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    • 97. 发明专利
    • Electrostatic induction type semiconductor device
    • 静电诱导型半导体器件
    • JPS58180066A
    • 1983-10-21
    • JP6425482
    • 1982-04-16
    • Matsushita Electric Ind Co LtdSemiconductor Res Found
    • EZAKI TAKEYANISHIZAWA JIYUNICHI
    • H01L29/80
    • H01L29/80
    • PURPOSE:To increase the drain current of an electrostatic induction type transistor SIT by a method wherein the impurity density in the first conductive type thin layer is made higher than that of the semiconductor layer located around the thin layer. CONSTITUTION:An N type thin layer 5 is formed between gates 3, and 3' located in an N type layer 1-2 and, as a result, the N type channel region spreading from a source 2 and a drain 1-1 is divided into the region A on the side close to the source 2 and the region B on the side close to the drain 1-1. The thin layer 5 is formed in the impurity density several times higher than that of the N type regions A and B located around the thin layer. Drain current becomes larger as the density degree of the N type thin layer 5 becomes higher, but if said impurity density becomes too high, the withstand voltage of the gates 3 and 3', the source 2 and the drain 1-1 is reduced and the electrostatic capacity increases. Therefore, the impurity density of 3-5 times or thereabout against the density of epitaxial layer 1-1 is desirable.
    • 目的:通过使第一导电型薄层中的杂质浓度高于位于薄层周围的半导体层的杂质浓度的方法来增加静电感应型晶体管SIT的漏极电流。 构成:在N型层1-2中的栅极3和3'之间形成有N型薄层5,结果从源极2和漏极1-1扩散的N型沟道区被分割 进入靠近源极2侧的区域A和靠近漏极1-1的一侧的区域B. 薄层5形成的杂质密度比位于薄层周围的N型区域A和B的杂质密度高几倍。 漏极电流随着N型薄层5的密度变大而变大,但如果杂质浓度过高,则栅极3,3',源极2和漏极1-1的耐压降低, 静电容量增加。 因此,期望与外延层1-1的密度相关的3-5倍的杂质密度。
    • 98. 发明专利
    • High-frequency semiconductor device
    • 高频半导体器件
    • JPS58180045A
    • 1983-10-21
    • JP6273082
    • 1982-04-14
    • Matsushita Electric Ind Co Ltd
    • KUBOTA MASABUMIEZAKI TAKEYAISHIKAWA OSAMU
    • H01L23/12H01L23/66
    • H01L23/66H01L2223/6644H01L2224/48H01L2224/48011H01L2224/4813H01L2224/49H01L2224/49175H01L2924/00H01L2924/00012
    • PURPOSE:To contrive to enhance assembling yield of the high-frequency semiconductor device by a method wherein bonding pads for transmission are provided to attain curtailment of wire length, while the number of pieces of long wires is reduced. CONSTITUTION:The bonding pads 31, 32 for transmission are the metal electrodes for transmission short-circuited to neither electrode of an emitter, a base nor a collector formed on the field oxide film of a chip other than the bonding wires, and have the role to distribute the input signals of the bonding wires 38, 39 to respective two wires 40, 41 and 42, 43. Moreover the bonding pads 31, 32 for transmission are connected by the wire 44. The wire thereof is used to prevent generation of unbalance of input electric power to respective unit BPT's 19-22 according to dispersion of lengths of the long wires 38, 39, or dispersion of the characteristics of the unit BPT's, and accordingly abnormal oscillation can be suppressed, and allowable input electric power can be increased.
    • 目的:为了提高高频半导体器件的组合收益率,通过提供用于传输的接合焊盘以减少线长度的方法,同时减少长导线数量。 构成:用于透射的接合焊盘31,32是用于传输短路的金属电极,其不仅形成在除接合线之外的芯片的场氧化膜上形成的发射极,基极和集电极的电极,并且具有作用 以将接合线38,39的输入信号分配到相应的两根导线40,41和42,43。此外,用于传输的接合焊盘31,32通过导线44连接。其导线用于防止产生不平衡 根据长导线38,39的长度的分散或单位BPT的特性的偏差,对各单元BPT19-22的输入电力进行输入,从而可以抑制异常振荡,能够增加容许输入电力 。