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    • 1. 发明专利
    • METHOD FOR CLEANING PROBE OF PROBE CARD
    • JP2003086642A
    • 2003-03-20
    • JP2002107679
    • 2002-04-10
    • POWERCHIP SEMICONDUCTOR CORP
    • LIOU YOU-SHINTANG KUANG-PING
    • G01R1/06B24B19/16B24B49/10G01R1/073G01R3/00H01L21/66
    • PROBLEM TO BE SOLVED: To provide a method for cleaning a probe which can achieve excellent cleaning effects even for impurities which are difficult to remove, such as an alloy or the like, and can assure the test accuracy and quality of a probe card. SOLUTION: First, a cleaning wafer is provided, and a rough surface of this cleaning wafer is brought into contact with a needle distal end surface of a probe card to rub against each other, so that a polishing effect on the needle distal end surface is attained. During the contact, the cleaning wafer is moved at an optimum contact speed in accordance with different materials to bring it into contact with the needle distal end surface, and such operations are conducted by a plurality of times. Further, a comparatively high acceleration and a fast contact speed are created, and the cleaning wafer is moved and brought into contact with the needle distal end surface. Such operations are conducted by a plurality of times, and a needle distal end surface is flattened. Further, the cleaning wafers are rotated at different angles, respectively, and probe cleaning processing is repeated, thereby obtaining the more favorable effect of probe cleaning.