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91. 发明专利

JP2007040772A Semiconductor pressure sensor 审中-公开
标题翻译：半导体压力传感器
公开(公告)号：JP2007040772A
公开(公告)日：2007-02-15
申请号：JP2005223699
申请日：2005-08-02
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TAKAHATA YOSHIMITSU , NAKAMURA HIROSHI , TARUYA KIMIAKI , ASADA SHINSUKE
IPC分类号： G01L9/00
CPC分类号： H01L23/057 , G01L19/0084 , G01L19/141 , G01L19/147 , H01L23/24 , H01L24/45 , H01L24/48 , H01L2224/32188 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01014 , H01L2924/01068 , H01L2924/01079 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor capable of reducing breakage of a bonding wire even in an environment having great temperature change or pressure actuation, and elongating a lifetime. SOLUTION: This semiconductor pressure sensor includes a resin package 1 having a recessed part 1a; a lead 2 whose one end is exposed to the recessed part 1a and whose other end is drawn out to the outside of the package 1, integrated with the package 1 by insert molding; a sensor chip 3 provided on the recessed part 1a, for detecting the pressure; and the bonding wire 4 for connecting electrically the sensor chip 3 to the lead 2. In the sensor, the recessed part 1a side of the interface between the lead 2 and the package 1 is coated by the first insulating protection resin part 6, and the bonding wire 4 is coated by the second protection resin part 7 which is softer than the first protection resin part 6. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供即使在具有大的温度变化或压力驱动的环境中也能够减少接合线断裂并延长使用寿命的半导体压力传感器。解决方案：该半导体压力传感器包括具有凹部1a的树脂封装1; 引线2的一端暴露于凹部1a，另一端被拉出到封装1的外部，通过嵌入成型与封装1一体化; 设置在凹部1a上用于检测压力的传感器芯片3; 以及用于将传感器芯片3电连接到引线2的接合线4.在传感器中，引线2和封装1之间的界面的凹部1a侧被第一绝缘保护树脂部6涂覆，接合线4由比第一保护树脂部分6软的第二保护树脂部分7涂覆。版权所有（C）2007，JPO＆INPIT

93. 发明专利

JP2007012831A Power semiconductor device 审中-公开
标题翻译：功率半导体器件
公开(公告)号：JP2007012831A
公开(公告)日：2007-01-18
申请号：JP2005190869
申请日：2005-06-30
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KOIKE YOSHIHIKO , OKUBO SHINJI , TOYODA YASUSHI , SAITO KATSUAKI , HAYAKAWA SEIICHI
IPC分类号： H01L23/29 , H01L23/31
CPC分类号： H01L23/24 , H01L23/16 , H01L23/3135 , H01L23/3735 , H01L23/49811 , H01L24/29 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L25/072 , H01L2224/29101 , H01L2224/32225 , H01L2224/37124 , H01L2224/40095 , H01L2224/40225 , H01L2224/40992 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48455 , H01L2224/48472 , H01L2224/48699 , H01L2224/48992 , H01L2224/48997 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2224/83801 , H01L2224/84205 , H01L2224/85205 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/15787 , H01L2924/181 , H01L2924/30105 , H01L2924/351 , H01L2924/0695 , H01L2924/0715 , H01L2924/2076 , H01L2924/0665 , H01L2224/78 , H01L2924/00012 , H01L2924/00 , H01L2924/3512
摘要： PROBLEM TO BE SOLVED: To provide a power semiconductor device wherein the life of a joint between a metal wire and a semiconductor element is extended and the insulating resistance of an insulating substrate is improved. SOLUTION: In the power semiconductor, the peripheral surface of an insulating substrate where a metal circuit is not joined and a joint interface between a semiconductor element and a metal wire are coated with an electrically insulating resin having (1) a smaller coefficient of expansion, (2) a larger Young's modulus, and (3) higher insulation tolerance than that of resin which is filled in order to secure the insulation of the whole module, and the thickness of the coated resin is selected so that an inflection point of the coating resin in the direction of the wire section becomes not more than 1/4 of the section height of the wire. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种功率半导体器件，其中金属线和半导体元件之间的接头的寿命延长并且绝缘衬底的绝缘电阻得到改善。解决方案：在功率半导体中，金属电路未接合的绝缘基板的外周表面和半导体元件与金属线之间的接合界面涂覆有电绝缘树脂，其具有（1）较小的系数的膨胀，（2）较大的杨氏模量，和（3）比填充树脂更高的绝缘公差，以确保整个模块的绝缘，并且选择涂层树脂的厚度，使得拐点涂层树脂在导线部分的方向上不超过导线的截面高度的1/4。版权所有（C）2007，JPO＆INPIT

94. 发明专利

JP2006269848A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2006269848A
公开(公告)日：2006-10-05
申请号：JP2005087481
申请日：2005-03-25
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SASAKI KOJI , HIRAMITSU SHINJI , KARIYA TADAAKI , MATSUYOSHI SATOSHI , KAJIWARA RYOICHI , ISHIHARA SHOSAKU
IPC分类号： H01L23/48
CPC分类号： H01L23/488 , H01L23/051 , H01L23/24 , H01L24/32 , H01L24/33 , H01L2224/291 , H01L2224/29111 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01082 , H01L2924/0132 , H01L2924/10253 , H01L2924/181 , H01L2924/351 , H01L2924/01026 , H01L2924/01028 , H01L2924/01083 , H01L2924/3512 , H01L2924/00 , H01L2924/00015 , H01L2924/014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which is capable of preventing an Si chip from being broken due to thermal stress when used, and uses Pb-free solder having a melting point of ≥250°C. SOLUTION: Stress buffer plates 2a, 2b having a linear expansion coefficient of 3×10-6/°C to 8×10-6/°C are bonded on the upper/lower faces of the Si chip 1 via Pb-free solder having a thickness of ≤0.05 mm and a melting point of ≥250°C. The upper/lower faces of the stress buffer plates 2a, 2b are bonded to a lead 5 and a base 6 via Pb-free solder having a thickness of ≥0.15 mm and a melting point of ≥250°C. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供能够防止Si芯片在使用时由于热应力而被破坏的半导体器件，并且使用熔点≥250℃的无铅焊料。解决方案：线性膨胀系数为3×10-6 /℃至8×10-6 /℃的应力缓冲板2a，2b通过Pb-Si键合在Si芯片1的上/下表面上，厚度≤0.05mm，熔点≥250℃的无铅焊料。应力缓冲板2a，2b的上下面通过厚度≥0.15mm，熔点≥250℃的无铅焊料与引线5和基底6接合。版权所有（C）2007，JPO＆INPIT

95. 发明专利

JP3776522B2 Ranging light-receiving device and a method of manufacturing the same 失效
公开(公告)号：JP3776522B2
公开(公告)日：2006-05-17
申请号：JP24462196
申请日：1996-09-17
申请人：セイコープレシジョン株式会社
发明人：仲村知記 , 雨宮裕伸 , 露木裕人
IPC分类号： G01B11/00 , H01L31/02 , G02B6/42 , G02B7/00 , G02B7/28 , H01L23/24 , H01L31/16
CPC分类号： G02B7/00 , G02B6/4204 , G02B6/4245 , G02B6/4251 , G02B6/426 , G02B6/428 , H01L23/24 , H01L2924/0002 , H01L2924/00
摘要： A light-receiving apparatus comprises a light-receiving device positioned relative to an external component with increased accuracy. A sealing frame is mounted on a printed circuit board. One corner of this sealing frame is detectable by image processing. The position inside of the sealing frame at which the light-receiving device should be mounted is determined from the detected position of the corner of the sealing frame. A sealing material is injected inside the sealing frame and cured, thereby sealing the light-receiving device. Pins of the external components are inserted into holes or cutouts in the sealing frame and made stationary when the light-receiving device is mounted to the external component. The mounting of the light-receiving device inside the sealing frame is based on the sealing frame, and the mounting of the apparatus to the external part is based on the sealing frame. Therefore, the light-receiving device can be mounted relative to the external part with high accuracy.

97. 发明专利

JP2005538569A diode 审中-公开
公开(公告)号：JP2005538569A
公开(公告)日：2005-12-15
申请号：JP2004536811
申请日：2003-06-03
申请人：ローベルトボツシユゲゼルシヤフトミツトベシユレンクテルハフツングRobert Bosch Gmbh
发明人：ハムゼンカーリン , シュピッツリヒャルト
IPC分类号： H01L23/28 , H01L23/051 , H01L23/24 , H01L29/861
CPC分类号： H01L24/01 , H01L23/051 , H01L23/24 , H01L2924/01029 , H01L2924/01033 , H01L2924/01076 , H01L2924/10253 , H01L2924/00
摘要：埋込ソケット（１１）を有するダイオード（１０）が記載されている。当該ダイオード（１０）には、軸上に延在する固定領域（１２）が半導体チップ（１５）のために設けられており、該半導体チップに固定されたヘッドワイヤ（１５，１７）が設けられている。ヘッドワイヤは、段付けされたワイヤ端子、ないしは、埋込ソケットとカバー（２２）とともに気密のケーシングを形成する領域（２１）を有する。ケーシングに形成された中空スペースには、安定化のために充填材（２３）が充填されており、この充填材（２３）はケーシング内部にのみ設けられている。

98. 发明专利

JP2005223873A Oscillator package structure and device mounting method thereof 审中-公开
标题翻译：振荡器封装结构及其装置安装方法
公开(公告)号：JP2005223873A
公开(公告)日：2005-08-18
申请号：JP2004095328
申请日：2004-03-29
申请人： Txc Corp , 台湾晶技股▼ふん▲有限公司
发明人： CHIANG CHIEN-WEI
IPC分类号： H05K5/00 , B65D85/30 , H01L21/54 , H01L23/04 , H01L23/24 , H01L23/28 , H03B5/32 , H03H9/05 , H03H9/10
CPC分类号： H03H9/0552 , H01L21/54 , H01L23/24 , H01L2224/48091 , H03H9/1021 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide an oscillator package structure and a device mounting method thereof.
SOLUTION: The oscillator package structure and the device mounting method thereof are capable of reducing the size of the oscillator using the principle of capillarity and the surface tension of liquid and also protecting piezoelectric devices from contamination. The oscillator package structure has a substrate structure with a top surface and a bottom surface. By extending a plurality of sides upward from the circumference of the top surface to a certain height, a container opened upwards with the top surface is formed and at least one piezoelectric device can be housed. A sealed environment is formed by covering the container opened upward with a top lid, and by distributing a printed circuit on the surface, at least one electronic device can be connected. A plurality of struts of the same heights are distributed on the printed circuit, and by bonding a bottom lid to these struts, a partly opened environment is formed with the bottom surface. The bottom lid has a resin filler hole, and a plastic material is charged into the partly opened environment from the resin filler hole.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决的问题：提供一种振荡器封装结构及其装置安装方法。解决方案：振荡器封装结构及其器件安装方法能够使用毛细管的原理和液体的表面张力来减小振荡器的尺寸，并且还保护压电器件免受污染。振荡器封装结构具有具有顶表面和底表面的衬底结构。通过将多个侧面从上表面的周边向上延伸到一定高度，形成有顶面向上开口的容器，并且可容纳至少一个压电装置。通过用顶盖覆盖向上开口的容器形成密封环境，并且通过在表面上分配印刷电路，可以连接至少一个电子设备。多个相同高度的支柱分布在印刷电路上，并且通过将底盖粘合到这些支柱上，形成具有底表面的部分打开的环境。底盖具有树脂填充孔，并且从树脂填充孔将塑料材料装入部分打开的环境中。版权所有（C）2005，JPO＆NCIPI

99. 发明专利

JP2005150621A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2005150621A
公开(公告)日：2005-06-09
申请号：JP2003389670
申请日：2003-11-19
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： AKAGAWA KOICHI , NAGASE TOSHIAKI , ONISHI HIROYUKI , ISHIKAWA JUN
IPC分类号： H01L25/00 , H01L23/12 , H01L23/24 , H01L23/495
CPC分类号： H01L23/24 , H01L23/495 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which can prevent its gel from climbing up, without increasing its size.
SOLUTION: When injecting a silicone gel 19 into the inside of a case 17, since the gel 19 is liquid before its hardening, the gel 19 intends to rise along the very small clearance formed between the front surface of a first electrode 12 and the rear surface of a resin member 13. However, since the clearance is extended in a recessed portion 12a of the first electrode 12, such climbing-up of the gel 19 is stopped at the height of the recessed portion 12a. That is, the gel 19 is prevented from reaching the connecting portions of the first electrode 12 and a second electrode 14 with their external terminals. Also, since the climbing-up of the gel 19 can be prevented by the recessed portion 12a, the first and second electrodes 12, 14 can be so disposed as to approximate them to each other.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种可以防止其凝胶上升而不增加其尺寸的半导体器件。解决方案：当将硅凝胶19注入到壳体17的内部时，由于凝胶19在其硬化之前是液体，凝胶19将沿着形成在第一电极12的前表面之间的非常小的间隙上升和树脂构件13的后表面。然而，由于间隙在第一电极12的凹部12a中延伸，所以凝胶19的上升在凹部12a的高度处停止。也就是说，防止凝胶19到达第一电极12的连接部分和第二电极14的外部端子。此外，由于可以通过凹部12a来防止凝胶19的上升，所以可以将第一电极12和第二电极14设置成彼此接近。版权所有（C）2005，JPO＆NCIPI

100. 发明专利

JP2005117038A Integrated circuit and integrated circuit assembly 有权
标题翻译：集成电路和集成电路总成
公开(公告)号：JP2005117038A
公开(公告)日：2005-04-28
申请号：JP2004283743
申请日：2004-09-29
申请人： Agilent Technol Inc , アジレント・テクノロジーズ・インクAgilent Technologies, Inc.
发明人： KELLY MICHAEL G , KAW RAVINDHAR K
IPC分类号： H01L23/12 , H01L23/13 , H01L23/24 , H01L23/31 , H01L23/433 , H01L23/498 , H01L23/50 , H01L25/00
CPC分类号： H01L23/50 , H01L23/13 , H01L23/24 , H01L23/3128 , H01L23/4334 , H01L23/49816 , H01L23/49833 , H01L24/48 , H01L24/73 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73207 , H01L2924/00014 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/19041 , H01L2924/19107 , H01L2924/3011 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide a low cost integrated circuit having the advantages of both flip chip bonding and wire bonding. SOLUTION: The integrated circuit 10, 50 includes: an integrated circuit package having a first plurality of bonding pads 20, 62; a semiconductor substrate 14, 54 having a certain surface area, arranged within the integrated circuit package and provided with a second plurality of bonding pads 24, 64; a plurality of wire bonds 30, 66 that connect the pads selected from the first plurality of bonding pads 20, 62 to the pads selected from the second plurality of bonding pads 24, 64; and an interconnection substrate 16, 70 mounted on the semiconductor substrate and having a surface area smaller than said surface area of the semiconductor substrate. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供具有倒装芯片接合和引线接合两者优点的低成本集成电路。解决方案：集成电路10,50包括：集成电路封装，具有第一多个焊盘20,62; 具有一定表面积的半导体衬底14,54，布置在集成电路封装内并具有第二多个焊盘24和64; 将从第一多个接合焊盘20,62中选择的焊盘连接到从第二多个接合焊盘24,64中选择的焊盘的多个引线接合件30,66; 以及安装在半导体衬底上并具有比半导体衬底的所述表面积小的表面积的互连衬底16,70。版权所有（C）2005，JPO＆NCIPI

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