专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2013147755A Surface-treated electrolytic copper foil and copper clad laminated sheet obtained by using the surface-treated copper foil 有权
标题翻译：表面处理电解铜箔和铜箔层压板采用表面处理铜箔
公开(公告)号：JP2013147755A
公开(公告)日：2013-08-01
申请号：JP2013091303
申请日：2013-04-24
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： DOBASHI MAKOTO , MATSUDA MITSUYOSHI , TOMONAGA SAKIKO , SAKAI HISAO , SAKATA TOMOHIRO , YOSHIOKA ATSUSHI , NISHIKAWA SUSUMU , TAGUCHI TAKEO
IPC分类号： C25D1/04 , H05K1/09 , H05K3/38
CPC分类号： H05K3/384 , C25D1/04 , C25D3/38 , C25D5/16 , C25D5/18 , C25D5/48 , C25D7/06 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , H05K2203/1476 , Y10T428/12438 , Y10T428/12451 , Y10T428/12472 , Y10T428/12882 , Y10T428/12903 , Y10T428/12993 , Y10T428/24355 , Y10T428/24917
摘要： PROBLEM TO BE SOLVED: To provide a surface-treated electrolytic copper foil, which has a low profile at a level equal to that of a conventional low-profile surface-treated electrolytic copper foil, and which has small undulation affecting the straight line performance of wiring.SOLUTION: A surface-treated electrolytic copper foil is obtained by applying at least one or more of a rust preventive treatment and a silane coupling agent treatment onto a surface of an electrolytic copper foil. The bonding surface to be bonded with an insulation layer-constituting material of the surface-treated electrolytic copper foil is obtained by using the surface of the electrolytic copper foil having a surface roughness (Rzjis) of 0.1 to 1.0 μm and a glossiness [Gs (60°)] of 400 or more. The maximum difference in height of unevenness (PV) of the bonding surface is 0.05 to 1.5 μm.
摘要翻译：要解决的问题：提供一种表面处理电解铜箔，其具有与常规低轮廓表面处理电解铜箔相同水平的低轮廓，并且具有较小的起伏影响直线性能布线。解决方案：通过在电解铜箔的表面上施加防锈处理和硅烷偶联剂处理中的至少一种来进行表面处理的电解铜箔。通过使用表面粗糙度（Rzjis）为0.1〜1.0μm的电解铜箔表面和光泽度[Gs（...）），得到与表面处理电解铜箔的绝缘层构成材料接合的接合面， 60°）]为400以上。接合面的不均匀度（PV）的最大差异为0.05〜1.5μm。

2. 发明专利

JP2007146289A Method for manufacture of electrolytic copper foil, electrolytic copper foil manufactured by the method, surface-treated copper foil manufactured using the electrolytic copper foil, and copper-clad laminate manufactured using the electrolytic copper foil or surface-treated copper foil 审中-公开
标题翻译：电解铜箔制造方法，使用电解铜箔制造的表面处理铜箔和使用电解铜箔或表面处理铜箔制造的铜箔层压板制造的电解铜箔
公开(公告)号：JP2007146289A
公开(公告)日：2007-06-14
申请号：JP2006294778
申请日：2006-10-30
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： DOBASHI MAKOTO , MATSUDA MITSUYOSHI , TOMONAGA SAKIKO , SAKAI HISAO , SAKATA TOMOHIRO , TATSUOKA AYUMI , YOSHIOKA ATSUSHI , HATA HIROSHI , MOGI AKIRA , TAGUCHI TAKEO
IPC分类号： C25D1/04 , C25C1/12
CPC分类号： C25D3/38 , C25D1/04 , H05K1/09
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacture of an electrolytic copper foil having a lower profile compared to a conventional, commercially available low-profile electrolytic copper foil and also having excellent mechanical strength, with good efficiency.
SOLUTION: The method comprises electrolyzing a sulfate-type copper electrolyte solution containing a quaternary ammonium salt polymer having a cyclic structure and a chlorine to form the electrolytic copper foil, wherein the quaternary ammonium salt polymer to be added to the sulfate-type copper electrolyte solution is a DDAC polymer composed of two or more monomer units. Preferably, the quaternary ammonium salt polymer is a diaryldimethylammonium chloride having a number average molecular weight of 300 to 10,000. Preferably, the sulfate-type copper electrolyte solution comprises bis(3-sulfopropyl)disulfide or 3-mercapto-1-propanesulfonic acid which has a mercapto group.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造与现有的市售薄膜电解铜箔相比具有较低外形的电解铜箔的方法，并且具有优异的机械强度，效率高。解决方案：该方法包括电解含有具有环状结构和氯的季铵盐聚合物的硫酸盐型铜电解质溶液以形成电解铜箔，其中加入硫酸盐型的季铵盐聚合物铜电解质溶液是由两个或多个单体单元组成的DDAC聚合物。优选地，季铵盐聚合物是数均分子量为300〜10,000的二芳基二甲基氯化铵。优选地，硫酸盐型铜电解质溶液包含具有巯基的二（3-磺丙基）二硫化物或3-巯基-1-丙磺酸。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2005048277A Electrolytic copper foil with carrier foil, and manufacturing method therefor 审中-公开
标题翻译：具有载体箔的电解铜箔及其制造方法
公开(公告)号：JP2005048277A
公开(公告)日：2005-02-24
申请号：JP2003420277
申请日：2003-12-18
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： MATSUNAGA AKIHIRO , YOSHIOKA ATSUSHI , SUGIMOTO AKIKO
IPC分类号： B32B15/08 , C23C28/00 , C25D1/04 , C25D3/38 , C25D7/06
CPC分类号： C23C28/023 , C23C28/00 , C23C28/021
摘要： PROBLEM TO BE SOLVED: To provide an electrolytic copper foil with a carrier foil, which imparts an improved boring property with a laser of low energy to a copper-clad laminate, and contains a little amount of elements different from copper, which places few loads on the environment. SOLUTION: The peelable type of an electrolytic copper foil with the carrier foil comprises the first roughened layer 3 made of the first fine copper grains 4 formed on one side of the carrier foil 2, an organic layer 5 formed on the first roughened layer 3, a bulky copper layer 6 formed on the organic layer 5 through an electrolytic process, the second roughened layer 7 made of the second fine copper grains 8 on the bulky copper layer 6 as needed, and a surface-treated layer such as a rust-prevention layer. In the electrolytic copper foil 1 with the carrier foil, the first fine copper grains 4 constituting the first roughening treatment layer 3 in the above electrolytic copper foil are embedded in the bulky copper layer 6 together with the organic layer 5, so that when the carrier foil 2 is peeled off, all or one of the first fine copper grains 4 are also ripped and peeled while leaving the rest on the surface of the bulky copper layer 6 side in a bonding state.The manufacturing method therefor is also provided. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供具有载体箔的电解铜箔，其赋予了覆铜层压板具有低能量激光的改善的钻孔特性，并且含有少量与铜不同的元素，在环境中几乎没有负载。解决方案：具有载体箔的电解铜箔的可剥离型包括由形成在载体箔2的一侧上的第一细铜颗粒4制成的第一粗糙层3，形成在第一粗糙层上的有机层5 层3，通过电解工艺形成在有机层5上的大块铜层6，根据需要在笨重的铜层6上由第二细铜颗粒8制成的第二粗糙层7和表面处理层防锈层。在具有载体箔的电解铜箔1中，构成上述电解铜箔中的第一粗糙化处理层3的第一细微细铜颗粒4与有机层5一起嵌入到大体积铜层6中，箔2被剥离，所有或一个第一细铜颗粒4也被剥离和剥离，同时将其余部分保持在大块铜层6侧的表面上，处于粘合状态。其制造方法也被提供。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2009299100A Electrolytic copper foil and method for manufacturing electrolytic copper foil 有权
标题翻译：电解铜箔及制造电解铜箔的方法
公开(公告)号：JP2009299100A
公开(公告)日：2009-12-24
申请号：JP2008151957
申请日：2008-06-10
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： TOMONAGA SAKIKO , YOSHIOKA ATSUSHI , NAKAJIMA DAISUKE , DOBASHI MAKOTO , TAZAKI YOSHIAKI , TAKAHASHI HIROKI , TAHIRA YASUKI
IPC分类号： C25D1/04 , C25D1/00 , H05K1/09
摘要： PROBLEM TO BE SOLVED: To supply an electrolytic copper foil provided with bending performance as same as a rolled copper foil. SOLUTION: In the electrolytic copper foil obtained by electrolyzing a copper electrolytic solution to attain the bending performance, the electrolytic copper foil adopts an electrolytic copper foil containing 25-110 ppm sulfur, 50-200 ppm chlorine, and 70-150 ppm carbon. In the electrolytic copper foil, the ratio (B/A) of the twin density B after heated at 380°C for 30 min to the normal twin density A measured by an EBSD (Electron Back Scatter Diffraction Patterns) method is ≥0.7. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供具有与卷绕的铜箔相同的弯曲性能的电解铜箔。解决方案：在通过电解铜电解液获得弯曲性能的电解铜箔中，电解铜箔采用含有25-110ppm硫，50-200ppm氯和70-150ppm的电解铜箔碳。在电解铜箔中，通过EBSD（Electron Back Scatter Diffraction Patterns）法测定的在380℃30分钟加热到正常双密度A之后的双重密度B的比（B / A）≥0.7。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2004169083A Resistance copper layer, multilayered material having resistance copper layer, and method for manufacturing insulation substrate having resistance copper layer 审中-公开
标题翻译：电阻铜层，具有电阻铜层的多层材料，以及制造具有电阻铜层的绝缘基板的方法
公开(公告)号：JP2004169083A
公开(公告)日：2004-06-17
申请号：JP2002334749
申请日：2002-11-19
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： YOSHIOKA ATSUSHI , SUGIMOTO AKIKO
IPC分类号： C25D3/38 , C25D7/06 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a resistor layer which is easily manufactured, capable of easily adjusting the resistivity, and is easily etched.
SOLUTION: The method for manufacturing the resistance copper layer suitable for the production of a printed circuit board includes carrying out an electroplating operation in an electrolytic solution for copper plating while making 10 g/L or more of glue or 20 g/L or more of gelatin exist therein. The method for manufacturing the multilayered material having the resistance copper layer suitable for the production of the printed circuit board comprises forming a peeling layer on the surface of an electroconductive support, and forming the resistance copper layer as described above on the peeling layer. The method for manufacturing the insulation substrate having the resistance copper layer suitable for the production of the printed circuit board comprises laminating the multilayered material having the resistance copper layer manufactured as described above onto the insulation substrate so that the resistance copper layer can come in contact with the insulation substrate; peeling the electroconductive support from the multilayered material having the resistance copper layer to expose the resistance copper layer; and subsequently cleaning and removing the peeling layer remaining on the surface of the resistance copper layer.
COPYRIGHT: (C)2004,JPO
摘要翻译：解决的问题：提供一种易于制造的电阻层的制造方法，能够容易地调节电阻率，并且易于蚀刻。解决方案：适用于生产印刷电路板的电阻铜层的制造方法包括在电解电解液中进行电镀操作，同时制成10g / L或更多的胶或20g / L 或更多的明胶。制造具有适用于制造印刷电路板的电阻铜层的多层材料的方法包括在导电载体的表面上形成剥离层，并在剥离层上形成如上所述的电阻铜层。制造具有适用于生产印刷电路板的电阻铜层的绝缘基板的方法包括将具有如上所述制造的具有电阻铜层的多层材料层压到绝缘基板上，使得电阻铜层可以与绝缘基板; 从具有电阻铜层的多层材料剥离导电载体以暴露电阻铜层; 并且随后清洗和去除残留在电阻铜层表面上的剥离层。版权所有（C）2004，JPO

6. 发明专利

JP2013019056A Surface treated electrolytic copper foil and copper clad laminate obtained by using the same 有权
标题翻译：表面处理电解铜箔和使用它的铜箔层压板
公开(公告)号：JP2013019056A
公开(公告)日：2013-01-31
申请号：JP2012231519
申请日：2012-10-19
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： DOBASHI MAKOTO , MATSUDA MITSUYOSHI , TOMONAGA SAKIKO , SAKAI HISAO , SAKATA TOMOHIRO , YOSHIOKA ATSUSHI , NISHIKAWA SUSUMU , TAGUCHI TAKEO
IPC分类号： C25D1/04 , C25D7/06 , H05K1/09
CPC分类号： H05K3/384 , C25D1/04 , C25D3/38 , C25D5/16 , C25D5/18 , C25D5/48 , C25D7/06 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , H05K2203/1476 , Y10T428/12438 , Y10T428/12451 , Y10T428/12472 , Y10T428/12882 , Y10T428/12903 , Y10T428/12993 , Y10T428/24355 , Y10T428/24917
摘要： PROBLEM TO BE SOLVED: To provide a surface treated electrolytic copper foil which has a low profile on an equal or higher level as compared with a low-profile surface treated electrolytic copper foil which has been supplied on the conventional market and is small in waviness which affects the linearity of wiring, and to provide a process for producing the surface treated electrolytic copper foil.SOLUTION: In the surface treated electrolytic copper foil, on the face of adhesion to an insulating layer constituent material, the maximum level difference of elevation of waviness (Wmax) is 0.05 μm to 0.7 μm, the maximum difference of elevation of irregularities (PV) is 0.05 to 1.5 μm, and the surface roughness (Rzjis) is 0.1 μm to 1.0 μm. The electrolytic copper foil used in the production of the surface treated electrolytic copper foil is produced by electrolysis under electrolytic conditions of current density on at least two different levels from continuous first step electrolysis to nth step electrolysis, using a sulfuric acid-based copper electrolysis solution, prepared by adding 3-mercapto-1-propanesulfonic acid or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine, and by using a cathode having a small surface roughness.
摘要翻译：要解决的问题：提供一种表面处理电解铜箔，其具有与常规市场上提供的低轮廓表面处理电解铜箔相同或更高的等级或更高的表面处理电解铜箔，并且尺寸小影响布线线性的波纹度，提供一种表面处理电解铜箔的制造方法。解决方案：在表面处理的电解铜箔中，在与绝缘层构成材料的粘合力的表面上，波纹高度的最大水平差（Wmax）为0.05μm至0.7μm，最大的不规则度的差异（PV）为0.05〜1.5μm，表面粗糙度（Rzjis）为0.1μm〜1.0μm。用于生产表面处理电解铜箔的电解铜箔通过电解密度在电解条件下通过电解在连续的第一阶段电解至第n阶段电解的至少两个不同的水平上使用硫酸基铜电解溶液通过添加3-巯基-1-丙磺酸或双（3-磺丙基）二硫化物，具有环状结构的季铵盐聚合物和氯制备，并且通过使用具有小表面粗糙度的阴极。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2005307270A Carrier foil-fitted electrolytic copper foil and method for producing the carrier foil-fitted electrolytic copper foil 审中-公开
标题翻译：载体电极电解铜箔及其生产载体电极电解铜箔的方法
公开(公告)号：JP2005307270A
公开(公告)日：2005-11-04
申请号：JP2004125587
申请日：2004-04-21
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： YOSHIOKA ATSUSHI , SUGIOKA AKIKO
IPC分类号： B32B15/01 , C25D1/04 , C25D1/20
摘要： PROBLEM TO BE SOLVED: To provide an more inexpensive product as peelable type carrier foil-fitted electrolytic copper foil. SOLUTION: Regarding the carrier foil-fitted electrolytic copper foil in which the surface of carrier foil is provided with a circuit formation layer, either the circuit formation layer or carrier foil is an organic agent-containing precipitated copper layer formed by electrolysis, also, the precipitated crystals in the precipitated copper layer have a fine and continuous crystal shape and are columnar, and the other is a pure copper layer having a purity of ≥99.9 wt.%. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供更便宜的产品作为可剥离型载体箔安装电解铜箔。解决方案：对于其中载体箔的表面设置有电路形成层的载体箔安装电解铜箔，电路形成层或载体箔是通过电解形成的含有机试剂的沉淀铜层，析出的铜层中析出的结晶也具有微细且连续的晶体形状，是柱状的，另一种是纯度为≥99.9重量％的纯铜层。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2005072290A Copper foil for printed wiring board, method for manufacturing the same, and copper clad laminate using the same 审中-公开
标题翻译：用于印刷布线板的铜箔，其制造方法和使用其的铜箔层压板
公开(公告)号：JP2005072290A
公开(公告)日：2005-03-17
申请号：JP2003300680
申请日：2003-08-26
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： YOSHIOKA ATSUSHI , SUGIMOTO AKIKO , DOBASHI MAKOTO
IPC分类号： H05K1/09 , C25D3/38 , C25D7/00 , C25D7/06
摘要： PROBLEM TO BE SOLVED: To provide a copper foil capable of high speed etching and having excellent laser drilling.
SOLUTION: The electrolytic copper foil for the printed wiring board having a carbon content obtained by electrolyzing an electrolyte containing an organic agent in high concentration, is high carbon contained copper in which the organic agent disperses in grains of the deposition crystal of the electrolytic copper foil.
COPYRIGHT: (C)2005,JPO&NCIPI

9. 发明专利

JP2003328178A Method of producing high temperature heat resistant electrolytic copper foil with carrier foil and high temperature heat resistant electrolytic copper foil with carrier foil obtained by the production method 有权
标题翻译：生产高温耐热电解铜箔的方法与生产方法制作的带载体箔的高温耐热电解铜箔
公开(公告)号：JP2003328178A
公开(公告)日：2003-11-19
申请号：JP2002138881
申请日：2002-05-14
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： TAKANASHI TETSUAKI , IWAKIRI KENICHIRO , SUGIMOTO AKIKO , YOSHIOKA ATSUSHI , OBATA SHINICHI , DOBASHI MAKOTO
IPC分类号： C25D1/20 , B32B15/08 , C25D1/04 , C25D7/06 , H05K3/02
CPC分类号： B32B15/08 , C25D1/04 , C25D7/0614 , H05K3/025 , Y10T428/12438 , Y10T428/12556 , Y10T428/12569 , Y10T428/12903 , Y10T428/1291 , Y10T428/31678
摘要： PROBLEM TO BE SOLVED: To provide a method of producing high temperature heat resistant electrolytic copper foil with carrier foil by which the carrier foil can easily be peeled even when press working is performed at ≥200°C. SOLUTION: An organic joint boundary face layer is formed on the surface of carrier foil by using an organic agent. An electrolytic copper foil layer is then formed on the organic joint boundary face layer. In the production method, the organic joint boundary face is formed on the surface of the carrier foil as a pickling adsorption organic film in such a manner that, while the surface of the carrier foil is pickled and dissolved with a pickling solution containing a 50 to 2,000 ppm organic agent used for the formation of the joint boundary face layer, the organic agent is simultaneously allowed to be adsorbed thereon. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种制造具有载体箔的耐高温电解铜箔的方法，即使在≥200℃下进行压制加工时，载体箔也容易剥离。解决方案：通过使用有机试剂在载体箔的表面上形成有机接合界面层。然后在有机接合界面层上形成电解铜箔层。在制造方法中，作为酸洗吸附有机膜，在载体箔的表面上形成有机接合界面，使得当载体箔的表面酸洗和溶解时，用含有50〜用于形成接合界面层的2,000ppm有机试剂，同时使有机试剂吸附在其上。版权所有（C）2004，JPO

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式