C，30E和第二通孔导体30B，30D，30F; 形成在基材20的第一表面F侧的第一导体图案33B，33C，并将第一通孔导体30A，30C，30E与第二通孔导体30B，30D，30F连接; 以及形成在基材20的第二表面S侧的第二导体图案34A，34B，34C，并且将第一通孔导体30A，30C，30E与第二通孔导体30B，30D，30F连接。第一通孔导体，第二通孔导体，第一导体图案和第二导体图案形成电感器L.版权所有：（C）2013，JPO＆INPIT

12. 发明专利

JP2008034839A Capacitor having adjustable capacitance and printed wiring board having same 审中-公开
标题翻译：具有可调节电容的电容器和具有相同功能的印刷电路板
公开(公告)号：JP2008034839A
公开(公告)日：2008-02-14
申请号：JP2007177108
申请日：2007-07-05
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： SAKAMOTO HAJIME , KARIYA TAKASHI , MANO YASUHIKO
IPC分类号： H01G4/255 , H01G4/12 , H01G4/18 , H01G4/30 , H05K3/46
CPC分类号： H01G4/005 , H01G2/06 , H05K1/162 , H05K3/4644 , H05K2201/09509 , H05K2201/0969 , H05K2203/171
摘要： PROBLEM TO BE SOLVED: To provide a novel capacitor having adjustable capacitance and a printed wiring board having the same. SOLUTION: The capacitance of a capacitor is adjusted by: forming openings in one of a pair of electrodes of the capacitor, the openings having different sizes d1, d2, d3, ... wherein d1>d2>d3... and being arranged in numbers n1, n2, n3, ..., respectively; and sequentially filling a necessary number of the openings with an electroconductive material in descending order of size so as to adjust the capacitance gradually with an increasing degree of precision. The resulting capacitor is included to a printed wiring board. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有可调电容的新型电容器和具有该电容器的印刷电路板。解决方案：通过以下方法来调节电容器的电容：在电容器的一对电极中形成开口，开口具有不同的尺寸d1，d2，d3，...，其中d1> d2> d3 ... 并分别以数字n1，n2，n3，...排列; 并按照尺寸的大小顺序用导电材料依次填充必要数量的开口，以便随着精度的增加逐渐调整电容。所得到的电容器被包括在印刷线路板中。版权所有（C）2008，JPO＆INPIT

13. 发明专利

JP2008021996A Power-supply-integrated package board 有权
标题翻译：电源综合封装板
公开(公告)号：JP2008021996A
公开(公告)日：2008-01-31
申请号：JP2007177205
申请日：2007-07-05
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： KARIYA TAKASHI , MANO YASUHIKO , KONO SHUICHI , CHIN TOSHIMASU
IPC分类号： H01L23/12 , H01L25/00 , H05K3/46
CPC分类号： H01L23/49827 , H01L23/49822 , H01L2224/16 , H01L2224/16235 , H01L2224/45124 , H01L2224/45139 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01047 , H01L2924/01078 , H01L2924/16152 , H01L2924/207 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2224/48 , H01L2924/0002 , H01L2224/0401 , H01L2924/01005
摘要： PROBLEM TO BE SOLVED: To provide a small-sized power-supply-integrated package board which can supply low voltages and large currents to the IC side and reduce the height of a power supply. SOLUTION: A magnetic layer 74B is formed on the surface of a copper wire 74C so that the magnetic saturation of the copper wire 74C hardly occurs and that an inductor 74 comes to have sufficient inductance. A plurality of the inductances 74 are arranged in rows, and are fixed with resin 72 to make an inductor array 70. This allows arranging many inductors in a small space, thus enabling power supply division. Power supply division increases the number of feeder cables 52 to lessen a current volume per feeder cable 52, which enables supply of a large current to the IC chip 40 side. In addition, a power supply module 50 is built in the package board 30. This shortens the distance between the power supply and the IC chip 40, which reduces heat generation and voltage drop by the feeder cables 52, thereby facilitates supply of large currents to the IC chip 40 side. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够向IC侧提供低电压和大电流并降低电源高度的小型电源集成封装板。解决方案：在铜线74C的表面上形成磁性层74B，使得铜线74C的磁饱和几乎不发生，并且电感器74具有足够的电感。多个电感器74排列成行，并用树脂72固定以形成电感器阵列70.这允许在许多空间中布置许多电感器，从而实现电源分配。供电部分增加馈电电缆52的数量，以减小每个馈电电缆52的电流容量，这使得能够向IC芯片40侧提供大电流。此外，电源模块50内置在封装板30中。这缩短了电源和IC芯片40之间的距离，这减少了馈电电缆52的发热和电压降，从而有助于将大电流提供给 IC芯片40侧。版权所有（C）2008，JPO＆INPIT

14. 发明专利

JP2014160751A Printed-wiring board 审中-公开
标题翻译：印刷线路板
公开(公告)号：JP2014160751A
公开(公告)日：2014-09-04
申请号：JP2013030842
申请日：2013-02-20
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MANO YASUHIKO , YOSHIKAWA KAZUHIRO , MORITA HARUHIKO
IPC分类号： H05K1/14 , H05K1/16 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board including an inductor having high inductance.SOLUTION: A first inductor component 110 is formed on a first printed wiring board 101, and a second inductor component 310 is formed on a mother board. A printed wiring board is formed by the first and second printed wiring boards, and the first and second inductor components are connected with each other.
摘要翻译：要解决的问题：提供一种包括具有高电感的电感器的印刷线路板。解决方案：第一电感器部件110形成在第一印刷线路板101上，第二电感器部件310形成在母板上。印刷电路板由第一和第二印刷电路板形成，第一和第二电感元件彼此连接。

15. 发明专利

JP2014154813A Printed wiring board 审中-公开
标题翻译：印刷线路板
公开(公告)号：JP2014154813A
公开(公告)日：2014-08-25
申请号：JP2013025486
申请日：2013-02-13
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MORITA HARUHIKO , MANO YASUHIKO , YOSHIKAWA KAZUHIRO
IPC分类号： H05K3/46 , H05K1/16
CPC分类号： H01F17/0013 , H01F2017/0066
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board having a high inductance value.SOLUTION: Coil layers 58BL, 58DL are formed on a build-up layer of a printed wiring board 10 and an inductor component is incorporated into a core substrate of the printed wiring board.
摘要翻译：要解决的问题：提供具有高电感值的印刷线路板。解决方案：线圈层58BL，58DL形成在印刷线路板10的积层上，并且电感器部件被并入到印刷线路板。

16. 发明专利

JP2012186440A Inductor component, printed circuit board incorporating the component, and manufacturing method of the inductor component 审中-公开
标题翻译：电感元器件，印制电路板组件，以及电感元器件的制造方法
公开(公告)号：JP2012186440A
公开(公告)日：2012-09-27
申请号：JP2011239304
申请日：2011-10-31
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MANO YASUHIKO , KATO SHINOBU , KARIYA TAKASHI
IPC分类号： H05K3/46
CPC分类号： H05K3/4602 , H01F17/0033 , H01F2017/004 , H01L2224/16227 , H01L2924/15311 , H05K1/185 , H05K3/0032 , H05K2201/1003 , H05K2203/1469 , H05K2203/1572 , Y10T29/4913
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board incorporating an inductor component.SOLUTION: An inductor component is formed by alternately laminating coil layers and resin insulation layers. The inductor component is incorporated in a core substrate of the printed wiring board.
摘要翻译：要解决的问题：提供一种包含电感器部件的印刷线路板。解决方案：通过交替层叠线圈层和树脂绝缘层形成电感器部件。电感器部件结合在印刷线路板的芯基板中。版权所有（C）2012，JPO＆INPIT

17. 发明专利

JP2009188401A Printed circuit board with built-in capacitor 审中-公开
标题翻译：具有内置电容器的印刷电路板
公开(公告)号：JP2009188401A
公开(公告)日：2009-08-20
申请号：JP2009015019
申请日：2009-01-27
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MANO YASUHIKO , YAMASHITA TAKASHIGE , TSUCHIYA YOSHITAKE , KARIYA TAKASHI
IPC分类号： H05K3/46 , H01G4/38 , H05K1/16
CPC分类号： H05K1/162 , H05K3/0044 , H05K3/4644 , H05K3/4652 , H05K2201/0209 , H05K2201/09509 , H05K2201/09763 , H05K2201/09845 , H05K2203/025 , H05K2203/1476
摘要： PROBLEM TO BE SOLVED: To provide a novel printed circuit board with built-in capacitor capable of solving several problems about the conventional printed circuit boards with built-in capacitor. SOLUTION: In the printed circuit board with built-in capacitor, the capacitor has a dielectric, one electrode with a relatively smaller area in comparison with that of the dielectric, and another electrode with the relatively larger area in comparison with that of the dielectric. COPYRIGHT: (C)2009,JPO&INPIT

18. 发明专利

JP2014175406A Inductor part, manufacturing method of inductor part, and printed wiring board 审中-公开
标题翻译：电感器部件，电感器部件的制造方法和印刷电路板
公开(公告)号：JP2014175406A
公开(公告)日：2014-09-22
申请号：JP2013045545
申请日：2013-03-07
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MANO YASUHIKO , YOSHIKAWA KAZUHIRO , YANO TOSHIMASA , KARIYA TAKASHI
IPC分类号： H01F17/00 , H01F17/04 , H01F41/04
摘要： PROBLEM TO BE SOLVED: To provide an inductor part having good inductance property (Q value).SOLUTION: An inductor part comprises inductor patterns 158A, 158C, 158E, and 158G; magnetic material layers 174A, 174C, and 174E provided between the inductor patterns 158A, 158C, 158E, and 158G; and a dielectric film 175G through which each magnetic material layer is formed on the corresponding inductor pattern. The inductor patterns are spaced apart from the magnetic material layers by 0.5-10 μm. In inverse proportion to the square of the distance, the strength of an electromagnetic field weakens and accordingly, eddy currents arising on surfaces of the inductor patterns become smaller. Therefore, Q value of the inductor part is never deteriorated.
摘要翻译：要解决的问题：提供具有良好的电感特性（Q值）的电感部分。解决方案：电感器部分包括电感图案158A，158C，158E和158G; 设置在电感器图案158A，158C，158E和158G之间的磁性材料层174A，174C和174E; 以及在对应的电感图案上形成有各磁性体层的电介质膜175G。电感图案与磁性材料层隔开0.5-10μm。与距离的平方成反比，电磁场的强度减弱，因此在电感图案的表面上产生的涡流变小。因此，电感器部分的Q值不会变差。

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