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91. 发明专利

JP5087323B2 Crystal oscillator of the junction and for surface mounting 有权
公开(公告)号：JP5087323B2
公开(公告)日：2012-12-05
申请号：JP2007154701
申请日：2007-06-12
申请人：日本電波工業株式会社
发明人：雅浩福永
IPC分类号： H03B5/32 , H01L25/00
CPC分类号： H03H9/0547 , H03H9/0552 , H03H9/1021
摘要： A crystal oscillator has: a crystal unit having a container body in which a crystal blank is housed and hermetically sealed; and a mounting substrate that houses an IC chip having at least an integrated oscillating circuit that uses the crystal unit. External terminals are formed as protrusions at four corners of the outer bottom surface of the container body, and depressions corresponding to the external terminals are formed at four corners of the top surface of the mounting substrate. Bonding terminals are formed at the inner bottom surface of the depressions. The mounting substrate is electrically and mechanically bonded to the outer bottom surface of the crystal unit by fitting the external terminals into the depressions and bonding the external terminals to the corresponding bonding terminals by soldering.

92. 发明专利

JP5020340B2 Crystal oscillator of the constant-temperature and for surface mounting 有权
公开(公告)号：JP5020340B2
公开(公告)日：2012-09-05
申请号：JP2010023667
申请日：2010-02-05
申请人：日本電波工業株式会社
发明人：憲司笠原
IPC分类号： H03B5/32
CPC分类号： H03H9/0552 , H03H9/02102 , H03H9/0542 , H03H9/1021 , H03H9/105

93. 发明专利

JP4804813B2 Piezoelectric oscillator 有权
公开(公告)号：JP4804813B2
公开(公告)日：2011-11-02
申请号：JP2005185437
申请日：2005-06-24
申请人：日本電波工業株式会社
发明人：剛史内田 , 憲司笠原
IPC分类号： H03B5/32
CPC分类号： H03H9/08 , H03H9/0514 , H03H9/0542 , H03H9/0552 , H03H9/1014

94. 发明专利

JP4795602B2 Oscillator 有权
公开(公告)号：JP4795602B2
公开(公告)日：2011-10-19
申请号：JP2001557158
申请日：2001-01-29
申请人：京セラキンセキ株式会社
发明人：宏和小林 , 宏明赤川
IPC分类号： H03B5/32 , H01L23/04 , H01L41/09 , H01L41/18 , H01L41/22 , H01L41/23 , H01L41/311 , H01L41/313 , H03H3/007 , H03H3/02 , H03H9/02 , H03H9/05 , H03H9/10
CPC分类号： H03H9/0547 , H03B5/32 , H03H9/0552 , H03H9/1021
摘要： In a hermetically sealed container constituted by a lid (105), frame (103), and substrate (104), a piezoelectric vibrator (101) is fixed on the substrate (104) (on the upper surface of the substrate) with fixing members (104a) made of a conductive material, and a semiconductor component (102) is flip-chip mounted on the lower surface of the substrate (104).

95. 发明专利

JP4713215B2 Implementation method for the surface mount crystal oscillator 有权
公开(公告)号：JP4713215B2
公开(公告)日：2011-06-29
申请号：JP2005133487
申请日：2005-04-28
申请人：日本電波工業株式会社
发明人：貢一守谷
IPC分类号： H03B5/32
CPC分类号： H03H9/0547 , H03B5/36 , H03H9/0552 , H03H9/1021 , H05K1/0231 , H05K1/0243 , H05K1/182 , H05K2201/09072 , H05K2201/10083 , H05K2201/1053 , H05K2201/10636 , H05K2201/10727 , Y02P70/611

96. 发明专利

JP2011097553A Piezoelectric resonator, oscillator and oscillator package 有权
标题翻译：压电谐振器，振荡器和振荡器封装
公开(公告)号：JP2011097553A
公开(公告)日：2011-05-12
申请号：JP2010049883
申请日：2010-03-05
申请人： Seiko Instruments Inc , セイコーインスツル株式会社
发明人： YOSHIDA YOSHIFUMI
IPC分类号： H03H9/08 , H03B5/32 , H03H9/02 , H03H9/10
CPC分类号： H03H9/1021 , H03H9/0519 , H03H9/0542 , H03H9/0552 , H03H9/0557
摘要： PROBLEM TO BE SOLVED: To provide a piezoelectric resonator in which a piezoelectric resonator chip is mounted on a silicon substrate without deteriorating a characteristic.
SOLUTION: The piezoelectric resonator includes a silicon substrate 2, a metal film 3 formed on the surface of the silicon substrate 2, a pair of resonator chip mounting electrodes 5, 6, formed on the metal film 3 and an AT-cut type piezoelectric resonator chip 7 that is bump-bonded to the pair of resonator chip mounting electrodes 5, 6. A liner expansion coefficient of the metal film 3 is 13×10
-6 /°C or larger and a product of the linear expansion coefficient and a Young's modulus of the metal film 3 is 1.95 MPa/°C or larger.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种压电谐振器，其中压电谐振器芯片安装在硅衬底上而不劣化特性。解决方案：压电谐振器包括硅衬底2，形成在硅衬底2的表面上的金属膜3，形成在金属膜3上的一对谐振器芯片安装电极5,6和AT切割型谐振器芯片7，其凸起接合到一对谐振器芯片安装电极5,6上。金属膜3的线膨胀系数为13×10 -6 -6 /℃以上，金属膜3的线膨胀系数和杨氏模量的乘积为1.95MPa /℃以上。版权所有（C）2011，JPO＆INPIT

97. 发明专利

JP2010232806A Piezoelectric resonator, piezoelectric oscillator, electronic device and method for manufacturing piezoelectric resonator 审中-公开
标题翻译：压电谐振器，压电振荡器，电子设备及制造压电谐振器的方法
公开(公告)号：JP2010232806A
公开(公告)日：2010-10-14
申请号：JP2009076055
申请日：2009-03-26
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： WADA MITSUHIRO
IPC分类号： H03H9/19 , H01L41/09 , H01L41/18 , H01L41/22 , H01L41/23 , H01L41/253 , H01L41/311 , H03B5/32 , H03H3/02 , H03H3/04 , H03H9/02
CPC分类号： H03H9/19 , H03H3/04 , H03H9/02023 , H03H9/02157 , H03H9/0552 , H03H9/1014 , H03H9/1021 , Y10T29/42
摘要： PROBLEM TO BE SOLVED: To provide: a piezoelectric resonator having high reliability over a long period of time; a piezoelectric oscillator; an electronic device; and a method for manufacturing the piezoelectric resonator. SOLUTION: The piezoelectric resonator 200 includes: a package 110 having a cavity 1; a plurality of electrode pads 20 formed within the cavity 1; and a piezoelectric vibrating element 100 having one end supported by a first bonding section 31 and a second bonding section 32 that include silicone base conductive adhesive and are formed on the plurality of the electrode pads 20, respectively. The piezoelectric vibrating element 100 has a piezoelectric substrate 40 having mutually opposing first face 41 and second face 42, a first electrode film 50a that is formed on the first face 41 and electrically connected to the first bonding section 31, and a second electrode film 50b that is formed on the second face 42 and electrically connected to the second bonding section 32. In a supported region of the piezoelectric vibrating element 100 by the first bonding section 31 and the second bonding section 32 and a movable region 42 not supported by the first bonding section 31 or the second bonding section 32, a fluorocarbon resin film 60 is formed on the movable region 42. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供：长时间具有高可靠性的压电谐振器; 压电振荡器; 电子设备; 以及压电谐振器的制造方法。解决方案：压电谐振器200包括：具有空腔1的封装110; 形成在空腔1内的多个电极焊盘20; 以及压电振动元件100，其一端由第一接合部31支撑，第二接合部32分别由多个电极焊盘20形成，该第二接合部32包括硅酮基导电性粘接剂。压电振动元件100具有彼此相对的第一面41和第二面42的压电基板40，形成在第一面41上并与第一接合部31电连接的第一电极膜50a，第二电极膜50b 形成在第二面42上并与第二接合部32电连接。在压电振动元件100的被第一接合部31和第二接合部32的支撑区域和不由第一接合部32支撑的可动部42 接合部31或第二接合部32，在可动区域42上形成氟碳树脂膜60.权利要求（C）2011，JPO＆INPIT

98. 发明专利

JPWO2008136340A1 表面実装用の水晶発振器有权
公开(公告)号：JPWO2008136340A1
公开(公告)日：2010-07-29
申请号：JP2009512947
申请日：2008-04-24
申请人：日本電波工業株式会社
发明人：播磨　秀典 , 秀典播磨 , 貢一守谷 , 貢一守谷
IPC分类号： H03B5/32
CPC分类号： H03H9/0552 , H03H9/1014
摘要：表面実装用の水晶発振器は、両主面にそれぞれ第1及び第2凹部を有する容器本体と、第1凹部内に密閉封入された水晶片と、水晶片を用いる発振回路が集積化され第2凹部内に収容されたICチップと、を有する。ICチップは、水晶片との接続用の一対の水晶端子を含めて複数のIC端子を備える。第2凹部の底面には、IC端子に対応して、IC端子がフリップチップボンディングでそれぞれ接続される複数の実装電極が形成されている。一対の水晶端子に対応する実装電極は、水晶片に電気的に接続するとともに、他の実装電極よりも大きな面積を有する一対の兼用電極として形成されている。

99. 发明专利

JP2009194091A Electronic component, electronic equipment, and base member manufacturing method 审中-公开
标题翻译：电子元件，电子设备和基座制造方法
公开(公告)号：JP2009194091A
公开(公告)日：2009-08-27
申请号：JP2008032046
申请日：2008-02-13
申请人： Seiko Instruments Inc , セイコーインスツル株式会社
发明人： TAKEUCHI HITOSHI , SATO KEIJI , ARATAKE KIYOSHI , NUMATA SATOSHI
IPC分类号： H01L23/02 , H01L41/09 , H01L41/18 , H03H3/02 , H03H9/02
CPC分类号： H03H9/1021 , H01L23/562 , H01L41/053 , H01L2924/0002 , H01L2924/09701 , H03H9/02133 , H03H9/0552 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an electronic component capable of withstanding stress from a printed board or the like. SOLUTION: In the electronic component 1a, a cavity 9 tight-sealed by a base 2 and a lid 5 is formed and a quartz vibrator 6 is held above an upper surface of the base 2 by a support 7 in the cavity 9. The base 2 is made of glass and a stress relief layer 3 made of a conductive resin is formed over the entire bottom surface of the base 2. External electrodes 8 and 4 conducting an electrode of the quartz vibrator 6 reach down to the bottom of the stress relief layer 3 respectively along side faces of the base 2 and the stress relief layer 3. The electronic component 1a so constituted is surface-mounted by soldering the external electrodes 8 and 4 formed on the bottom parts of the stress relief layer 3 to the printed board. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够承受来自印刷电路板等的应力的电子部件。解决方案：在电子部件1a中，形成由基座2和盖5紧密密封的空腔9，并且石英振子6通过壳体9中的支撑件7保持在基座2的上表面上方基体2由玻璃制成，并且在基底2的整个底面上形成由导电树脂制成的应力消除层3。导电石英振动器6的电极的外部电极8和4到达底部应力消除层3分别沿着基座2和应力释放层3的侧面。这样构成的电子部件1a通过将形成在应力消除层3的底部上的外部电极8和4焊接到表面安装来印刷板。版权所有（C）2009，JPO＆INPIT

100. 发明专利

JP4151706B2 Piezoelectric device 有权
公开(公告)号：JP4151706B2
公开(公告)日：2008-09-17
申请号：JP2006120276
申请日：2006-04-25
申请人：エプソントヨコム株式会社
发明人：泰央丸山
IPC分类号： H03B5/32 , H01L23/28
CPC分类号： H05K3/3442 , H01L41/053 , H03H9/0552 , H03H9/1021 , H05K2201/09154 , H05K2201/10083 , Y02P70/613
摘要： A piezoelectric device includes: a piezoelectric element; a piezoelectric element package containing the piezoelectric element; a connecting terminal disposed on the bottom of the piezoelectric element package; a circuit element connected to the bottom of the piezoelectric element package; a insulating resin portion covering the circuit element; and an external electrode formed on the surface of the resin portion, wherein: in a plan view seen from the direction, along which the external electrode is formed, an inclined portion is provided in a part of an area of the resin portion, in which the external electrode is to be formed, the inclined portion extending from the bottom surface of the piezoelectric element package towards the surface of the resin portion; and the connecting terminal on the bottom of the piezoelectric element package and the external electrode of the resin portion are electrically connected to each other by means of a connecting electrode formed on the inclined portion.

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