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1. 发明专利

JP2012136726A Cu-Ni-Si BASED COPPER ALLOY SHEET EXCELLENT IN FATIGUE RESISTANCE AND SPRING PROPERTY AFTER BENDING WORKING, AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：铜镍硅基铜合金板在弯曲加工后耐疲劳性能和弹性好，及其制造方法
公开(公告)号：JP2012136726A
公开(公告)日：2012-07-19
申请号：JP2010288486
申请日：2010-12-24
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , ABE YOSHIO , SAITO AKIRA , KAMEYAMA YOSHIHIRO
IPC分类号： C22C9/06 , C22C9/04 , C22F1/00 , C22F1/08 , H01B1/02 , H01B5/02 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To provide a Cu-Ni-Si based copper alloy sheet which has excellent fatigue resistance and a spring property even if used at high temperature and high oscillation environment for a long time after bending working of a prescribed shape as a raw material as a relay movable piece, a socket terminal or the like of various electric parts.SOLUTION: The Cu-Ni-Si based copper alloy sheet includes 1.0-3.0 mass% of Ni; 1/6-1/4 concentration of Si based on Ni, and a rest consisting of Cu and inevitable impurities, wherein orientations of all pixel in a measured area of a surface are measured at 0.5 μm of a step size by an EBSD method, an area ratio of a crystal grain in which an average orientation difference among the all pixel in the crystal grain is less than 4° when a border in which an orientation difference between abutting pixel is at least 5° is made a crystal grain boundary is 45-55% of a measured area, an area average GAM of a crystal grain existing in an area to be measured is 0.8-1.6°, a number of a Ni-Si precipitated object particle in which a particle diameter exceeds 100 nm is 0.2-0.7 piece/μm, and a concentration of Si solid solved in a crystal grain is 0.1-0.4 mass%.
摘要翻译：要解决的问题：为了提供即使在规定形状的弯曲加工之后长时间在高温高振荡环境下使用的具有优异的耐疲劳性和弹性的Cu-Ni-Si基铜合金板作为各种电气部件的继电器可动件，插座端子等的原材料。解决方案：Cu-Ni-Si系铜合金板包含1.0-3.0质量％的Ni; 1 / 6-1 / 4的Si浓度，其余由Cu和不可避免的杂质组成，其中通过EBSD法测量表面的测量面积中所有像素的取向为0.5μm的步长，晶界的全部像素之间的平均取向差在邻接像素的取向差为5度以上的边界为小于4°的晶粒的面积比为45时，晶界为45 测定面积的-55％，待测区域中存在的晶粒的面积平均GAM为0.8〜1.6度，粒径超过100nm的Ni-Si析出物粒子数为0.2〜 0.7片/μm 2 ，溶解在晶粒中的Si固体的浓度为0.1-0.4质量％。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2012007231A Cu-Mg-P-BASED COPPER ALLOY BAR MATERIAL AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：基于Cu-Mg-P的铜合金棒材及其制造方法
公开(公告)号：JP2012007231A
公开(公告)日：2012-01-12
申请号：JP2010146895
申请日：2010-06-28
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , KAMEYAMA YOSHIHIRO , ABE YOSHIO
IPC分类号： C22C9/00 , C22F1/00 , C22F1/08 , H01B1/02 , H01B5/02 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To balance tensile strength, a spring deflection limit, and fatigue characteristics under completely reversed plane bending at high levels.SOLUTION: A copper alloy bar material includes a composition including, in mass%, 0.3-2% Mg, 0.001-0.1% P and the balance with Cu and unavoidable impurities. When orientations of all pixels in an area to be measured of the surface of the copper-alloy bar material are measured by an EBSD method using a scanning electron microscope provided with a backscatter electron diffraction image system with a step size of 0.5 μm, and a boundary having an orientation difference of 5° or more between adjacent pixels is defined as a crystal grain boundary, the area ratio of crystal grains having an average orientation difference of less than 4° between all the pixels in the crystal grains is 45-55% of the measured area, the area average GAM of crystal grains present in the measured area is 2.2-3.0°, the tensile strength is 641-708 N/mm, the spring deflection limit is 472-503 N/mm, and the fatigue limit under completely reversed plane bending in the number of repetitions of 1×10is 300-350 N/mm.
摘要翻译：要解决的问题：在高水平的完全反转平面弯曲下平衡拉伸强度，弹簧偏转极限和疲劳特性。解决方案：铜合金棒材料包括以质量％计含有0.3-2％Mg，0.001-0.1％P，余量为Cu和不可避免的杂质的组合物。当使用具有步长为0.5μm的后向散射电子衍射图像系统的扫描型电子显微镜的EBSD法测定铜合金棒材的表面的被测定区域中的所有像素的取向时，将相邻像素之间的取向差为5°以上的边界定义为晶体晶界，晶粒中所有像素之间的平均取向差小于4°的晶粒的面积比为45〜55％测量面积中存在的晶粒的面积平均GAM为2.2-3.0°，拉伸强度为641-708N / mm 2 ，弹簧偏转极限为472-503 N / mm 2 ，并且在完全反向平面弯曲下的疲劳极限重复次数为1×10 6 < / SP>为300-350 N / mm 2 。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2011132564A Cu-Mg-P-BASED COPPER-ALLOY MATERIAL AND METHOD OF PRODUCING THE SAME 有权
标题翻译： Cu-Mg-P系铜合金材料及其制造方法
公开(公告)号：JP2011132564A
公开(公告)日：2011-07-07
申请号：JP2009291542
申请日：2009-12-23
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , KAMEYAMA YOSHIHIRO , ABE YOSHIO
IPC分类号： C22C9/00 , C22F1/00 , C22F1/08 , H01B1/02 , H01B5/02
CPC分类号： C22C9/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a Cu-Mg-P-based copper alloy which has well-balanced and high levels of tensile strength and a spring deflection limit and to provide a method for manufacturing the same. SOLUTION: The copper-alloy material has a composition including, by mass%, 0.3-2% Mg, 0.001-0.1% P and the balance Cu with unavoidable impurities. When orientations of all pixels in an area to be measured of the surface of the copper-alloy strip material are measured with an EBSD method by a scanning electron microscope provided with a backscatter electron diffraction image system, and a boundary having an orientation difference of 5° or more between adjacent pixels is defined as a crystal grain boundary, an area ratio of crystal grains having an average orientation difference of less than 4° between all the pixels in the crystal grains is 45-55% of the measured area. The tensile strength is 641-708 N/mm 2 , and the spring deflection limit is 472-503 N/mm 2 . COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供具有良好平衡和高水平的拉伸强度和弹簧偏转极限的Cu-Mg-P系铜合金，并提供其制造方法。解决方案：铜合金材料具有以质量％计含有0.3-2％Mg，0.001-0.1％P和余量为不可避免的杂质的组成。当使用具有背散射电子衍射图像系统的扫描型电子显微镜，通过EBSD法测定铜合金带材的表面的被测定区域中的所有像素的取向，取向差为5的边界将相邻像素之间的角度定义为晶体晶界，晶粒中所有像素之间的平均取向差小于4°的晶粒的面积比为测量面积的45-55％。拉伸强度为641-708N / mm 2 ，弹簧偏转极限为472-503N / mm 2 。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2013040393A Cu-Ni-Si-BASED COPPER ALLOY EXCELLENT IN PROJECTION WELDING PROPERTY, AND METHOD FOR PRODUCING THE SAME 审中-公开
标题翻译：投影焊接性能优良的Cu-Ni-Si系铜合金及其制造方法
公开(公告)号：JP2013040393A
公开(公告)日：2013-02-28
申请号：JP2011179224
申请日：2011-08-18
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , ABE YOSHIO , SAITO AKIRA , KAMEYAMA YOSHIHIRO
IPC分类号： C22C9/06 , C22C9/10 , C22F1/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a Cu-Ni-Si-based copper alloy excellent in projection welding property that is used for a circuit board and the like installed inside a drive circuit and a motor unit that are mounted to a vehicle, and to provide a method for producing the same.SOLUTION: The Cu-Ni-Si-based copper alloy has a composition that includes, by weight, 1.0-4.0% Ni, 0.1-1.0% Si, 0.3-0.7% Zn, 0.4-0.8% Sn and the balance Cu and inevitable impurities, wherein an average value of grain orientation spread (GOS) measured by the electron backscatter diffraction (EBSD) method in the crystalline structure is 2.5°-5.0°, based on the whole crystal grain, and a ratio (Lσ/L) of the whole special grain boundary length Lσ of a special grain boundary to the whole grain boundary length L of the crystal grain boundary measured by the EBSD method is 15-30%.
摘要翻译：要解决的问题：提供一种用于安装在驱动电路内的电路板等的投影焊接性优异的Cu-Ni-Si系铜合金和安装在车辆上的电机单元并提供其制造方法。解决方案：Cu-Ni-Si系铜合金的重量比为1.0-4.0％Ni，0.1-1.0％Si，0.3-0.7％Zn，0.4-0.8％Sn，余量 Cu和不可避免的杂质，其中通过电子反向散射衍射（EBSD）法在晶体结构中测量的晶粒取向扩散（GOS）的平均值基于整个晶粒为2.5°-5.0°，并且比率（Lσ/ 特殊晶界的全部特殊晶界长度Lσ与EBSD法测得的晶界边界长度L的比值为15-30％。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2011246772A Cu-Fe-P BASED COPPER ALLOY SHEET EXCELLENT IN CONDUCTIVITY AND HEAT RESISTANCE, AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译： Cu-Fe-P系铜合金板，其电导率和耐热性优良，其制造方法
公开(公告)号：JP2011246772A
公开(公告)日：2011-12-08
申请号：JP2010121906
申请日：2010-05-27
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , SUKUMODA SHUNROKU , KAMEYAMA YOSHIHIRO
IPC分类号： C22C9/04 , C22C9/00 , C22C9/06 , C22F1/00 , C22F1/08 , H01B1/02 , H01B13/00 , H01L23/48
摘要： PROBLEM TO BE SOLVED: To provide a Cu-Fe-P based copper alloy sheet which is suitable as a material of a lead frame for a semiconductor device, has good balance between conductivity and heat resistance, and has conductivity of not less than 90% IACS, and Vickers hardness of not less than 100 after being heated at 400°C for one hour.SOLUTION: The Cu-Fe-P based copper alloy sheet has a composition including 0.05 to 0.15 wt.% Fe, 0.015 to 0.050 wt.% P, 0.01 to 0.20 wt.% Zn, respectively, with the balance Cu and inevitable impurities. The value obtained by averaging grain orientation spreads measured by an EBSD method over the entire crystal grains in a crystal structure is 2.5 to 5.0°. The Brass orientation density measured by the EBSD method is 11.0 to 14.5%. The Copper orientation density is 13.0 to 25.5%. The conductivity is not less than 90% IACS, and the Vickers hardness after being heated at 400°C for one hour is ≥100.
摘要翻译：要解决的问题：为了提供适合作为半导体装置的引线框的材料的Cu-Fe-P系铜合金板，在导电性和耐热性之间具有良好的平衡，并且导电率不低于超过90％IACS，维氏硬度在400℃加热1小时后不小于100。解决方案：Cu-Fe-P系铜合金板具有以下成分：Fe：0.05〜0.15重量％，P：0.015〜0.050重量％，Zn：0.01〜0.20重量％不可避免的杂质。通过EBSD法测量的晶体结构中的整个晶粒的平均晶粒取向扩展获得的值为2.5〜5.0°。通过EBSD法测定的黄铜取向密度为11.0〜14.5％。铜取向密度为13.0〜25.5％。电导率不小于90％IACS，在400℃加热1小时后的维氏硬度≥100。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2011219833A Cu-Ni-Si-BASED COPPER ALLOY EXCELLENT IN PROJECTION WELDING CHARACTERISTIC AND METHOD FOR PRODUCING THE SAME 有权
标题翻译： Cu-Ni-Si基铜合金在投影焊接中的优势及其生产方法
公开(公告)号：JP2011219833A
公开(公告)日：2011-11-04
申请号：JP2010092146
申请日：2010-04-13
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , ABE YOSHIO , SAITO AKIRA , KAMEYAMA YOSHIHIRO
IPC分类号： C22C9/06 , C22C9/10 , C22F1/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a Co-Ni-Si-based copper alloy which is used in an in-vehicle drive circuit or a circuit board and the like inside a motor unit and is excellent in projection welding characteristics, and to provide a method for producing the Co-Ni-Si-based copper alloy.SOLUTION: The Co-Ni-Si-based copper alloy has the composition containing 1.0-4.0 wt.% Ni, 0.1-1.0 wt.% Si, 0.3-0.7 wt.% Zn, 0.4-0.8 wt.% Sn and the balance of Cu and inevitable impurities and has 3.0-5.0° average value of GOS (Grain Orientation Spread) in a crystal structure and is measured by an EBSD (Electron Back Scatter Diffraction) method, in all grains and 15-30% ratio (Lσ/L) (wherein Lσ is the total length of special grain boundaries in crystal grain boundaries measured by the EBSD method; L is the total length of all grain boundaries).
摘要翻译：要解决的问题：提供一种用于车载驱动电路或电路板等内部的电动机单元中的Co-Ni-Si系铜合金，并且突出焊接特性优异，以提供Co-Ni-Si系铜合金的制造方法。解决方案：Co-Ni-Si基铜合金的组成包含1.0-4.0重量％的Ni，0.1-1.0重量％的Si，0.3-0.7重量％的Zn，0.4-0.8重量％的Sn 和余量的Cu和不可避免的杂质，并且在晶体结构中具有3.0-5.0°的GOS（晶粒取向扩散）的平均值，并且通过EBSD（Electron Back Scatter Diffraction）方法测量，在所有晶粒中和15-30％的比例（Lσ/ L）（其中Lσ是通过EBSD方法测量的晶粒边界中的特殊晶界的总长度; L是所有晶界的总长度）。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2011174127A Cu-mg-p-based copper alloy bar stock and method for producing the same 有权
标题翻译： CU-MG-P系铜合金棒及其制造方法
公开(公告)号：JP2011174127A
公开(公告)日：2011-09-08
申请号：JP2010038516
申请日：2010-02-24
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , KAMEYAMA YOSHIHIRO , ABE YOSHIO
IPC分类号： C22C9/00 , C22F1/00 , C22F1/08 , H01B1/02 , H01B5/02 , H01B13/00
CPC分类号： H01B1/026 , C22C9/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a Cu-Mg-P-based copper alloy bar stock in which tensile strength, a spring elastic limit and a stress relaxation rate when used at a high temperature for a long time are well-balanced at high levels, and a method for producing the same.
SOLUTION: The copper alloy bar stock has composition containing, by mass, 0.3 to 2% Mg and 0.001 to 0.1% P, and the balance Cu with inevitable impurities. When the orientations of all pixels in the measurement area on the surface of the copper alloy bar stock are measured by EBSD (electron backscatter diffraction) with a scanning electron microscope with a backscatter electron diffraction pattern system, and the boundary in which an orientation difference is ≥5° between the adjoining pixels is defined as a crystal grain boundary, the average value of the average orientation difference among all the pixels in the crystal grains in all the crystal grains is 3.8 to 4.2°, the tensile strength is 641 to 708 N/mm
2 , the spring elastic limit is 472 to 503 N/mm
2 , and a stress relaxation rate after heat treatment at 200°C for 1,000 hr is 12 to 19%.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供长时间在高温下使用时的拉伸强度，弹性弹性极限和应力松弛率的Cu-Mg-P系铜合金棒材，其平衡性良好在高水平上，以及其制备方法。解决方案：铜合金棒料具有质量分数为0.3〜2％的Mg和0.001〜0.1％的P，余量为Cu和不可避免的杂质。当使用具有背散射电子衍射图案系统的扫描电子显微镜通过EBSD（电子背散射衍射）测量铜合金棒材表面上的测量区域中的所有像素的取向，并且其中取向差为相邻像素之间的≥5°被定义为晶体晶界，所有晶粒中的晶粒中的所有像素之间的平均取向差的平均值为3.8〜4.2°，拉伸强度为641〜708N / mm 2 ，弹簧弹性极限为472〜503N / mm 2 ，200℃下热处理1000小时后的应力松弛率为12〜19 ％。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2012122114A Cu-Ni-Si-BASED COPPER ALLOY SHEET HAVING EXCELLENT DEEP DRAWABILITY AND FATIGUE RESISTANCE, AND METHOD FOR PRODUCING THE SAME 有权
标题翻译：具有优异的耐久性和耐疲劳性的Cu-Ni-Si基铜合金板及其制造方法
公开(公告)号：JP2012122114A
公开(公告)日：2012-06-28
申请号：JP2010275536
申请日：2010-12-10
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , ABE YOSHIO , SAITO AKIRA , KAMEYAMA YOSHIHIRO
IPC分类号： C22C9/06 , C22C9/04 , C22F1/00 , C22F1/08 , C23G1/10 , H01B1/02
摘要： PROBLEM TO BE SOLVED: To provide a Cu-Ni-Si-based copper alloy sheet having excellent deep drawability and fatigue resistance capable of use under high temperature and high vibration environment over a long period of time in a predetermined shape as a material of various electronic parts.SOLUTION: The Cu-Ni-Si-based copper alloy sheet contains 1.0-3.0 mass% of Ni, wherein the concentration of Si is 1/6 to 1/4 of that of Ni mass%, and the remainder includes Cu and inevitable impurities. The Cu-Ni-Si-based copper alloy sheet has Goss orientation density, which is measured by EBSD method using a scanning electron microscope with an electron backscatter diffraction pattern system, of 2.0-6.0%, an average value of KAM (kernel average misorientation) of 0.9-1.5°, and a ratio (Lσ/L) of the total special grain boundary length Lσ of special grain boundaries to the total grain boundary length L of crystal grain boundaries of 60-70%.
摘要翻译：解决问题：提供具有优异的深冲性和耐疲劳性的Cu-Ni-Si系铜合金板，其能够在高温高振动环境下长时间以预定形状使用，作为各种电子零件的材料。解决方案：Cu-Ni-Si系铜合金板含有1.0-3.0质量％的Ni，其中Si的浓度为Ni质量％的1/6至1/4，其余为Cu 和不可避免的杂质。 Cu-Ni-Si系铜合金板具有Goss取向密度，其通过EBSD法使用具有电子背散射衍射图谱系统的扫描电子显微镜测定为2.0-6.0％，平均值为KAM（芯平均取向偏差）为0.9-1.5°，特殊晶界的总特殊晶界长度Lσ与晶界边界长度L的比值（Lσ/ L）为60-70％。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2010095749A Copper alloy for electronic device and lead frame material 有权
标题翻译：铜合金电子器件和引线框架材料
公开(公告)号：JP2010095749A
公开(公告)日：2010-04-30
申请号：JP2008266684
申请日：2008-10-15
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： KIKUKAWA KAZUNORI , KUMAGAI JUNICHI , KAMEYAMA YOSHIHIRO , MIURA MASAO , ASAKURA KENTARO
IPC分类号： C22C9/00 , H01B1/02 , H01B5/02 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To provide a copper alloy for an electronic device having heat resistance with which strength is not deteriorated even in a high temperature region of 500°C.
SOLUTION: The copper alloy includes, by mass, 1.5 to 2.4% Fe, 0.008 to 0.08% P and 0.01 to 0.5% Zn, and, in observation with a transmission electron microscope, precipitate grains with a diameter of 15 to 35 nm are observed by ≥30 pieces per μm
2 , and further, the number of the precipitate grains with a diameter of 15 to 35 nm is ≥40% in all the numbers of the precipitate grains to be observed.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：为了提供一种具有耐热性的电子器件的铜合金，即使在500℃的高温区域中，其强度也不会降低。＆lt; P＆gt;解决方案：所述铜合金以质量计含有1.5〜2.4％的Fe，0.008〜0.08％的P和0.01〜0.5％的Zn，在透射电子显微镜观察中，析出直径为15〜35的晶粒 nm，每μm 2 观察到≥30个，另外，直径为15〜35nm的析出物颗粒的数量在观察到的所有析出物颗粒数中≥40％。版权所有（C）2010，JPO＆INPIT

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