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1. 发明专利

JPH06252121A WET-CLEANING DEVICE AND ITS CHEMICAL EXCHANGING METHOD 失效
公开(公告)号：JPH06252121A
公开(公告)日：1994-09-09
申请号：JP3847393
申请日：1993-02-26
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJINO NAOHIKO , SASAI HIROSHI , OMORI MASASHI
IPC分类号： B08B9/08 , H01L21/304
摘要： PURPOSE:To provide the chemical exchanging method of a wet-cleaning device by which the cleaning ability of a chemical can be maintained for a long period by suppressing the deterioration of the original cleaning ability of the chemical even when the chemical is repeatedly exchanged and the remaining of foreign matters in the chemical and the adhesion of the foreign matters to a product are not allowed immediately after exchanging the chemical. CONSTITUTION:In the title chemical changing method for a wet-cleaning device equipped with a filter 8 in a chemical circulating systems 7 and 9, a chemical in the filter 8 is replaced with a new chemical after once replacing the chemical with pure water.

2. 发明专利

JPH04271117A CHEMICAL VAPOR DEPOSITION EQUIPMENT 失效
公开(公告)号：JPH04271117A
公开(公告)日：1992-09-28
申请号：JP684191
申请日：1991-01-24
申请人： MITSUBISHI ELECTRIC CORP
发明人： SHIMA YUKIO , INABA YUTAKA , SASAI HIROSHI , NAKAJIMA YUICHI
IPC分类号： H01L21/205
摘要： PURPOSE:To prevent unreacted gas from flowing into an exhaust system in a low pressure chemical vapor deposition equipment so that foreign matter may not adhere to the exhaust system. CONSTITUTION:A wafer 11 with which reaction gas reacts is arranged between a wafer 1 and an exhaust piping inlet 6a in a chamber 2. Unreacted gas is led into the exhaust piping 6 after reaction with the wafer 11. Thereby the reaction gas which flows into the exhaust piping 6 before reaction can be reduced, so that foreign matter can be prevented form adhering to the exhaust system.

3. 发明专利

JPH06267919A SEMICONDUCTOR CLEANING DEVICE AND WAFER CASSETTE 失效
公开(公告)号：JPH06267919A
公开(公告)日：1994-09-22
申请号：JP22561193
申请日：1993-09-10
申请人： MITSUBISHI ELECTRIC CORP
发明人： OMORI MASASHI , TANAKA HIROSHI , NISHIMOTO AKIRA , FUJINO NAOHIKO , SASAI HIROSHI , KOTO SATORU
IPC分类号： B08B3/04 , B08B15/00 , B65G1/00 , B65G49/07 , H01L21/00 , H01L21/304 , H01L21/673 , H01L21/677 , H01L21/68
摘要： PURPOSE:To manufacture a semiconductor cleaning device, which is small in size and is superior in throughput capacity, by a method wherein the wafer hand of a transfer part directly holds each wafer extracted from product cassettes and the wafers are made to transfer in order to a cleaning part, a water washing part and a drying part. CONSTITUTION:A plurality of wafers 1 are respectively held by a wafer hand 35a of a cleaning product transfer part 35, are sent form a product insertion/ extraction part 31A to a cleaning part 32A and a cleaning of the wafers is performed. After that, the wafers 1 are respectively delivered from the cleaning part 32A to a wafer receiver of a water washing part 33A by the hand 35a, and are washed in water. After that, the wafers 1 are sent from the water washing part 33A to a drying part 34A and are dried. After that, the transfer part 35 moves the wafers 1 from the drying part 34A to the part 31A by the hand 35a and inserts the wafers 1 in product cassettes 4 placed on a support stage 31a. In such a way, by conducting the cleaning, the water washing and the drying of the wafers without using cassettes for cleaning, a cleaning device can be manufactured in a small size.

4. 发明专利

JPH05343378A 失效
公开(公告)号：JPH05343378A
公开(公告)日：1993-12-24
申请号：JP15318392
申请日：1992-06-12
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJINO NAOHIKO , SASAI HIROSHI
IPC分类号： H01L21/304 , H01L21/673 , H01L21/68 , H01L21/683
摘要： PURPOSE:To avoid direct contact between a wafer surface and a wafer carrying stand to prevent damage to the wafer surface, occurrence of abrasion dust or transfer of dust from a groove side of the wafer carrying stand to the wafer due to the direct contact. CONSTITUTION:At least a part in contact with a groove 2 of a wafer carrying stand 1 has a diameter larger than that of a wafer 3 to hold the wafer 3 in contact with a rear of the wafer 3 and is inserted and held in the groove of the wafer carrying stand 1.

5. 发明专利

JPH05338794A 失效
公开(公告)号：JPH05338794A
公开(公告)日：1993-12-21
申请号：JP15213492
申请日：1992-06-11
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJINO NAOHIKO , SASAI HIROSHI
IPC分类号： B65G49/07 , H01L21/677 , H01L21/68
摘要： PURPOSE:To prevent the damage of a silicon wafer end part by constituting the constituting material of at least the contact part with a silicon wafer of a silicon wafer carrying hand from a material lower in hardness than the silicon wafer. CONSTITUTION:The chuck 1 having a holding groove 2 for holding a silicon wafer 3 of a silicon wafer carrying hand is formed from a material softer than the Mohs' hardness 7. For example, a quartz glass in which boron or phosphor is doped or a quartz glass coated with Teflon film is used. Thus, the damage accompanying the contact sliding of the silicon wafer end surface with the side surface of the holding groove 2 is almost added to the side surface of the holding groove 2, and the problem in that the silicon wafer 3 end part is flawed is eliminated.

6. 发明专利

JPH0536665A WET TREATMENT DEVICE 失效
公开(公告)号：JPH0536665A
公开(公告)日：1993-02-12
申请号：JP19302991
申请日：1991-08-01
申请人： MITSUBISHI ELECTRIC CORP
发明人： WATAYA TAKASHI , SASAI HIROSHI , OMORI MASASHI
IPC分类号： H01L21/304
摘要： PURPOSE:To avoid the elongation of a whole device in the direction of a carrying line by preventing each length of various kinds of processing tanks from becoming longer in the direction of the carrying line even though the length becomes longer in the direction perpendicular to the carrying line when the surface of semiconductor wafers becomes larger. CONSTITUTION:A plurality of processing tanks 8-12 for cleaning the surface of semiconductor wafers 16 are arranged on a carrying line 6 between a loader 2 and an unloader 4 and the wafers 16 are put in and taken out from the tanks 8-12 through their taking in and out ports 8a-12a. Then the tanks 8-12 are arranged so that the wafers 16 can be put in and taken out from the tanks 8-12 through the ports 8a-12a while the surfaces of the wafers 16 being held perpendicularly to the line 6.

7. 发明专利

JPH06196471A WATER VAPOR DRYING METHOD AND DEVICE THEREOF 失效
公开(公告)号：JPH06196471A
公开(公告)日：1994-07-15
申请号：JP21293993
申请日：1993-08-27
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJINO NAOHIKO , SASAI HIROSHI , OMORI MASASHI , TANAKA HIROSHI , KOTO SATORU
IPC分类号： F26B3/00 , F26B21/14 , H01L21/304
摘要： PURPOSE:To enable a surface of a work to be dried out without producing stains on it even if works are small in number by a method wherein solvent vapor is so limited in absolute quantity as not to make the absolute quantity of latent heat of solvent vapor in a space in contact with a work enough to heat the work up to a boiling temperature of solvent vapor. CONSTITUTION:Before a silicon wafer 7 is put in an IPA vapor, an IPA vapor 4 in a contact space 8 is so limited in absolute quantity by a partition 14 as not to make the absolute quantity of latent heat of solvent vapor in a contact space 8 enough to heat the silicon wafer 7 up to a boiling temperature of solvent vapor 4. Thereafter, the silicon wafer 7 is brought into contact with IPA vapor 4 not only to make it condensed on the surface of the wafer 7 but also to raise the wafer 7 in temperature by the latent heat of the IPA vapor 7, and then the silicon wafer 7 is pulled out of the IPA vapor 4 to evaporate IPA 2 condensed on it. By this setup, a silicon wafer can be dried up producing no stain on its surface even if wafers are small in number.

8. 发明专利

JPH05304132A 失效
公开(公告)号：JPH05304132A
公开(公告)日：1993-11-16
申请号：JP10744492
申请日：1992-04-27
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJINO NAOHIKO , SASAI HIROSHI
IPC分类号： H01L21/304
摘要： PURPOSE:To dry the surface of an object to be cleaned without causing stain by supplying solvent vapor sequentially from the upper part toward the lower part of the object to be cleaned. CONSTITUTION:IPA solvent vapor 6 is supplied sequentially from the upper part toward the lower part of a wafer 5 to be cleaned by means of a diffusion pump comprising a duct 12 and a cooling coil 13 disposed in a vapor drying chamber body 1 thus forming dew of solvent vapor 6 sequentially from the upper part toward the lower part of the wafer 5. The temporarily temperature raised wafer 5 is then held in a cooling chamber 16 and cooled thus forming dew again on the surface of the wafer. Since fine dust does not flow down from the surface of the object to be cleaned, a vapor drying method excellent in drying characteristics and cleaning characteristics and causing no stain can be obtained.

9. 发明专利

JPH06188233A SEMICONDUCTOR CLEANING EQUIPMENT 失效
公开(公告)号：JPH06188233A
公开(公告)日：1994-07-08
申请号：JP34012092
申请日：1992-12-21
申请人： MITSUBISHI ELECTRIC CORP
发明人： YASUMURA TOSHIHARU , OMORI MASASHI , SASAI HIROSHI
IPC分类号： B08B3/14 , H01L21/304
摘要： PURPOSE:To provide a semiconductor cleaning equipment which can be operated without the efficiency of its foreign-matter filter means being reduced. CONSTITUTION:A filtering apparatus 22 to be the main part of a semiconductor cleaning equipment forms respectively in the upper part of the two parts whereinto the apparatus 22 is partitioned up and down by a partition wall 23 a gas separating chamber 24 and forms in the lower part a foreign-matter filter chamber 25 having a filter 30 whereby foreign matters are filter. Also, the filtering apparatus 22 stores in the gas separating chamber 24 a valve 32 which moves up and down according to the movement of the liquid surface of a cleaning liquid 2 and which chokes up an exhaust pipe 28 when the liquid surface rises to a predetermined level and chokes up an opening 23a of the partition wall 23 when the liquid surface falls to the level of the top surface of the partition wall 23.

10. 发明专利

JPH06132270A WET CLEANER AND ITS CHEMICAL EXCHANGING METHOD 失效
公开(公告)号：JPH06132270A
公开(公告)日：1994-05-13
申请号：JP27744992
申请日：1992-10-15
申请人： MITSUBISHI ELECTRIC CORP
发明人： FUJINO NAOHIKO , SASAI HIROSHI , TANAKA HIROSHI
IPC分类号： B08B3/04 , H01L21/304 , H01L21/306
摘要： PURPOSE:To provide a wet cleaner which can be restarted smoothly even after the exchange of chemicals without mixing foreign matter into the chemicals inside a cleaning vessel immediately after the exchange of chemicals, in its turn never lets foreign matter adhere to the product at restart. CONSTITUTION:This device is equipped with a cleaning vessel 1, which cleans a product such as a silicon wafer, etc., in the condition of being soaked in chemicals S, an overflow vessel 2, which receives the chemicals S having overflown from this cleaning vessel 1 when the product is soaked in this cleaning vessel 1, a liquid level sensor 3, which detects the liquid level as the quantity of chemicals inside this overflow vessel 2, and a circulation pump 6, which circulates the chemicals S to the cleaning vessel 1 while filtrating it with a filter 8, under the condition that the liquid level of the chemicals S is controlled by this liquid sensor 3. And, a changeover valve 16 is provided, which changes the destination of circulation of chemicals S between the cleaning vessel 1 and the overflow vessel 2.

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