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    • 12. 发明专利
    • Semiconductor integrated circuit
    • 半导体集成电路
    • JP2007080283A
    • 2007-03-29
    • JP2006293469
    • 2006-10-30
    • Hitachi Ltd株式会社日立製作所
    • NAKAYAMA MICHIAKISAKAKIBARA HIDEKIKOBAYASHI TORUMIYAOKA SHUICHIYOKOYAMA YUJISAWAMOTO HIDEOKUME SHOJI
    • G06F12/00G06F12/08G11C11/406
    • PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit which easily accepts a write access request regardless of an internal memory operational status. SOLUTION: A semiconductor integrated circuit (1) includes a plurality of memory banks (BNK0-BNK7) formed on a semiconductor chip (1A), a plurality of write buffers (WB0-WB3), an external input circuit (I/F1) and a control circuit (MCNT). Each of the plurality of memory banks includes a data input part and a plurality of memory cells periodically requiring stored data refreshing operations. The control circuit controls a corresponding write buffer so as to selectively hold data supplied to the external input circuit in the corresponding write buffer during a period of time for the refresh operation and the read operation of a corresponding memory bank, and control the corresponding write buffer to supply data to the corresponding memory bank after the completion of the refresh operation and the read operation of the corresponding memory bank. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供一种容易接受写访问请求的半导体集成电路,而不管内部存储器操作状态如何。 解决方案:半导体集成电路(1)包括形成在半导体芯片(1A)上的多个存储体(BNK0-BNK7),多个写入缓冲器(WB0-WB3),外部输入电路(I / F1)和控制电路(MCNT)。 多个存储体中的每一个都包括周期性地要求存储的数据刷新操作的数据输入部分和多个存储器单元。 控制电路控制相应的写入缓冲器,以便在对应的存储体的刷新操作和读取操作的时间段期间选择性地保持提供给相应写缓冲器中的外部输入电路的数据,并且控制对应的写入缓冲器 在完成刷新操作和对应的存储体的读取操作之后向对应的存储体提供数据。 版权所有(C)2007,JPO&INPIT
    • 14. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT
    • JPH11102910A
    • 1999-04-13
    • JP26306097
    • 1997-09-29
    • HITACHI LTD
    • KONO MASAKINAKAYAMA MICHIAKI
    • H01L23/52H01L21/3205H01L21/822H01L27/04
    • PROBLEM TO BE SOLVED: To prevent the freedom of signal wirings of a semiconductor integrated circuit from being obstructed on account of power source wirings. SOLUTION: This circuit 1 is provided with a retaining substrate 2, a first wiring layer 3 which is formed on the retaining substrate 2 and on which a plurality of first wirings are formed, a circuit element forming layer 4 formed on the first wiring layer 3, and a second wiring layer 5 which is formed on the circuit element forming layer 4 and has a plurality of second and third wirings which are connected with circuit elements of the circuit element forming layer 4. The first wirings are made power source wirings 31, 32, the second wirings are made signal wirings 53a, 53b, 53c, and the third wirings are made power source wirings 52a, 52b. Power source main lines can be constituted of the first wirings of the first wiring layer 3, arrangement of the power source main lines on the second wiring layer 5 is unnecessary, and the third wirings can be comparatively short.
    • 17. 发明专利
    • Semiconductor device
    • 半导体器件
    • JP2009021387A
    • 2009-01-29
    • JP2007182746
    • 2007-07-12
    • Hitachi Ltd株式会社日立製作所
    • KONO MASAKINAKAYAMA MICHIAKI
    • H01L21/822G06F1/10H01L27/04
    • PROBLEM TO BE SOLVED: To solve the problem that the timing displacement of signals is generated by a surrounding environment, the change of a power supply voltage by noise or the like or the change of the ambient temperature of a semiconductor device (including the temperature of the semiconductor device itself) for instance, even when timing is adjusted when supplying power and signals can not be normally transmitted since a timing width in which data can be normally fetched is reduced as a signal transmission speed becomes high. SOLUTION: A displacement amount detection circuit part 7 is newly provided inside an LSI 1, a circuit inside the displacement detection circuit part outputs a displacement amount dynamically changing after power supply, and a timing control circuit adjusts the timing again on the basis of the outputted change amount. Thus, even when the timing is displaced, the signals are normally transmitted. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题为了解决周围环境产生信号的定时位移的问题,电源电压由噪声等的变化或半导体器件的环境温度的变化(包括 半导体器件本身的温度),即使在供电时调整定时,也不能正常发送信号,因为可以正常取出数据的定时宽度随着信号传输速度变高而降低。 解决方案:在LSI1内部新设置位移量检测电路部7,位移检测电路部内的电路输出电源后动态变化的位移量,定时控制电路基于 的输出变化量。 因此,即使当定时被移位时,信号也被正常传输。 版权所有(C)2009,JPO&INPIT