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1. 发明专利

JP2010212542A Circuit board 审中-公开
标题翻译：电路板
公开(公告)号：JP2010212542A
公开(公告)日：2010-09-24
申请号：JP2009059067
申请日：2009-03-12
申请人： Panasonic Corp , パナソニック株式会社
发明人： NAKATANI HITOSHI , UKO MASATO
IPC分类号： H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a circuit board which improves the strength of the board without having an effect on the performance of an electric component even though the board becomes thinner in response to a demand for densely mounting a component on a circuit board.
SOLUTION: The circuit board 1 in which electronic components 3 to 11 are mounted on the board 2 includes belt-like adhesive layers 20 and 21 on the board 2 along at least part of the peripheries 3a and 4a of the electronic components 3 and 4. The strength of the board 2 is improved without having an effect on the performance of the electronic components 3 and 4. The lifting of the electronic components 3 and 4 from the board 2 and the strain of the board 2 are prevented.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种电路板，其可以在不影响电气部件的性能的情况下提高板的强度，即使板响应于将组件密集安装在电路上的要求变薄板。电子部件3〜11安装在基板2上的电路基板1沿着电子部件3的外周3a，4a的至少一部分，在基板2上具有带状粘接层20,21 改善了电路板2的强度，而不影响电子部件3和4的性能。防止了电子部件3和4从电路板2的抬起和电路板2的变形。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2011255512A Mask, apparatus and method for printing screen 审中-公开
标题翻译：掩模，设备和打印屏幕的方法
公开(公告)号：JP2011255512A
公开(公告)日：2011-12-22
申请号：JP2010129246
申请日：2010-06-04
申请人： Panasonic Corp , パナソニック株式会社
发明人： TOKII SEIJI , UKO MASATO
IPC分类号： B41F15/08 , B41F15/36 , B41F15/40 , B41M1/12 , B41N1/24 , H05K3/12 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a screen printing mask that enables certainly performing random mixed production of a plurality of kinds of substrate surfaces under an optimal print condition and enables sharply shortening switching time of the plurality of kinds of substrate surfaces, and to provide a screen printing apparatus and method using the screen printing mask.SOLUTION: The screen printing mask 1 is a metal mask of the shape of a thin plate whose thickness is about 100-150 μm in metal, and is used in order to perform screen printing of the printing paste such as cream solder to a substrate surface of a printed circuit board. In one screen printing mask 1, two kinds of opening patterns 2 and 3 are formed corresponding to two kinds of the substrate surfaces. Here the shape of the opening is the shape corresponding to a land on the substrate surface of the printed circuit board. Also in the screen printing mask 1, two kinds of information recognition marks 2a and 3a which record information openings 2 and 3, respectively. Here, a bar code, a QR code (R), etc. can be used for the information recognition marks 2a and 3a.
摘要翻译：要解决的问题：提供一种丝网印刷掩模，其能够在最佳打印条件下确实执行多种基板表面的随机混合生产，并且能够显着缩短多种基板表面的切换时间，并且以提供使用丝网印刷掩模的丝网印刷装置和方法。＆lt; P＆gt;解决方案：丝网印刷掩模1是在金属中厚度为约100-150μm的薄板形状的金属掩模，并且用于进行诸如膏状焊膏的印刷浆料的丝网印刷印刷电路板的基板表面。在一个丝网印刷掩模1中，对应于两种基板表面形成两种开口图案2和3。这里，开口的形状是与印刷电路板的基板表面上的焊盘相对应的形状。同样在丝网印刷掩模1中，分别记录信息开口2和3的两种信息识别标记2a和3a。这里，条形码，QR码（R）等可以用于信息识别标记2a和3a。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2012054417A Mounting structure of electronic component and method of manufacturing the same 审中-公开
标题翻译：电子元件的安装结构及其制造方法
公开(公告)号：JP2012054417A
公开(公告)日：2012-03-15
申请号：JP2010196030
申请日：2010-09-01
申请人： Panasonic Corp , パナソニック株式会社
发明人： TOKII SEIJI , UKO MASATO
IPC分类号： H01L21/60
CPC分类号： H01L2224/16227 , H01L2224/73203
摘要： PROBLEM TO BE SOLVED: To provide a mounting structure of an electronic component in which impact of heat shrinkage in hardening of reinforcement resin can be minimized when soldering and thermal hardening of the reinforcement resin are carried out in the same heating process.SOLUTION: A mounting structure 1 of an electronic component comprises a printed board 2, an electronic component 4 having a square plane mounted on the printed board 2 with solder balls 3 interposed therebetween, and reinforcement resin 5 applied and formed across the printed board 2 and the electronic component 4. When viewed from a normal direction of the upper surface of the electronic component 4, the reinforcement resin 5 is applied and formed clockwise along each side starting from each corner of the upper surface of the electronic component 4 with a length not reaching the adjacent corner.
摘要翻译：要解决的问题：提供一种电子部件的安装结构，其中在相同的加热过程中进行加强树脂的焊接和加热硬化时，加强树脂的硬化中的热收缩的冲击可以最小化。解决方案：电子部件的安装结构1包括印刷电路板2，具有安装在印刷电路板2上的方形平面的电子部件4，其间插入有焊球3，以及加强树脂5，其被印刷板2和电子部件4.当从电子部件4的上表面的法线方向观察时，加强树脂5沿着从电子部件4的上表面的每个角开始的每一侧沿顺时针方向施加并形成，长度未到达相邻角。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2010258173A Mounting method and mounting structure for semiconductor package component 有权
标题翻译：半导体封装组件的安装方法和安装结构
公开(公告)号：JP2010258173A
公开(公告)日：2010-11-11
申请号：JP2009105758
申请日：2009-04-24
申请人： Panasonic Corp , パナソニック株式会社
发明人： OHASHI NAOMICHI , KISHI ARATA , YAMAGUCHI ATSUSHI , UKO MASATO , TOKII SEIJI
IPC分类号： H05K3/34 , H01L23/12
CPC分类号： H01L24/81 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a mounting method with which heating processes can be decreased, quality of electric bonding can be stably maintained, and necessary strength can be obtained. SOLUTION: A semiconductor package component (3) is mounted on a substrate (1) such that the electrode (2) of the substrate (1) and the electrode of the semiconductor package component (3) abut on each other with a bonding metal (4) therebetween. A reinforcing adhesive (5a) is applied between the substrate (1) and the outer surface of the semiconductor package component (3), reflow is performed such that the bonding metal (4) is melted, and while the bonding metal (4) is solidified, the reinforcing adhesive (5a) is cured. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供可以降低加热过程的安装方法，可以稳定地保持电接合的质量，并且可以获得必要的强度。解决方案：半导体封装部件（3）安装在基板（1）上，使得基板（1）的电极（2）和半导体封装部件（3）的电极彼此邻接在其间粘合金属（4）。在基板（1）和半导体封装件（3）的外表面之间施加增强粘合剂（5a），使接合金属（4）熔化，并且当接合金属（4）为固化，增强粘合剂（5a）固化。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2010258172A Method for mounting semiconductor package component, and structure having semiconductor package component mounted therein 有权
标题翻译：半导体封装元件安装方法及其半导体封装元件安装结构
公开(公告)号：JP2010258172A
公开(公告)日：2010-11-11
申请号：JP2009105757
申请日：2009-04-24
申请人： Panasonic Corp , パナソニック株式会社
发明人： YAMAGUCHI ATSUSHI , KISHI ARATA , OHASHI NAOMICHI , TOKII SEIJI , UKO MASATO
IPC分类号： H01L21/60
CPC分类号： H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83951 , H01L2224/92125 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a mounting method capable of reducing a heating step, stably maintaining the quality of electric joining, and obtaining required strength. SOLUTION: In a method for mounting a semiconductor package component, a first adhesive (5) for reinforcing is applied in a predetermined position (6) where the semiconductor package component (3) in a board (1) is to be mounted, the semiconductor package component (3) is mounted on the board (1) such that each electrode (2) of the board (1) and each electrode of the semiconductor package component (3) are brought into contact via a bonding metal (4) in a solidified state, a second adhesive (5a) for reinforcing is applied between a circumferential section (6) of an area where the semiconductor package component (3) of the board (1) has been mounted and the outer surface of the semiconductor package component (3), reflow is subsequently performed so that the bonding metal (4) is melted, and the first and second adhesives (5, 5a) for reinforcing are hardened while the bonding metal (4) solidifies. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够减少加热步骤，稳定地保持电接合质量并获得所需强度的安装方法。解决方案：在用于安装半导体封装部件的方法中，将用于加强的第一粘合剂（5）施加在预定位置（6）中，其中要安装板（1）中的半导体封装部件（3）半导体封装件（3）安装在板（1）上，使得板（1）的每个电极（2）和半导体封装件（3）的每个电极通过接合金属（4）接触），在用于加强的第二粘合剂（5a）被施加在已经安装了板（1）的半导体封装部件（3）的区域的周向部分（6）和半导体的外表面之间随后进行回流焊接，从而使接合金属（4）熔化，并且用于增强的第一和第二粘合剂（5,5a）在粘合金属（4）固化时硬化。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2011177652A Paste coating apparatus 审中-公开
标题翻译：涂料涂料
公开(公告)号：JP2011177652A
公开(公告)日：2011-09-15
申请号：JP2010044428
申请日：2010-03-01
申请人： Panasonic Corp , パナソニック株式会社
发明人： TOKII SEIJI , UKO MASATO , ENDO HIROYA , KOZUKI KATSUHIKO
IPC分类号： B05C5/00 , B05C11/00
摘要： PROBLEM TO BE SOLVED: To provide a paste coating apparatus capable of highly accurate paste coating while also corresponding to the tolerance of mounting accuracy and a component shape of an electronic component.
SOLUTION: The paste coating apparatus 1 includes a nozzle 4 for discharging a paste astride on both a substrate 2 and an electronic component 3 mounted on the substrate 2. The paste coating apparatus 1 is equipped with a camera (imaging tool) 7 as a position recognition tool to recognize the positional relation between the substrate 2 and the electronic component 3, and a nozzle controller 8 for controlling the nozzle 4 so as to coat and form the paste on a paste pattern with a desired shape based on the positional relationship between the substrate 2 and the electronic component 3.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够高度精确地进行糊涂的膏涂装置，同时也对应于电子部件的安装精度和部件形状的公差。糊剂涂布装置1包括用于在基板2和安装在基板2上的电子部件3两者上跨越排出浆料的喷嘴4.糊剂涂布装置1配备有相机（成像工具）7 作为用于识别基板2和电子部件3之间的位置关系的位置识别工具以及用于控制喷嘴4的喷嘴控制器8，以便以基于位置的所需形状将浆料涂布并形成具有所需形状的浆料图案基板2和电子部件3之间的关系。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2009218435A Printed circuit board, and mounting structure for surface mounted device 有权
标题翻译：印刷电路板和表面安装器件的安装结构
公开(公告)号：JP2009218435A
公开(公告)日：2009-09-24
申请号：JP2008061638
申请日：2008-03-11
申请人： Panasonic Corp , パナソニック株式会社
发明人： UKO MASATO , TOKII SEIJI
IPC分类号： H05K3/34 , H05K1/18
CPC分类号： H05K3/3436 , H01R12/523 , H05K1/113 , H05K2201/09381 , H05K2201/09436 , H05K2201/09509 , H05K2201/09572 , Y02P70/613 , Y10T29/49213
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board capable of sufficiently securing connection strength and connection reliability when mounting a surface mounted device, and to provide a mounting structure of the surface mounted device using the printed circuit board. SOLUTION: A BGA package 3 as a surface mounted device has a plurality of solder balls 3a arranged in alignment and the printed circuit board 2 has a plurality of mounting pads 4 respectively corresponding to the plurality of solder balls 3a. The BGA package 3 is mounted on the printed circuit board 2 when being joined to the mounting pads 4 on the printed circuit board 2 due to melting of the solder balls 3. A recessed via hole 10 is formed in each mounting pad 4 having a circular surface shape and a part of the solder ball 3a is get into the recessed via hole 10. Wherein, a center position of the recessed via hole 10 is separated from the center O of the mounting pad 4 by a diameter dimension and more of the recessed via hole 10. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在安装表面安装装置时能够充分确保连接强度和连接可靠性的印刷电路板，并且提供使用印刷电路板的表面安装装置的安装结构。解决方案：作为表面安装器件的BGA封装3具有排列成对准的多个焊球3a，并且印刷电路板2具有分别对应于多个焊球3a的多个安装焊盘4。 BGA封装3由于焊锡球3的熔化而被接合到印刷电路板2上的安装焊盘4而安装在印刷电路板2上。在每个安装焊盘4中形成有凹形的通孔10，表面形状和焊球3a的一部分进入凹入的通孔10.其中凹入的通孔10的中心位置与安装焊盘4的中心O分开直径尺寸，并且更多的凹陷通孔10.版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2011119352A Reflow soldering device and reflow soldering system using the same 审中-公开
标题翻译：使用其反射焊接装置和反射焊接系统
公开(公告)号：JP2011119352A
公开(公告)日：2011-06-16
申请号：JP2009273768
申请日：2009-12-01
申请人： Panasonic Corp , パナソニック株式会社
发明人： TOKII SEIJI , UKO MASATO
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a reflow soldering device reducing power consumption and the size and mixedly producing plural kinds of printed boards.
SOLUTION: The reflow soldering device 1 includes a conveyor 6 for conveying the printed board 3, and first and second preheating heaters 8 and 9, vertically mounted movably to a conveying part for the conveyor 6 to preheat the printed board 3, and the reflow soldering device 1 further includes a reflow-heating heater 10 mounted on the reverse side to the carry-in side of the printed board 3 for the second preheating heater 9 and vertically installed movably to the conveying section for the conveyor 6 for reflow-heating the printed board 3.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种降低功耗和尺寸并且混合制造多种印刷板的回流焊接装置。回流焊接装置1包括用于输送印刷电路板3的输送机6和可移动地垂直安装到输送机6的输送部分以预热印刷板3的第一和第二预热加热器8和9，以及回流焊接装置1还包括安装在用于第二预热加热器9的印刷电路板3的背面的反面上的回流加热器10，并且可移动地垂直地安装到用于回流焊接的输送机6的输送部分，加热印刷板3.版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2010212655A Electronic device and method of manufacturing the same 有权
标题翻译：电子设备及其制造方法
公开(公告)号：JP2010212655A
公开(公告)日：2010-09-24
申请号：JP2009246696
申请日：2009-10-27
申请人： Panasonic Corp , パナソニック株式会社
发明人： KISHI ARATA , OHASHI NAOMICHI , YAMAGUCHI ATSUSHI , TOKII SEIJI , UKO MASATO
IPC分类号： H05K3/34 , H05K3/36
CPC分类号： H05K3/3489 , B23K1/0016 , B23K1/203 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/73104 , H01L2224/812 , H01L2224/81801 , H01L2224/83191 , H01L2224/83192 , H01L2224/92125 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/19043 , H01L2924/351 , H05K3/305 , H05K3/3436 , H05K3/3442 , H05K2201/10515 , H05K2201/10636 , H05K2201/10977 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： PROBLEM TO BE SOLVED: To improve bonding reliability of an electronic device as a stack structure of circuit assemblies which are electrically connected to each other through solder bumps.
SOLUTION: A method of manufacturing the electronic device includes the steps of: setting a solder material on electrodes of a first circuit assembly; setting a resin having a flux action on one surface of a second circuit assembly so as to entirely cover solder bumps formed on one surface of the second circuit assembly; setting the second circuit assembly on the first circuit assembly via the resin so that the solder material set on the electrodes of the first circuit assembly and the solder bumps of the second circuit assembly are put into contact with each other; and applying thermal energy to connecting portions between the solder material and the solder bumps and to the resin. By carrying out these processes, the electronic device in which the first circuit assembly and the second circuit assembly are joined together and in which their junction portions are sealed by the resin is manufactured. As a result, in the electronic device, bonding reliability can be improved.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提高作为通过焊料凸块彼此电连接的电路组件的堆叠结构的电子设备的接合可靠性。解决方案：一种制造电子器件的方法包括以下步骤：将焊料材料设置在第一电路组件的电极上; 将在第二电路组件的一个表面上具有磁通作用的树脂设置成完全覆盖形成在第二电路组件的一个表面上的焊料凸块; 通过树脂将第二电路组件设置在第一电路组件上，使得设置在第一电路组件的电极上的焊料材料和第二电路组件的焊料凸块彼此接触; 并且将热能施加到焊料材料和焊料凸块之间的连接部分和树脂上。通过进行这些处理，制造其中第一电路组件和第二电路组件接合在一起并且其接合部分被树脂密封的电子设备。结果，在电子设备中，可以提高接合可靠性。版权所有（C）2010，JPO＆INPIT

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