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1. 发明专利

JP2014099485A Solar cell module 有权
标题翻译：太阳能电池模块
公开(公告)号：JP2014099485A
公开(公告)日：2014-05-29
申请号：JP2012249837
申请日：2012-11-14
申请人： Panasonic Corp , パナソニック株式会社
发明人： OHASHI NAOMICHI , SUZUKI YASUHIRO , HINO HIROHISA , MIYAGAWA HIDEKI , KISHI ARATA
IPC分类号： H01L31/042
CPC分类号： Y02E10/52
摘要： PROBLEM TO BE SOLVED: To provide a solar cell module having a high power generation efficiency capable of preventing wraparound of white resin from the rear side to the light receiving surface of a solar cell and by effectively reflecting the light passing through the cells and spaces between cells with a white resin to collect the light to the solar cell.SOLUTION: In the solar cell module, both of the light receiving surface and the rear side of the solar cells are sealed with a resin. The surface of the cells other than the light receiving surface is coated with the resin which contains white filler the density of which is 0.2-21 wt%. With this, the wraparound of the resin from the rear side to the light receiving surface of the cell is prevented. Accordingly, the solar cell module ensures high power generation efficiency.
摘要翻译：要解决的问题：提供一种具有高发电效率的太阳能电池模块，其能够防止白色树脂从太阳能电池的背面到光接收表面的环绕，并且有效地反射通过电池的光和空间之间的空间具有白色树脂的电池用于将光收集到太阳能电池。解决方案：在太阳能电池模块中，太阳能电池的光接收表面和后侧都用树脂密封。除了光接收表面之外的细胞表面涂有含有密度为0.2-21重量％的白色填料的树脂。由此，可以防止树脂从电池的后侧到光接收面的环绕。因此，太阳能电池模块确保高发电效率。

2. 发明专利

JP2012244034A Mounting structure of semiconductor package component and manufacturing method thereof 有权
标题翻译：半导体封装组件的安装结构及其制造方法
公开(公告)号：JP2012244034A
公开(公告)日：2012-12-10
申请号：JP2011114459
申请日：2011-05-23
申请人： Panasonic Corp , パナソニック株式会社
发明人： YAMAGUCHI ATSUSHI , TSUJIMURA HIDEYUKI , OWADA HIROE , KUWABARA RYO , OHASHI NAOMICHI
IPC分类号： H05K3/34 , H01L21/60
CPC分类号： H01L23/315 , H01L23/3157 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/131 , H01L2224/14131 , H01L2224/14136 , H01L2224/16238 , H01L2224/29017 , H01L2224/29035 , H01L2224/29082 , H01L2224/29083 , H01L2224/2919 , H01L2224/30155 , H01L2224/32225 , H01L2224/73203 , H01L2224/81143 , H01L2224/81193 , H01L2224/81411 , H01L2224/81815 , H01L2224/831 , H01L2224/83862 , H01L2224/9221 , H01L2924/01047 , H01L2924/01029 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/00012 , H01L2924/0665
摘要： PROBLEM TO BE SOLVED: To connect a semiconductor package component and a substrate with durability and strength while maintaining solder joint quality.SOLUTION: When a semiconductor package component 3 is mounted on a substrate 1, and an adhesive agent is applied between the substrate 1 and a peripheral part of the semiconductor package component 3, an adhesive agent 6a is applied on the substrate 1 as a first application, and an adhesive agent 6b is applied thereon as a second application so as to connect the peripheral part of the semiconductor package component 3 and the adhesive agent 6a. Thereafter, reflow is carried out to cause solder melting. After the adhesive agents 6a and 6b are cured, solder joint is coagulated. In this case, a relationship between a cross-sectional area S1 of an adhesive agent part 60a of the first application and a cross-sectional area S2 of an adhesive agent part 60b of the second application satisfies S1≤S2.
摘要翻译：要解决的问题：在保持焊点质量的同时，使半导体封装部件和基板具有耐久性和强度。解决方案：当将半导体封装部件3安装在基板1上，并且将粘合剂施加在基板1和半导体封装部件3的周边部分之间时，将粘合剂6a施加在基板1上作为第一应用和粘合剂6b作为第二应用施加在其上，以便连接半导体封装部件3的周边部分和粘合剂6a。此后，进行回流以使焊料熔化。粘合剂6a和6b固化后，焊点凝结。在这种情况下，第一应用的粘合剂部60a的截面积S1与第二应用的粘合剂部60b的截面积S2之间的关系满足S1≤S2。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2012256672A Mounting structure of semiconductor component 有权
标题翻译：半导体元件的安装结构
公开(公告)号：JP2012256672A
公开(公告)日：2012-12-27
申请号：JP2011128131
申请日：2011-06-08
申请人： Panasonic Corp , パナソニック株式会社
发明人： YOSHIDA HISAHIKO , KISHI ARATA , OHASHI NAOMICHI , YAMAGUCHI ATSUSHI
IPC分类号： H05K3/34 , H01L21/60 , H01L23/12
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To prevent blowout of solder due to fusion expansion of the solder when a second surface is subject to reflow heating in a circuit board where a land grid array (LGA) is soldered on a first surface of a printed wiring board with a solder paste containing an adhesive resin.SOLUTION: In a circuit board 4, a land grid array 3, where multiple connection terminals 301 are disposed on a lower surface, is soldered to a printed wiring board 1, where lands 111 are respectively formed at positions corresponding to the multiple connection terminals 301 on at least a first surface 110, with a solder paste 2 containing flux, containing an adhesive resin, and solder powder. The circuit board 4 includes protruding region parts 113 at positions enclosing outer peripheries of the lands 111. A distance A is provided between the outer periphery of the land 111 and an inner periphery of the protruding region part 113. A chip component 6 is soldered on a second surface 120 of the printed wiring board 1 which is located on the opposite side of the first surface 110.
摘要翻译：要解决的问题：为了防止当在印刷的第一表面上焊接焊盘格栅阵列（LGA）的电路板中的第二表面进行回流加热时由于焊料的熔融膨胀而引起的焊料的喷射具有含有粘合树脂的焊膏的布线板。解决方案：在电路板4中，将多个连接端子301设置在下表面上的焊盘格栅阵列3焊接到印刷布线板1，其中焊盘111分别形成在对应于多个至少第一表面110上的连接端子301，包含含有粘合剂树脂的助焊剂的焊膏2和焊料粉末。电路板4在包围焊盘111的外周的位置包括突出区域部分113.在焊盘111的外周与突出区域部分113的内周之间设置距离A.芯片部件6焊接在印刷线路板1的位于第一表面110的相对侧的第二表面120.版权所有：（C）2013，JPO＆INPIT

4. 发明专利

JP2012092296A Electroconductive adhesive, and circuit board and electronic component module using the same 有权
标题翻译：电磁粘合剂，电路板和电子元件组件
公开(公告)号：JP2012092296A
公开(公告)日：2012-05-17
申请号：JP2011169966
申请日：2011-08-03
申请人： Panasonic Corp , パナソニック株式会社
发明人： KISHI ARATA , OHASHI NAOMICHI , YAMAGUCHI ATSUSHI
IPC分类号： C09J163/00 , B22F1/00 , B23K35/26 , C09J9/02 , C09J11/04 , C09J11/06 , C22C12/00 , H01B1/00 , H01B1/22 , H01B5/14 , H01L21/60 , H05K3/12
CPC分类号： C09J9/02 , C08K3/08 , C08K5/09 , C09J11/04 , H01L21/4853 , H01L23/49811 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/1329 , H01L2224/13313 , H01L2224/16225 , H01L2224/16227 , H01L2224/81192 , H01L2224/8122 , H01L2224/81874 , H01L2924/00013 , H01L2924/15787 , H05K3/12 , H05K3/321 , H05K3/4069 , H05K2201/0272 , H05K2203/0425 , H01L2924/0105 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To solve a problem that printing to an electronic circuit board which has a land of a fine pitch still finer than 0.8 mm is not completed by a conventional electroconductive adhesive.SOLUTION: The electroconductive adhesive includes 10-90 wt.% of an SnBi based solder powder, and a remainder which contains an adhesive containing an organic acid, wherein the SnBi based solder powder includes solder particles A-D in which a particle diameter Lis 20-30 μm and a solder particle E in which a particle diameter Lis 8-12 μm, and in a mixed rate of the SnBi based solder powder, the solder particles A-D whose particle diameters are 20-30 μm is 40-90 wt.% of the whole solder powder, and a remainder is the solder particle E whose particle diameter is 8-12 μm.
摘要翻译：要解决的问题为了解决印刷到具有小于0.8mm的细小间距的电子电路板的问题未被传统的导电粘合剂完成。
解决方案：导电粘合剂包括10-90重量％的SnBi基焊料粉末，其余部分含有含有机酸的粘合剂，其中SnBi基焊料粉末包括焊料颗粒AD，其中粒径L 1 为20-30μm，其中粒径L 2 的焊料颗粒E为8-12μm， SnBi基焊料粉末的混合比率，粒径为20-30μm的焊料颗粒AD为整个焊料粉末的40-90重量％，剩余部分为粒径为8-12的焊料颗粒E 微米。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2014103190A Solar cell module 有权
标题翻译：太阳能电池模块
公开(公告)号：JP2014103190A
公开(公告)日：2014-06-05
申请号：JP2012252953
申请日：2012-11-19
申请人： Panasonic Corp , パナソニック株式会社
发明人： HINO HIROHISA , OHASHI NAOMICHI , SUZUKI YASUHIRO , KISHI ARATA , MIYAGAWA HIDEKI
IPC分类号： H01L31/042
CPC分类号： Y02E10/52
摘要： PROBLEM TO BE SOLVED: To provide a solar cell module capable of achieving high generation efficiency by effectively reflecting light passing through spaces between solar cells to collect the light to the solar cells.SOLUTION: The solar cell module comprises: a white resin; plural solar cells positioned on an upper face of the white resin; a transparent resin positioned over an upper face of the solar cells; and a surface coating material positioned over an upper face of the transparent resin, wherein the white resin forms a convex part between the plural solar cells, and wherein the white resin is formed by connecting a rectangular parallelepiped located beneath a lower face of the plural solar cells and the convex part located between the plural solar cells.
摘要翻译：要解决的问题：提供一种通过有效地反射通过太阳能电池之间的空间的光来实现高发电效率的太阳能电池模块，以将光收集到太阳能电池。解决方案：太阳能电池模块包括：白色树脂; 多个太阳能电池位于白色树脂的上表面上; 位于太阳能电池的上表面上的透明树脂; 以及位于所述透明树脂的上表面上的表面涂层材料，其中所述白色树脂在所述多个太阳能电池之间形成凸部，并且其中所述白色树脂通过连接位于所述多个太阳能电池的下表面下方的长方体形成电池和位于多个太阳能电池之间的凸部。

6. 发明专利

JP2010245434A Solder bonding method and solder bonding structure 有权
标题翻译：焊接方法和焊接结合结构
公开(公告)号：JP2010245434A
公开(公告)日：2010-10-28
申请号：JP2009094889
申请日：2009-04-09
申请人： Panasonic Corp , パナソニック株式会社
发明人： OHASHI NAOMICHI , KISHI ARATA , YAMAGUCHI ATSUSHI , MIYAGAWA HIDEKI
IPC分类号： H05K3/34 , H05K3/28 , H05K3/32
CPC分类号： H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a solder bonding method of forming a bonding part which is stable in bondability and highly reliable.
SOLUTION: The solder bonding method of soldering an electronic component 4 with a bump electrode 5 to an electronic circuit board 1 includes the steps of: forming a conductive paste layer 3 by supplying conductive paste containing a conductive filler, a flux, a first thermosetting resin, and a curing agent for curing the resin to an electrode part 2 of the electronic circuit board 1; forming an insulating resin paste layer 6 by supplying insulating resin paste containing a second thermosetting resin and a curing agent for curing the resin to the electronic component 4; loading the electronic component 4 on the electronic circuit board 1; and heating and fusing the conductive filler to solder the electronic component 4 to the electrode part 2 of the electronic circuit board 1, and curing the first and second thermosetting resins of the paste layers 3 and 6.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种焊接方法，其形成粘合性稳定并且高可靠性的接合部。解决方案：将具有凸起电极5的电子部件4焊接到电子电路板1的焊接方法包括以下步骤：通过提供包含导电填料，焊剂，第一热固性树脂和用于将树脂固化到电子电路板1的电极部分2的固化剂; 通过向电子部件4供给含有第二热固性树脂的绝缘树脂膏和用于固化树脂的固化剂，形成绝缘树脂浆料层6; 将电子部件4装载在电子电路基板1上; 加热并熔融导电填料以将电子部件4焊接到电子电路板1的电极部分2上，并固化糊层3和6的第一和第二热固性树脂。版权所有（C）2011 ，JPO＆INPIT

7. 发明专利

JP2010212655A Electronic device and method of manufacturing the same 有权
标题翻译：电子设备及其制造方法
公开(公告)号：JP2010212655A
公开(公告)日：2010-09-24
申请号：JP2009246696
申请日：2009-10-27
申请人： Panasonic Corp , パナソニック株式会社
发明人： KISHI ARATA , OHASHI NAOMICHI , YAMAGUCHI ATSUSHI , TOKII SEIJI , UKO MASATO
IPC分类号： H05K3/34 , H05K3/36
CPC分类号： H05K3/3489 , B23K1/0016 , B23K1/203 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/73104 , H01L2224/812 , H01L2224/81801 , H01L2224/83191 , H01L2224/83192 , H01L2224/92125 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/19043 , H01L2924/351 , H05K3/305 , H05K3/3436 , H05K3/3442 , H05K2201/10515 , H05K2201/10636 , H05K2201/10977 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： PROBLEM TO BE SOLVED: To improve bonding reliability of an electronic device as a stack structure of circuit assemblies which are electrically connected to each other through solder bumps.
SOLUTION: A method of manufacturing the electronic device includes the steps of: setting a solder material on electrodes of a first circuit assembly; setting a resin having a flux action on one surface of a second circuit assembly so as to entirely cover solder bumps formed on one surface of the second circuit assembly; setting the second circuit assembly on the first circuit assembly via the resin so that the solder material set on the electrodes of the first circuit assembly and the solder bumps of the second circuit assembly are put into contact with each other; and applying thermal energy to connecting portions between the solder material and the solder bumps and to the resin. By carrying out these processes, the electronic device in which the first circuit assembly and the second circuit assembly are joined together and in which their junction portions are sealed by the resin is manufactured. As a result, in the electronic device, bonding reliability can be improved.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提高作为通过焊料凸块彼此电连接的电路组件的堆叠结构的电子设备的接合可靠性。解决方案：一种制造电子器件的方法包括以下步骤：将焊料材料设置在第一电路组件的电极上; 将在第二电路组件的一个表面上具有磁通作用的树脂设置成完全覆盖形成在第二电路组件的一个表面上的焊料凸块; 通过树脂将第二电路组件设置在第一电路组件上，使得设置在第一电路组件的电极上的焊料材料和第二电路组件的焊料凸块彼此接触; 并且将热能施加到焊料材料和焊料凸块之间的连接部分和树脂上。通过进行这些处理，制造其中第一电路组件和第二电路组件接合在一起并且其接合部分被树脂密封的电子设备。结果，在电子设备中，可以提高接合可靠性。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2012115871A Solder paste 有权
标题翻译：焊膏
公开(公告)号：JP2012115871A
公开(公告)日：2012-06-21
申请号：JP2010267533
申请日：2010-11-30
申请人： Panasonic Corp , パナソニック株式会社
发明人： YAMAGUCHI ATSUSHI , KISHI ARATA , OHASHI NAOMICHI , OKUNO SHINJI
IPC分类号： B23K35/363 , B23K35/22 , B23K35/26 , C22C12/00 , C22C13/00 , H05K3/34
CPC分类号： Y02P70/613
摘要： PROBLEM TO BE SOLVED: To provide solder paste that improves the visibility of a part reinforced with an adhesive agent in a joining part, thereby facilitating detection of failures.SOLUTION: The solder paste 1 containing an adhesive agent includes: a solder containing 15-65 wt.% Bi and Sn; a resin for an adhesive agent, which is an epoxy resin; a curative agent; and a first activator that is a hydroxycarboxylic acid and a second activator that is an aliphatic dicarboxylic acid, thereby improving the visibility of a part reinforced with an adhesive agent in a joining part and facilitating detection of failures.
摘要翻译：要解决的问题：提供一种焊膏，其提高了在接合部中用粘合剂增强的部件的可视性，从而便于检测到故障。含有粘合剂的焊膏1包括：含有15-65重量％Bi和Sn的焊料; 用于粘合剂的树脂，其是环氧树脂; 治疗剂以及作为羟基羧酸的第一活化剂和作为脂肪族二羧酸的第二活化剂，从而提高在接合部分中用粘合剂增强的部分的可视性，并且便于检测到故障。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2010077265A Thermosetting resin composition, production method thereof and circuit board 有权
标题翻译：热固性树脂组合物，其制造方法和电路板
公开(公告)号：JP2010077265A
公开(公告)日：2010-04-08
申请号：JP2008246863
申请日：2008-09-25
申请人： Panasonic Corp , Panasonic Electric Works Co Ltd , パナソニック株式会社 , パナソニック電工株式会社
发明人： HINO HIROHISA , FUKUHARA YASUO , OHASHI NAOMICHI , KISHI ARATA , YAMAGUCHI ATSUSHI , MIYAGAWA HIDEKI , TSUJIMURA HIDEYUKI
IPC分类号： C08L101/00 , C08K3/08 , C08K5/092 , C08K5/36 , C08L63/00 , H05K3/32 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which can collectively be reflowed at a low temperature with low temperature melting solder particles, when an electronic circuit containing parts not resisting to high temperature is mounted, and can mount parts in excellent strength and toughness.
SOLUTION: The thermosetting resin composition comprises a metal filler component, a flux component, and a thermosetting resin binder, characterized by using at least one of Bi and In as the metal filler component and further using at least one of diglycolic acid represented by structural formula (1): HOOCH
2 C-O-CH
2 COOH, thiodiglycolic acid represented by structural formula (2): HOOCH
2 C-S-CH
2 COOH, and dithiodiglycolic acid represented by structural formula (3): HOOCH
2 C-S-S-CH
2 COOH as the flux component.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种可在低温熔融焊料颗粒下共同回流的热固性树脂组合物，当安装含有不耐高温的部件的电子电路时，可以将部件安装成优异强度和韧性。解决方案：热固性树脂组合物包含金属填料组分，助熔剂组分和热固性树脂粘合剂，其特征在于使用Bi和In中的至少一种作为金属填料组分，并进一步使用至少一种二甘醇酸代表由结构式（1）表示：由结构式（2）表示的硫二甘醇酸：HOOCH 2 CO / CH 2， CH 3，COOH和由结构式（3）表示的二硫代二乙醇酸：作为助熔剂组分的HOOCH 2 CO 2 COOH。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2009283453A Conductive paste and mounting structure using the same 有权
标题翻译：导电胶和安装结构
公开(公告)号：JP2009283453A
公开(公告)日：2009-12-03
申请号：JP2009101095
申请日：2009-04-17
申请人： Panasonic Corp , パナソニック株式会社
发明人： OHASHI NAOMICHI , HIGUCHI TAKAYUKI , KISHI ARATA , YAMAGUCHI ATSUSHI , MIYAGAWA HIDEKI
IPC分类号： H01B1/22 , B23K35/22 , B23K35/26 , B23K35/363 , H01B1/00 , H01L21/60 , H05K3/34
CPC分类号： H01B1/22 , B23K35/025 , B23K35/262 , B23K2201/36 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H05K3/3484 , H05K2201/0272 , Y10T428/31681 , H01L2224/05599
摘要： PROBLEM TO BE SOLVED: To restrain generation of solder balls to secure electric bonding at low resistance, at the time of soldering. SOLUTION: A conductive paste includes a filler component and a flux component. The filler component includes a first conductive filler and a second conductive filler having different melting points, and the melting point of the first conductive filler is higher than that of the second conductive filler by 20°C. or more, the flux component includes a first flux and a second flux having different melting points, the melting point of the first flux is higher than that of the second flux, and the melting point of the first flux is higher than that of the second conductive filler by 15°C to 45°C. The melting point of the second flux is equal to or less than that of the second conductive filler. The conductive paste is excellent in preserving property at room temperature. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：在焊接时，为了抑制焊球的产生以确保电阻低的电阻。导电浆料包括填料组分和助熔剂组分。填料组分包括具有不同熔点的第一导电填料和第二导电填料，第二导电填料的熔点比第二导电填料的熔点高20℃。以上，所述通量成分包括第一助熔剂和熔点不同的第二助熔剂，所述第一焊剂的熔点高于所述第二焊剂的熔点，所述第一熔剂的熔点高于所述第二熔剂的熔点导电填料在15°C至45°C之间。第二通量的熔点等于或小于第二导电填料的熔点。导电性糊剂在室温下的保存性优异。版权所有（C）2010，JPO＆INPIT

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