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91. 发明专利

JP2004347565A Inspection method for probe card and semiconductor device 审中-公开
公开(公告)号：JP2004347565A
公开(公告)日：2004-12-09
申请号：JP2003147783
申请日：2003-05-26
申请人： Nec Electronics Corp , Necエレクトロニクス株式会社
发明人： MIZOGUCHI OSAMU
IPC分类号： G01R31/26 , B08B1/00 , G01R1/067 , G01R1/073 , G01R3/00 , H01L21/66
CPC分类号： G01R1/06738 , B08B1/00 , G01R1/0675 , G01R1/06755 , G01R1/07342
摘要： PROBLEM TO BE SOLVED: To improve throughput of inspection without requiring a means cleaning a probe 1, in an inspection method for a probe card and a semiconductor device.
SOLUTION: A tip part of the probe 1 is formed with a blade part 5 alongside of a contact part 4 contacting with an electrode pad 12. By applying overdrive in time of measurement, the blade part 5 scrapes away an oxide film or foreign matter on the surface of the electrode pad 12 to allow the contact part 4 to always contact with a freshened electrode pad face.
COPYRIGHT: (C)2005,JPO&NCIPI

92. 发明专利

JP2004336062A Contact carrier (tile) for stationing spring contact to larger substrate 有权
公开(公告)号：JP2004336062A
公开(公告)日：2004-11-25
申请号：JP2004147222
申请日：2004-05-18
申请人： Formfactor Inc , フォームファクター,インコーポレイテッド
发明人： KHANDROS IGOR Y , ELDRIDGE BENJAMIN N , MATHIEU GAETAN L , DOSIRE THOMAS H , SMITH WILLIAM D
IPC分类号： B23K20/00 , C23C18/16 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/603 , H01L21/66 , H01L21/68 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L25/065 , H01L25/16 , H01R33/76 , H05K1/14 , H05K3/20 , H05K3/32 , H05K3/40
CPC分类号： B23K20/004 , B23K2201/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/06711 , G01R1/06716 , G01R1/06744 , G01R1/07342 , G01R3/00 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/13099 , H01L2224/131 , H01L2224/16145 , H01L2224/45144 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/4015 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a contact mechanism to a wafer in which a semiconductor is suitably aged at a stage of a wafer. SOLUTION: A plurality of free-standing mutual contact elements 710 such as contact bumps or free-standing spring contacts including both monolithic and composite interconnection elements are mounted to relatively small tile substrates 702 which are then mounted and connected to a relatively large electronic component substrate 706, thereby stationing a plurality of contact elements to an electronic component. In this manner, pressure connections can be made to an entire semiconductor wafer, at once, to provide for wafer-stage aging and the like. Further, solder balls, a z-axis conductive adhesive, or compliant connections are suitably employed for making electrical connections between the tile substrates 702 and the electronic component. COPYRIGHT: (C)2005,JPO&NCIPI

94. 发明专利

JP2004528996A Methods for making microelectronic spring structure on a substrate 有权
公开(公告)号：JP2004528996A
公开(公告)日：2004-09-24
申请号：JP2002564434
申请日：2002-02-06
申请人：フォームファクター,インコーポレイテッド
发明人：ウェンゼル，スチュアート，ダブリュー． , エルドリッジ，ベンジャミン，エヌ．
IPC分类号： B81C1/00 , B81B3/00 , G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , H01H11/04 , H01L21/768 , H01L23/48 , H01L23/482 , H01R13/24 , H05K3/40 , H05K7/10
CPC分类号： G01R1/06716 , G01R1/0483 , G01R1/06727 , G01R1/06733 , G01R1/07342 , G01R3/00 , H01L23/4822 , H01L24/72 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/12036 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01R12/52 , H01R13/24 , H01R13/2407 , H05K3/4092 , H05K7/1069 , Y10T29/49147 , H01L2924/00
摘要：基板上に犠牲材料の層を形成する。次に、型またはスタンプを用いて犠牲材料を成形するなどの方法で犠牲材料に凹凸面を作り出す。この凹凸面は、少なくとも１つのばね状成形物用の型になり、好ましくはばね状成形物のアレイの型になるものである。必要に応じて、犠牲層を硬化または固化させる。犠牲材料の凹凸面上に、パターンをなしてばね材料の層を成膜し、少なくとも１つのばね状成形物を画定し、好ましくはばね状成形物のアレイを画定する。次に、ばね状成形物の下から犠牲材料を少なくとも部分的に除去し、少なくとも１つの独立したばね構造体を露出させる。このようにして得られるばね構造体それぞれに別の通電性の先端部を任意に取り付け、必要に応じて、各構造体を単一または複数の別の材料層で任意にめっきまたは被覆する。液体のメニスカスの特性を利用して、弾力のある接点構造体を作る他の方法をさらに開示する。この別の方法の最初の工程では、基板上に材料の層を形成する。次に、この材料にくぼみを作り、くぼみに液体を供給してメニスカスを得る。この液体を硬化または固化させ、メニスカスの凹凸形状を安定させる。その後、安定したメニスカスを利用して、犠牲材料の被成形面の場合と同じようにしてばね状成形物を画定する。

95. 发明专利

JP2003294787A Contactor, its manufacturing method, and testing method using contactor 有权
标题翻译：接触器及其制造方法和使用接触器的测试方法
公开(公告)号：JP2003294787A
公开(公告)日：2003-10-15
申请号：JP2002099133
申请日：2002-04-01
申请人： Fujitsu Ltd , 富士通株式会社
发明人： MARUYAMA SHIGEYUKI , WATANABE NAOYUKI , TASHIRO KAZUHIRO , KOBASHI NAOTO , IGAWA OSAMU , FUJISAWA TETSUYA
IPC分类号： G01R31/26 , G01R1/067 , G01R1/073 , G01R3/00 , H01L21/66 , H05K7/10
CPC分类号： G01R1/0675 , G01R3/00 , H05K7/1069
摘要： PROBLEM TO BE SOLVED: To provide a contactor capable of arranging bending needle type contact electrodes at fine pitches, and inexpensively being formed, and to provide a method of manufacturing the contactor. SOLUTION: This contactor has a contact substrate 41 and a plurality of contact electrodes 40 formed on the contact substrate. Each contact electrode 40 is connected to the contact substrate 41 at its one end and formed with a metal wire 42 bent between one end and the other end. An inclined surface 42b comprising a cut surface and a ruptured surface 42c caused by tension are formed at the tip part of the contact electrode 40. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种能够以细间距布置弯曲针型接触电极并且廉价地形成的接触器，并且提供一种制造接触器的方法。解决方案：该接触器具有接触基板41和形成在接触基板上的多个接触电极40。每个接触电极40在其一端连接到接触基板41，并且形成有在一端和另一端之间弯曲的金属丝42。在接触电极40的前端形成有由张力引起的切断面和断裂面42c的倾斜面42b。（C）2004，JPO

96. 发明专利

JP2003526790A 失效
公开(公告)号：JP2003526790A
公开(公告)日：2003-09-09
申请号：JP2001566038
申请日：2001-02-28
IPC分类号： G01R31/26 , G01R1/073 , G01R3/00

97. 发明专利

JP3434400B2 失效
公开(公告)号：JP3434400B2
公开(公告)日：2003-08-04
申请号：JP32664595
申请日：1995-12-15
IPC分类号： C08J9/28 , C04B41/50 , G01R1/073 , G01R3/00 , H01B3/18 , H01B13/00 , H01R13/24 , H01R43/00

98. 发明专利

JP2003167004A CONTACT PROBE AND ITS MANUFACTURING METHOD 审中-公开
公开(公告)号：JP2003167004A
公开(公告)日：2003-06-13
申请号：JP2001369645
申请日：2001-12-04
申请人： NIPPON MEKTRON KK
发明人： TAKANO SHOJI
IPC分类号： G01R31/26 , G01R1/073 , G01R3/00 , H01L21/66 , H01R11/01 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a contact probe and its manufacturing method suitable for electrical inspection on a semiconductor chip, a display element, a circuit board or the like. SOLUTION: An insulating resin layer 6 is formed by electro coating on a metal column 4 formed by plating means. The tip of the metal column 4 is projected by removing a prescribed amount of the surface of the insulating resin layer 6. COPYRIGHT: (C)2003,JPO

99. 发明专利

JP2003086642A METHOD FOR CLEANING PROBE OF PROBE CARD 审中-公开
公开(公告)号：JP2003086642A
公开(公告)日：2003-03-20
申请号：JP2002107679
申请日：2002-04-10
申请人： POWERCHIP SEMICONDUCTOR CORP
发明人： LIOU YOU-SHIN , TANG KUANG-PING
IPC分类号： G01R1/06 , B24B19/16 , B24B49/10 , G01R1/073 , G01R3/00 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a method for cleaning a probe which can achieve excellent cleaning effects even for impurities which are difficult to remove, such as an alloy or the like, and can assure the test accuracy and quality of a probe card. SOLUTION: First, a cleaning wafer is provided, and a rough surface of this cleaning wafer is brought into contact with a needle distal end surface of a probe card to rub against each other, so that a polishing effect on the needle distal end surface is attained. During the contact, the cleaning wafer is moved at an optimum contact speed in accordance with different materials to bring it into contact with the needle distal end surface, and such operations are conducted by a plurality of times. Further, a comparatively high acceleration and a fast contact speed are created, and the cleaning wafer is moved and brought into contact with the needle distal end surface. Such operations are conducted by a plurality of times, and a needle distal end surface is flattened. Further, the cleaning wafers are rotated at different angles, respectively, and probe cleaning processing is repeated, thereby obtaining the more favorable effect of probe cleaning.

100. 发明专利

JP2003077603A Ic socket 有权
标题翻译： IC插座
公开(公告)号：JP2003077603A
公开(公告)日：2003-03-14
申请号：JP2001268985
申请日：2001-09-05
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： SUZUKI KATSUMI , ITO TAKEHIRO
IPC分类号： G01R31/26 , G01R1/04 , G01R1/073 , G01R3/00 , H01R33/76
CPC分类号： G01R1/0466 , G01R1/0433 , G01R3/00
摘要： PROBLEM TO BE SOLVED: To prevent tilting by providing a spacer member for a contact sheet and adhering the contact sheet to the spacer member in mounting the contact sheet to a test board.
SOLUTION: An IC socket is formed by mounting a socket frame to the test board via the contact sheet. The contact sheet has a plurality of cantilever spring contacts disposed on an insulating film in alignment and the spacer member.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了防止倾斜，通过提供用于接触片的间隔构件，并且在将接触片安装到测试板上时将接触片粘附到间隔构件。解决方案：通过接触片将插座框架安装到测试板上形成IC插座。接触片具有多个布置在绝缘膜上的悬臂弹簧触点和间隔件。

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