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91. 发明专利

JP2004052270A Joint design resin film, metallic plate covered with joint design resin film, and method of manufacturing them 审中-公开
公开(公告)号：JP2004052270A
公开(公告)日：2004-02-19
申请号：JP2002208010
申请日：2002-07-17
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： KAKUMA TOKUAKI , TOMOMORI MOTOHIRO , TAGUMA KOJI , TANIGAMI MASANORI , NAKAMURA TAKUSHI
IPC分类号： E04F13/07 , B32B3/30 , C08J5/18 , E04F13/00 , E04F13/08 , E04F13/12
摘要： PROBLEM TO BE SOLVED: To provide a joint design resin film superior in design, moisture resistance, durability and pollution resistance, a joint design resin film-covered metallic plate, and a manufacturing method therefor. SOLUTION: This resin film is laminated on a metallic plate by forming a groove-shaped recessed part 7 and a bank-shaped projecting part 8 on both sides of the groove-shaped recessed part 7 on either surface of a double layer resin film for laminating a colored monolayer resin film 2 or a transparent resin film 4 for applying printing on a colored resin film or a colored resin film having an adhesive resin film on a lower layer, and is formed as the joint design resin film-covered metallic plate 10. COPYRIGHT: (C)2004,JPO

92. 发明专利

JP2004034619A Metal sheet laminate, laminated molded object using the same, and part using laminated molded object 审中-公开
公开(公告)号：JP2004034619A
公开(公告)日：2004-02-05
申请号：JP2002197865
申请日：2002-07-05
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： SAIJO KINJI , YOSHIDA KAZUO , OSAWA SHINJI , NANBU KOJI
IPC分类号： B23K20/04 , B23K20/24 , B32B15/01 , C23F4/00
摘要： PROBLEM TO BE SOLVED: To perform lamination without exerting adverse effect on the bonded part of a metal sheet laminate and to enhance processability at the time of processing into a required shape.
SOLUTION: A plurality of compounded metal sheets 26 and 28 capable of forming an intermetallic compound are laminated and, after the surfaces of the respective metal plates to be bonded are subjected to activation treatment, the metal plates are superposed one upon another in a contact state so that the activated treated surfaces are mutually opposed and lamination bonding is applied to both metal plates to manufacture a metal sheet laminate 20. Next, molding processing is applied to the metal sheet laminate to manufacture a laminated molded object 30 and this molded object is heat-treated to form the intermetallic compound in the vicinity of the bonded surface and, if necessary, the intermetallic compound is formed to the whole to produce a part 34.
COPYRIGHT: (C)2004,JPO

93. 发明专利

JP2004017622A Method for connecting resin films and connection device therefor 有权
公开(公告)号：JP2004017622A
公开(公告)日：2004-01-22
申请号：JP2002180118
申请日：2002-06-20
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： TAKAHASHI SATOSHI , NAKAMURA TAKUSHI , NOMURA KATSUNORI , AKITOMO TSUTOMU , HOSODA KAZUKI , YOSHIMURA KUNIHIRO
IPC分类号： B29C65/02 , B29C65/74 , B65H19/18
CPC分类号： B65H19/1873 , B29C65/02 , B29C65/18 , B29C65/74 , B29C66/1122 , B29C66/43 , B29C66/71 , B29C66/723 , B29C66/73117 , B29C66/8322 , B65H19/1815 , B65H19/1852 , B65H19/1868 , B65H2301/4621 , B65H2301/4634 , B65H2301/46412 , B65H2701/1752 , B29K2067/00
摘要： PROBLEM TO BE SOLVED: To provide a connection method capable of carrying out connection work while continuously performing the processing work of a post-process, in the connection of the preceding resin film and succeeding resin film of a continuously advancing long strip-like non-stretched resin film. SOLUTION: After the leading end of the succeeding resin film 22 is bonded to the preceding resin film 11 to connect both resin films, the preceding resin film just behind the connection position is heated within a specific temperature range and cut. COPYRIGHT: (C)2004,JPO

94. 发明专利

JP2004017480A Metallic laminate and part using the metallic laminate 审中-公开
公开(公告)号：JP2004017480A
公开(公告)日：2004-01-22
申请号：JP2002175655
申请日：2002-06-17
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： SAIJO KINJI , YOSHIDA KAZUO , OSAWA SHINJI , NANBU KOJI
IPC分类号： B23K20/00 , B23K20/04 , B23K20/24 , B32B15/01
摘要： PROBLEM TO BE SOLVED: To provide a metallic laminate obtained by laminating a plurality of highly conductive metallic sheets and parts using the metallic laminate which are applicable to a finned heat sink.
SOLUTION: This metallic laminate 20 with a specified laminar thickness is obtained by first laminating a plurality of highly conductive metallic sheets, then activating the surface of each of the metallic sheets to be laminated and bringing the activated faces into contact oppositely with each other and bonding them together in a laminar fashion. Next, the metallic laminate 20 is subjected to machining such as cutting so that the fins are formed and thus a heat sink is manufactured.
COPYRIGHT: (C)2004,JPO

95. 发明专利

JP2003328065A Wrought magnesium thin-sheet superior in formability, and manufacturing method therefor 审中-公开
标题翻译：无限制的镁合金薄膜及其制造方法
公开(公告)号：JP2003328065A
公开(公告)日：2003-11-19
申请号：JP2002135282
申请日：2002-05-10
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： OKAMOTO HIROAKI , IWANAGA KENGO , SHIMIZU KEIICHI
IPC分类号： B21B3/00 , C22C23/02 , C22F1/00 , C22F1/06
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive wrought magnesium thin-sheet superior in formability, particularly in press formability, and to provide a manufacturing method therefor.
SOLUTION: The magnesium thin-sheet is rolled from an extruded Mg alloy plate which comprises 1-9 wt.% Al, 0.1-2 wt.% Mn, and the balance Mg with inevitable impurities; is 0.2-2 mm thick after being rolled; has 200-350 MPa of each T1 and T2, and 0.7 or less of at least one value of a value (Y1/T1) and a value (Y2/T2), when Y1 is defined to be a yield strength, T1 to be a tensile strength in a direction parallel to the rolling direction, Y2 to be the yield strength, and T2 to be the tensile strength in the direction vertical to the rolling direction; and has an average crystal grain size of 3-100 μm. The manufacturing method is also disclosed.
COPYRIGHT: (C)2004,JPO
摘要翻译：待解决的问题：提供一种廉价的成型性优异的锻造镁薄片，特别是在冲压成形性方面，并提供其制造方法。解决方案：将镁薄片从包含1-9重量％的Al，0.1-2重量％的Mn和剩余的Mg与不可避免的杂质的挤出Mg合金板轧制。轧制后厚度为0.2-2毫米; 每个T1和T2具有200-350MPa的MPa，以及当将Y1定义为屈服强度时，为0.7（或更小）值（Y1 / T1）和值（Y2 / T2）的至少一个值，T1为在与轧制方向平行的方向上的拉伸强度，作为屈服强度的Y2，作为与轧制方向垂直的方向的拉伸强度的T2; 平均晶粒尺寸为3〜100μm。还公开了制造方法。版权所有（C）2004，JPO

96. 发明专利

JP2003291241A Method for producing plate laminate, method for producing hollow laminate using plate laminate, and method for producing part using hollow laminate 有权
标题翻译：生产板状层压板的方法，使用板层压板生产中空层压板的方法及使用中空层压板生产部件的方法
公开(公告)号：JP2003291241A
公开(公告)日：2003-10-14
申请号：JP2002100409
申请日：2002-04-02
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： SAIJO KINJI , YOSHIDA KAZUO , OSAWA SHINJI
IPC分类号： F28D15/02 , B23K20/00 , B23K20/14 , B23K20/18 , B32B7/04
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a plate laminate in which a plurality of plates are laminated and bonded, a junction controlling part is formed in a prescribed pattern between a pair of facing plates to form at least one junction controlling part in the laminate, and one or more spots of the junction controlling part are to be used as openings, a method for producing a hollow laminate using the plate laminate, and a method for producing a part using the hollow laminate. SOLUTION: The junction controlling part is formed in the prescribed pattern between the facing plates 12 to form the plate laminate 20. The junction controlling part of the plate laminate 20 is expanded to form the hollow laminate having a hollow part 11, and a part of the hollow part is used as an opening part to produce the part. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供一种板状层压体的制造方法，其中多个板被层压和结合，结合控制部分以规定的图案形成在一对相对的板之间以形成至少一个接合部控制部分在层压板中，并且接合控制部分的一个或多个点用作开口，使用该板层压板制造中空层压体的方法，以及使用该中空层压体制造部件的方法。解决方案：接合控制部分在相对板12之间以规定的图案形成，以形成板状层压体20.板状层压体20的接合控制部分被膨胀以形成具有中空部分11的中空层压体，并且中空部分的一部分用作开口部分以制造该部件。版权所有（C）2004，JPO

97. 发明专利

JP2003291238A Method for producing base material layer laminate and method for producing part using the laminate 有权
标题翻译：用于生产基材层压板的方法和使用层压板生产部分的方法
公开(公告)号：JP2003291238A
公开(公告)日：2003-10-14
申请号：JP2002095914
申请日：2002-03-29
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： SAIJO KINJI , KAWAMURA TSUGIO , YOSHIDA KAZUO , OSAWA SHINJI
IPC分类号： B32B7/02
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a base material laminate in which base material layers and conductive layers are laminated without using a high temperature process, and a method for producing a part using the laminate. SOLUTION: In the method for producing the base material layer laminate 30 in which the base material layers 24 and the conductive layers 22 are laminated alternately, by forming the conductive layer 22 by using a conductive layer forming means by electric plating, etc., in a clearance formed by the base material layers 24, each having thin conductive layer 22, the base material layers are bonded/fixed to obtain the base material layer laminate 30. The part such as a capacitor is produced by using the laminate 30. COPYRIGHT: (C)2004,JPO
摘要翻译：解决问题的方法：提供一种基板材料层叠体的制造方法，其中不使用高温处理层叠基材层和导电层，以及使用该层压体的部件的制造方法。＆lt; P＆gt;解决方案：在基材层24和导电层22交替层叠的基材层叠体30的制造方法中，通过使用导电层形成装置通过电镀等形成导电层22 在由具有薄导电层22的基材层24形成的间隙中，基材层被粘结/固定以获得基材层层叠体30.通过使用层压体30制造诸如电容器的部分版权所有（C）2004，JPO

98. 发明专利

JP2003291237A Base material layer laminate and part using the laminate 有权
标题翻译：基层材料层和层压板的一部分
公开(公告)号：JP2003291237A
公开(公告)日：2003-10-14
申请号：JP2002095855
申请日：2002-03-29
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： SAIJO KINJI , KAWAMURA TSUGIO , YOSHIDA KAZUO , OSAWA SHINJI
IPC分类号： B32B7/02
摘要： PROBLEM TO BE SOLVED: To provide a base material layer laminate in which base material layers and conductive layers are laminated without using a high temperature process, and a part using the laminate. SOLUTION: In the base material layer laminate 30, the base material layers 24 and the conductive layers 22 are laminated alternately. The conductive layer is formed by using a conductive layer forming means by electric plating, etc., in a clearance formed by the base material layers 24, each having the thin conductive layer 22 on at least one side, so that the base material layers are bonded and fixed to obtain the laminate 30. The laminate 30 is used in the part such as a capacitor. COPYRIGHT: (C)2004,JPO
摘要翻译：解决的问题：为了提供在不使用高温处理的情况下层压基材层和导电层的基材层层叠体和使用该层压体的部分。解决方案：在基材层叠体30中，交替层叠基材层24和导电层22。通过在由基材层24形成的间隙中通过电镀等使用导电层形成装置形成导电层，每个基材层在至少一侧具有薄导电层22，使得基材层粘合并固定以获得层压体30.层压体30用于诸如电容器的部分中。版权所有（C）2004，JPO

99. 发明专利

JP2003282064A Compound current collector 审中-公开
标题翻译：复合电流收集器
公开(公告)号：JP2003282064A
公开(公告)日：2003-10-03
申请号：JP2002079426
申请日：2002-03-20
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： OKAMURA TAKAAKI , HIRAKAWA SHINSUKE
IPC分类号： H01M4/66
CPC分类号： Y02E60/12
摘要： PROBLEM TO BE SOLVED: To provide a compound current collector of resin and a metal in which junctions of lead wires have only to be put on either a front or back face, and which can be made more lightweight than a metallic foil, and moreover, to provide the compound current collector which can respond also to a demand for thinning.
SOLUTION: By forming electric conduction treatment layers 12a and 12b on both faces of a resin film 11 with many through-holes 15, and after forming metal-plating layers 13a, 13b and 13c on the electric conduction treatment layers by an electrolysis metal-plating treatment, the compound current collector has a surface electric resistance of 40 mΩ/cm or less, a tensile strength of 0.8 kg/cm, and a front-back resistance of the electric conduction of 100 mΩ/cm or less, and a formula Y1+Y2+Y3≤0.8×(X1+X2+X3)×Y3/X3 is satisfied further. Here, X1 is the thickness of the resin film (μm), X2 is the thickness (μm) of the electric conduction treatment layer, X3 is the thickness (μm) of the metal- plating layer, Y1 is the weight (mg/cm
2 ) of the resin film, Y2 is the weight (mg/cm
2 ) of the electric conduction treatment layer, and Y3 is the weight (mg/cm
2 ) of the metal-plating layer.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供一种树脂和金属的复合集电体，其中引线的接合部仅仅放置在前表面或后表面上，并且可以制成比金属箔更轻，此外，提供可以应对薄化需求的复合集电体。解决方案：通过在具有多个通孔15的树脂膜11的两个表面上形成导电处理层12a和12b，并且通过电解在导电处理层上形成金属镀层13a，13b和13c之后金属电镀处理时，复合集电体的表面电阻为40mΩ/ cm以下，拉伸强度为0.8kg / cm，电导率的前后阻力为100mΩ/ cm以下，进一步满足式Y1 + Y2 +Y3≤0.8×（X1 + X2 + X3）×Y3 / X3。这里，X1是树脂膜的厚度（μm），X2是导电处理层的厚度（μm），X3是金属镀层的厚度（μm），Y1是重量（mg / cm 2 ），Y2是导电处理层的重量（mg / cm 2 SP），Y 3是重量（mg / cm 2） 2 ）。版权所有（C）2004，JPO

100. 发明专利

JP2003240959A PROTECTIVE FILM FOR POLARIZING FILM, RELEASE PROTECTIVE FILM FOR POLARIZING FILM AND POLARIZING PLATE USING THE SAME 审中-公开
公开(公告)号：JP2003240959A
公开(公告)日：2003-08-27
申请号：JP2002362584
申请日：2002-12-13
申请人： TOYO KOHAN CO LTD
发明人： MAIDA TOMOMASA , FUJII YUKIHARU , FUKUI TAKESHI
IPC分类号： G02B5/30 , B32B27/36
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive protective film and a release film having extremely little birefringence for a polarization film and to provide a polarizing plate using the above films in which optical defects are easily detected. SOLUTION: A three-layer film having no orientation produced by laminating polybutylene terephthalate films on both surfaces of a polycarbonate film having ≥100°C glass transition temperature is used for the protective film for a polarizing film. A silicone release agent is applied on the surface of the polybutylene terephthalate film on one face of the three-layer film to obtain the release protective film for a polarizing film. The protective film for a polarizing film and the release protective film for a polarizing film are used as outermost layers, that is the polarizing plate to constitute a polarizing film containing a polarizer. COPYRIGHT: (C)2003,JPO

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