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11. 发明专利

JPH07302816A MANUFACTURE OF ELECTRONIC CIRCUIT SUBSTRATE 失效
公开(公告)号：JPH07302816A
公开(公告)日：1995-11-14
申请号：JP9605394
申请日：1994-05-10
申请人： HITACHI LTD
发明人： SAKATA TOMOAKI , SUZUKI TAKAMICHI , MURASE TOMOHIKO , INOUE KOSUKE , ODAJIMA HITOSHI
IPC分类号： H01L21/60 , H05K3/34
摘要： PURPOSE:To produce at a low cost an electronic circuit substrate using an LSI having connections made by spherical solder joints. CONSTITUTION:A predetermined amount of solder required for forming a spherical solder junctions 11 is formed by performing heating reflow after placing an LSI6 on the solder. By doing this, the formation of spherical solder junctions 11 in LSI production process becomes unnecessary and the working cost and facility cost required for that become unnecessary, thereby reducing the price of the LSI6 and also producing at a lower cost an electronic circuit substrate 1 using LSI6 to be connected by the spherical solder connections 11.

12. 发明专利

JPH07254631A ELECTRONIC CIRCUIT DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH07254631A
公开(公告)日：1995-10-03
申请号：JP4340894
申请日：1994-03-15
申请人： HITACHI LTD
发明人： SAKATA TOMOAKI , SUZUKI TAKAMICHI , MURASE TOMOHIKO , ODAJIMA HITOSHI
IPC分类号： H01L21/60 , H01L21/321
摘要： PURPOSE:To realize complete fusion bonding of an electronic circuit device onto a substrate by providing a protrusion having a melting point higher than that of a protruding contact facing a terminal electrode on a substrate and setting the height of the protrusion lower than that of the protruding contact. CONSTITUTION:Protrusions 3 are provided in same direction as protruding contacts 2 on the same surface of a substrate 6 as the protruding contacts 2 facing terminal electrodes 7 are provided. The protrusion 3 has melting point higher than that of the protruding contact 2 and the height of the protrusion 3 is set equal to or lower than the height for allowing positive electrical connection of all protruding contacts with the terminal electrodes 7 at the time of fusion thereof but higher than the height which causes mutual contact and short circuit of fused protruding contacts 2. This method realizes fusion bonding of an electronic circuit device, e.g. an LSI 1, having a plurality of protruding contacts 2 onto the substrate 6 without causing insufficient contact or short circuit.

13. 发明专利

JPH079269A PLATE HOLDING DEVICE 失效
公开(公告)号：JPH079269A
公开(公告)日：1995-01-13
申请号：JP16120393
申请日：1993-06-30
申请人： HITACHI LTD
发明人： TSUTSUI YOSHITAKA , ODAJIMA HITOSHI , SUZUKI TAKAMICHI , TANAKA KATSUHISA
IPC分类号： B23P19/00 , B23Q3/08
摘要： PURPOSE:To provide possibility of handling plates appearing in different shapes which have a wide area and are susceptible to flaw, dust, etc., by furnishing a plurality of contactless chucks holding the plate at its surface other than the peripheral parts contactlessly in the perpendicular direction to the applicable surface while a certain gap is reserved in between. CONSTITUTION:A hand 8 is sunk and stopped where suction pads 11 of chucks 2 contact a plate to be handled 29. The plates 29 is sucked by the suction pads 11, and air is sent blowing to the cap 30 with the plate 29 from contactless chucks 3, and the plate 29 is held contactlessly in the blow-out parts. Therein the oversurface position of the plate 29 held by the contactless chucks 3 is adjusted so that the oversurface of the plate 29 sucked by the pads 11 is contacted with the cup end face 22 and is identical to the position of contacting.

14. 发明专利

JPH05109861A WORK CONVEYOR 失效
公开(公告)号：JPH05109861A
公开(公告)日：1993-04-30
申请号：JP27070891
申请日：1991-10-18
申请人： HITACHI LTD
发明人： TANAKA KATSUHISA , SUZUKI TAKAMICHI , ODAJIMA HITOSHI , SAKATA TOMOAKI , URA KAZUHIRO , YONEDA TATSUYA
IPC分类号： H01L21/677 , H01L21/68
摘要： PURPOSE:To provide a conveyor for a vacuum unit in which a work delivering mistake between processing chambers is eliminated and contamination of a work in vacuum is further reduced. CONSTITUTION:A carrier 16 is conveyed to a processing chamber 3 by an inversion system by means of pressing force of an air cylinder 19, a contaminated atmosphere from the chamber 3 is prevented by a cover 13 provided with a copying mechanism, and a work 17 is processed to a final process while the work 17 is inserted into the carrier 16 in a conveyor for a vacuum unit. Thus, contamination of the work is reduced to improve its yield.

15. 发明专利

JPH0567640A METHOD OF HEATING ELECTRONIC CIRCUIT DEVICE 失效
公开(公告)号：JPH0567640A
公开(公告)日：1993-03-19
申请号：JP22686591
申请日：1991-09-06
申请人： HITACHI LTD
发明人： ODAJIMA HITOSHI , SAKATA TOMOAKI , TANAKA KATSUHISA
IPC分类号： H01L21/60 , H01L21/52 , H01L21/68 , H01L21/683
摘要： PURPOSE:To prevent damage on an electronic circuit and moreover, to cope with automization of a method of heating an electronic circuit device by a method wherein the heating surface, on which the electronic circuit device is heated, of a heat block is made large, an irregularity in heating temperatures is lessened by a means, which makes the device adhere closely to the heating surface, and the device is handled by a transfer block having a suction means. CONSTITUTION:A transfer block (d) ascends, passes through a through hole in a tray (c) and holds and lifts an electronic circuit device (b) by vacuum clamping. Then, a heat block (a) is moved horizontally, the tip of the main body of the block (d) is put in a slit formed in the block (a) and when the block (d) is made to descend, the device (b) is put on the upper surface of the block (a) and is clamped on the upper surface by the suction hole. In this state, the device (b) is heated for a prescribed time, a solder is melted and the device (b) is bonded on a substrate. After that, the block (d) is made to ascend from the device (b) from the upper surface of the block (a), the device (b) is held on the upper surface of the block (d) by vacuum suction, the block (d) is made to descend and the device (b) is housed in the tray (c).

16. 发明专利

JPH0519764B2 失效
公开(公告)号：JPH0519764B2
公开(公告)日：1993-03-17
申请号：JP17585485
申请日：1985-08-12
申请人： HITACHI LTD
发明人： BABA MASAICHI , ODAJIMA HITOSHI , TSUTSUI YOSHITAKA
IPC分类号： G11B5/53 , G11B5/56

17. 发明专利

JPH04341786A HEAT BLOCK 失效
公开(公告)号：JPH04341786A
公开(公告)日：1992-11-27
申请号：JP11435891
申请日：1991-05-20
申请人： HITACHI LTD
发明人： TANAKA KATSUHISA , SAKATA TOMOAKI , ODAJIMA HITOSHI
IPC分类号： H05B3/03 , H05B3/10
摘要： PURPOSE:To simplify the shape of a heat radiating part of an instantly heating- type heat block and lower the manufacturing cost. CONSTITUTION:A cartridge heater 4 is buried at the position near the part connected with an electrode 2 and in the outside of a heat radiating part 3 of a heat block to heat the outer circumferential part of the heat radiating part and prevent heat from being radiated due to heat transmission, so that heat is distributed in the circumferential part as same as in the center.

18. 发明专利

JPH0258311A CYLINDRICAL ROTARY TRANSFORMER AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0258311A
公开(公告)日：1990-02-27
申请号：JP20836488
申请日：1988-08-24
申请人： HITACHI LTD
发明人： HIRAMATSU HIROMICHI , ODAJIMA HITOSHI
IPC分类号： G11B5/02 , H01F38/14
摘要： PURPOSE:To prevent a coil from damaging in case of mounting the coil in the winding groove of a cylindrical core and to shorten a working time by composing the groove formed on the inner peripheral surface and the corner of an extending groove in curved states. CONSTITUTION:A coil holder 8 is closed and positioned to insert a winding guide 822 and an end wire guide 823 into the inner peripheral surface of a cylindrical core 3. Then, a winding 7 is formed in a groove 821 between the guides 822 on the outer peripheral surface of the pusher 82 of the holder 8 while driving means 10. Then, solvent coating means 12 is driven to coat the forming part of the winding 7 with paint thereby to fixedly hold the shape. Thereafter, the winding groove 4 of the core 3, the groove 821 of the holder 8, the guide 823, and the extending groove 5 of the core 3 are brought into coincidence. Expanding means 9 is driven in this state to expand the pusher 82 of the holder 8, and the winding 7 is inserted together with the guide 822 into the groove 4 of the core 3. In this case, the corners of the guide 822, 823 of the holder 8 are formed in curved states, and the corners 6 of the grooves 4, 5 are formed in cured states. Accordingly, it can prevent the winding 7 from damaging.

19. 发明专利

JPH025402A METHOD OF FIXING WINDING ON INNER PERIPHERY OF CYLINDER 失效
公开(公告)号：JPH025402A
公开(公告)日：1990-01-10
申请号：JP15473888
申请日：1988-06-24
申请人： HITACHI LTD
发明人： HIRAMATSU HIROMICHI , ODAJIMA HITOSHI
IPC分类号： H01F41/04
摘要： PURPOSE:To prevent transmitting characteristic of a winding from decreasing and to enhance the performance by bringing the winding mounted in the winding grooves of the inner periphery of a core into close contact with the bottoms of the grooves by a pushing member, coating the grooves or lead grooves with an adhesive and curing it. CONSTITUTION:After a winding 9 is mounted in a winding grooves 11 formed on the inner periphery of a cylindrical core 10, it is inserted into the core 10 in a state that a radially openable pushing member 61 is closed, the protrusion of the member 61 is positioned with respect to the grooves 11, and the member 61 is opened to so push the winding 9 as to bring it into close contact with the bottoms of the grooves 11. Since the pushed winding 9 is plastically deformed, it is held in the state to be closely brought into contact with the bottoms of the grooves 11 even after it is removed from the core 10. Thereafter, the grooves 11 or lead grooves 12 are coated with an adhesive and cured so that the winding can be effectively fixed in the state in close contact with the bottoms of the grooves 11. Thus, no irregularity in the distances between the outer winding side and the inner winding side occurs to prevent its transmitting characteristic from decreasing.

20. 发明专利

JPH01169912A FIXING PROCESS OF INNER PERIPHERAL WINDING 失效
公开(公告)号：JPH01169912A
公开(公告)日：1989-07-05
申请号：JP32693487
申请日：1987-12-25
申请人： HITACHI LTD
发明人： HIRAMATSU HIROMICHI , ODAJIMA HITOSHI
IPC分类号： H01F41/10
摘要： PURPOSE:To enable a wire directly wound around a winding groove to be fixed without fail by a method wherein the inside of a winding groove cut in the inner peripheral surface of a cylindrical core is coated with a bonding agent with high curing shrink properties while a wire is wound around the winding groove and then the bonding agent is cured. CONSTITUTION:The bottom of a winding groove 81 of a cylindrical core 8 is previously coated with a bonding agent 7 with curing shrink properties not to protrude from the groove 81. A wire 9 pierced through the hole of a winding jig 1 is led to a wire outlet along a slope and a wire guide. The jig 1 is inserted into the cylindrical core 8. Either one of the core 8 or the jig 1 is turned to wind the wire 9 around the groove 81 in almost orthogonal direction. The wire 8 is wound around the groove 81 in the specified number of turns. The bonding agent 7 is regular-cured for fixing the wire 9 in the groove 81 to finish the winding and fixing processes of the wire 9. Through these procedures, the wire 9 can be wound directly around the groove 81 to be fixed without fail.

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