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1. 发明专利

JP2012005283A Heating method and heater of stator by induction heating 有权
标题翻译：加热方法和加热器通过感应加热
公开(公告)号：JP2012005283A
公开(公告)日：2012-01-05
申请号：JP2010139174
申请日：2010-06-18
申请人： Hitachi Chem Co Ltd , Hitachi Industrial Equipment Systems Co Ltd , Tokyo Electric Power Co Inc:The , 日立化成工業株式会社 , 東京電力株式会社 , 株式会社日立産機システム
发明人： KOYAMA MASATAKA , SAKUBARA NOBUHIRO , ITOI MASAYUKI , KOBAYASHI KOJI , URANO MANABU , SHIBAZAKI MASAYUKI
IPC分类号： H02K15/12
摘要： PROBLEM TO BE SOLVED: To provide a heating method and a heater of a stator by induction heating, which can fill a slot of the stator with varnish of high viscosity and can improve energy efficiency.SOLUTION: For induction-heating the stator of an electric machine and hardening the varnish applied to the vicinity of a coil wound around the stator, an induction heating portion closely covers at least a half or above of an external part of the stator. An induction heating coil is arranged so that induction heating current flowing in the coil flows in one direction in the induction heating portion. The induction heating current is supplied to the induction heating coil and the stator is heated while rotating.
摘要翻译：要解决的问题：通过感应加热来提供定子的加热方法和加热器，其可以通过高粘度的清漆填充定子的槽，并且可以提高能量效率。解决方案：感应加热电机的定子并使施加到缠绕在定子上的线圈附近的清漆硬化，感应加热部分紧密地覆盖定子的外部部分的至少一半或更多。感应加热线圈布置成使得在线圈中流动的感应加热电流在感应加热部分中沿一个方向流动。感应加热电流被提供给感应加热线圈，并且定子在旋转的同时被加热。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2013027181A Rotary electric machine 有权
标题翻译：旋转电机
公开(公告)号：JP2013027181A
公开(公告)日：2013-02-04
申请号：JP2011160437
申请日：2011-07-22
申请人： Hitachi Industrial Equipment Systems Co Ltd , 株式会社日立産機システム
发明人： SAITO KENICHI , KOBAYASHI KOJI , SUZUKI TOSHIFUMI , SUZUKI NORINAGA , SANO MASAHIRO , TAJIMA KIYOMI , OIKAWA KUNIHIKO , KOBAYASHI TATSUYA
IPC分类号： H02K9/02 , H02K5/02 , H02K11/00
CPC分类号： H02K9/14 , H02K5/08 , H02K5/18 , H02K5/20 , H02K11/33
摘要： PROBLEM TO BE SOLVED: To provide a rotary electric machine which is operable under a harsh environment such as a location receiving direct sunlight and realizes low noise.SOLUTION: A rotary electric machine comprises: a housing 51 in which multiple cooling fins 52 are formed at an outer periphery; a stator attached to the housing 51; a rotor fixed to a rotation shaft and rotated by a rotating magnetic field from the stator; a cooling fan 58 rotating with the rotation of the rotation shaft; a cover 10 provided at the outer periphery of the housing 51; and a covering material 80 disposed between the cover 10 and the housing 51 and covering tip parts of the multiple cooling fins 52. Spaces, covered by the covering material 80, are formed between the multiple cooling fins 52. This structure allows cooling to be conducted by cooling air while sound absorption effect and heat radiation effect are respectively achieved by the covering material 80 and the spaces.
摘要翻译：要解决的问题：提供一种在诸如接收阳光直射的位置的恶劣环境下操作并实现低噪声的旋转电机。解决方案：一种旋转电机包括：外壳51，在外壳上形成有多个散热片52; 固定在壳体51上的定子; 固定在旋转轴上并通过来自定子的旋转磁场旋转的转子; 随着旋转轴的旋转而旋转的冷却风扇58; 设置在壳体51的外周的盖10; 以及设置在盖10和壳体51之间并覆盖多个冷却翅片52的顶端部分的覆盖材料80.在多个散热片52之间形成由覆盖材料80覆盖的空间。这种结构允许进行冷却通过冷却空气，同时通过覆盖材料80和空间分别实现吸声效果和散热效果。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2012157194A Rotary electric machine assembly 有权
标题翻译：旋转电机总成
公开(公告)号：JP2012157194A
公开(公告)日：2012-08-16
申请号：JP2011015258
申请日：2011-01-27
申请人： Hitachi Industrial Equipment Systems Co Ltd , 株式会社日立産機システム
发明人： SAITO KENICHI , KOBAYASHI KOJI , SUZUKI TOSHIFUMI , SUZUKI NORINAGA , SANO MASAHIRO , TAJIMA KIYOMI , OIKAWA KUNIHIKO , KOBAYASHI TATSUYA , ICHIKI KAZUTAKA , ONO KOJI
IPC分类号： H02K11/00 , H02K5/18 , H02K5/22 , H02K9/06
CPC分类号： H02K5/225 , H02K5/18 , H02K9/14 , H02K11/05 , H02K11/33
摘要： PROBLEM TO BE SOLVED: To provide a rotary electric machine assembly which is suitable for integrating various circuit boards, and further, a noise filter and a capacitor, being excellent in practicability.SOLUTION: A rotary electric machine assembly integrally includes, in a cover, a permanent magnet type rotary electric machine, a power converter device, a components constituting the power converter device, a control I/F board which performs inputting/outputting to the outside and controls operation of the rotary electric machine through the power converter device, and a terminal box which incorporates a noise filter, with a cooling fan attached to one end of the cover. The power converter device is integrally fitted to a flat surface part formed at a part of housing that is fitted to the outer periphery of an armature of the rotary electric machine, with a plurality of cooling fins formed on the outer periphery. At another part of the housing, the component and the control I/F board are arranged between the cooling fin and the inner peripheral surface of the cover, with the noise filter fitted to a part of the cover.
摘要翻译：要解决的问题：提供一种适用于集成各种电路板的旋转电机组件，以及具有优异实用性的噪声滤波器和电容器。解决方案：旋转电机组件在盖子中一体地包括永磁式旋转电机，功率转换器装置，构成功率转换器装置的部件，控制I / F板，其执行输入/输出外部并通过功率转换器装置控制旋转电机的操作，以及包括噪声滤波器的接线盒，其中冷却风扇附接到盖的一端。电力转换装置与形成在壳体的与旋转电机的电枢的外周嵌合的一部分的平坦面部一体地嵌合，在外周形成有多个散热片。在壳体的另一部分，部件和控制I / F板布置在冷却片和盖的内周表面之间，噪声过滤器安装在盖的一部分上。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2012160546A Adhesive film for circuit connection and circuit connection structure 审中-公开
标题翻译：用于电路连接和电路连接结构的胶带
公开(公告)号：JP2012160546A
公开(公告)日：2012-08-23
申请号：JP2011018531
申请日：2011-01-31
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TATEZAWA TAKASHI , KOBAYASHI KOJI , KUDO SUNAO , SEKI KOTARO
IPC分类号： H01L21/60 , C09J4/00 , C09J7/02 , C09J9/02 , C09J11/04 , C09J11/06 , C09J201/00 , H01B5/00 , H01B5/16 , H01R11/01
摘要： PROBLEM TO BE SOLVED: To provide an adhesive film for circuit connection and a circuit connection structure using the same, capable of assuring visibility of a sensor while reducing connection resistance between circuit electrodes.SOLUTION: The adhesive film for circuit connection contains an adhesive layer which is interposed between circuit electrodes, facing each other, so as to electrically connect the circuit electrodes together. It includes an adhesive component containing (a) a hardening agent for generating free radical by heating, (b) radical polymerizable material, and (c) film formation polymer, conductive particles which, with plastic as nucleus, have a projection on an outermost, and are covered with metal plating containing at least one kind selected from the group of Ni, Ni alloy, and Ni oxide, and pigment which raises L* value of the adhesive layer to be 35 or higher in CIELAB.
摘要翻译：要解决的问题：为了提供一种用于电路连接的粘合膜和使用该粘合膜的电路连接结构，能够确保传感器的可视性，同时减少电路电极之间的连接电阻。解决方案：用于电路连接的粘合剂膜包含介于彼此面对的电路电极之间的粘合剂层，以将电路电极电连接在一起。它包括一种粘合剂组分，其包含（a）通过加热产生自由基的硬化剂，（b）可自由基聚合的材料，和（c）成膜聚合物，以塑料为核，在最外面具有突起的导电颗粒，并且覆盖有含有选自Ni，Ni合金和Ni氧化物中的至少一种的金属电镀，以及在CIELAB中将粘合剂层的L *值提高到35以上的颜料。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2012114092A Circuit connecting material, film-like-circuit connecting material using the same, circuit-member connecting structure, and circuit-member connecting method 审中-公开
标题翻译：电路连接材料，薄膜电路连接材料，电路连接结构和电路连接方法
公开(公告)号：JP2012114092A
公开(公告)日：2012-06-14
申请号：JP2011271214
申请日：2011-12-12
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ARIFUKU MASAHIRO , KOBAYASHI KOJI , FUJINAWA MITSUGI
IPC分类号： H01R11/01 , H01B1/00 , H01B1/20 , H01B5/16 , H01L21/60
CPC分类号： H05K3/323 , B82Y10/00 , H01L2224/83101 , H01L2924/12044 , H05K3/361 , H05K2201/0224 , H05K2201/026 , H05K2201/0323 , Y10T29/49117 , Y10T29/532 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a circuit connecting material that achieves both secure of insulating properties between adjacent circuits and secure of a conductivity between facing circuits, in a highly precise circuit.SOLUTION: A circuit connecting material is interposed between facing circuit-electrodes, and presses facing circuit-electrodes, and electrically connects press-directional electrodes, and moreover, includes anisotropic conductive particles where conductive particles are dispersed in an organic insulating substance.
摘要翻译：要解决的问题：提供在高精度电路中实现相邻电路之间的绝缘性能确保和面对电路之间的导电性的电路连接材料。解决方案：电路连接材料插入在相对的电路电极之间，并且面对电路电极，并且电连接压力方向电极，此外，还包括其中导电颗粒分散在有机绝缘物质中的各向异性导电颗粒。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2011116937A Adhesive composition, circuit connection structure, and semiconductor device 有权
标题翻译：胶粘组合物，电路连接结构和半导体器件
公开(公告)号：JP2011116937A
公开(公告)日：2011-06-16
申请号：JP2010179753
申请日：2010-08-10
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KUDO SUNAO , ARIFUKU MASAHIRO , KOBAYASHI KOJI , KUME MASAHIDE , MASUDA KATSUYUKI , EJIRI TAKAKO
IPC分类号： C09J179/04 , C09J7/00 , C09J9/02 , C09J11/02 , C09J179/08 , H01L21/60 , H05K1/14 , H05K3/36
CPC分类号： C03C27/10 , C08G73/0633 , C08G73/1085 , C09J179/04 , C09J179/08 , H01L24/32 , H01L2224/16 , H01L2224/32225 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01067 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition transferable to a circuit member in a short time, and having a sufficiently long pot life, and a circuit connection structure and a semiconductor device using the adhesive composition. SOLUTION: The adhesive composition 40 comprising an adhesive component 5 containing a resin having a piperazine skeleton represented by general formula (1), and conductive particles 7, a circuit connection structure, and a semiconductor device are provided. In formula (1), R 1 and R 2 are each independently a bivalent organic group, R 3 is a 1-10C monovalent organic group or ether, ester, carbonyl, sulfonyl, or sulfonate group in which a hydrogen atom or a 1-10C organic group is bonded to one of the bonds, and n is an integer of 0-4, provided that when n is 2-4, the existing plurality of R 3 s each may be the same and different. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供在短时间内可转移到电路部件并且具有足够长的适用期的粘合剂组合物，以及使用该粘合剂组合物的电路连接结构和半导体器件。解决方案：提供包含粘合剂组分40的粘合剂组合物40，其包含通式（1）表示的具有哌嗪骨架的树脂和导电颗粒7，电路连接结构和半导体器件。在式（1）中，R 1和R 2各自独立地是二价有机基团，R 3是一个1-10C的一价有机基团或其中氢原子或1-10C有机基团键合到一个键上的醚，酯，羰基，磺酰基或磺酸酯基，n为0-4的整数，条件是当n为2-4时，现有的多个R＆lt; SP＆gt; 3＆lt; 3＆gt; s可以相同且不同。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2010267627A Resin film sheet and electronic component 有权
标题翻译：树脂薄膜和电子元件
公开(公告)号：JP2010267627A
公开(公告)日：2010-11-25
申请号：JP2010157782
申请日：2010-07-12
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KONO TSUTOMU , KOBAYASHI KOJI , KOJIMA KAZUYOSHI , MINO MASAYUKI
IPC分类号： H01R11/01 , H01B5/16
CPC分类号： H01L2224/2929 , H01L2224/293 , H01L2224/73204 , H01L2224/83851
摘要： PROBLEM TO BE SOLVED: To reduce cost and to improve conductivity performance by improving a particle capture rate of a conductive resin film sheet. SOLUTION: The conductive resin film sheet is formed by laminating two or more of a resin film layer with conductive particles included and a resin film layer with no conductive particle included in a thickness direction to improve the particle capture rate expressed by a ratio of the number of particles included in a resin film between electrodes before forming and the number of particles sandwiched between the electrodes after forming. The particle capture rate is improved by setting thermal conductivity of an insulating resin film layer lower than thermal conductivity of the resin film layer with the conductive particles included. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：通过提高导电树脂膜片的颗粒捕获率来降低成本和改善导电性能。解决方案：导电树脂膜片通过层压两个或更多个树脂膜层和包括导电颗粒的树脂膜层和在厚度方向上不包含导电颗粒的树脂膜层而形成，以提高由比例表示的颗粒捕获率包含在形成前的电极之间的树脂膜中的颗粒数量和在形成之后夹在电极之间的颗粒的数量。通过使包含导电性粒子的树脂膜层的导热率低于绝对树脂膜层的导热率来提高粒子捕获率。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2010248485A Adhesive material reel 有权
标题翻译：胶粘材料卷
公开(公告)号：JP2010248485A
公开(公告)日：2010-11-04
申请号：JP2010056241
申请日：2010-03-12
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TATEZAWA TAKASHI , SEKI TAKASHI , KOBAYASHI KOJI , FUJINAWA MITSUGI , ARIFUKU MASAHIRO , SEKI KOTARO
IPC分类号： C09J7/02 , B65H75/28 , H01L21/60 , H05K1/14
CPC分类号： B65H75/28 , B65H2701/377 , H01R4/04 , H01R12/52 , H05K3/323 , Y10T428/14 , Y10T428/266 , Y10T428/28
摘要： PROBLEM TO BE SOLVED: To provide an adhesive material reel capable of sufficiently inhibiting the transfer of an adhesive layer to the back surface of a substrate material on drawing out a circuit-connecting tape in a wound state and useful for the production of a circuit-connected body having an excellent connection reliability. SOLUTION: This adhesive material reel equipped with a tape state substrate material and a circuit-connecting tape having an adhesive layer formed on the one side surface of the same and a winding core for winding the circuit-connecting tape is provided with that the circuit-connecting tape has a portion without forming the adhesive layer by at least over one round length of the winding core from the terminal end to the beginning end direction, and an end tape pasted to the terminal end part of the circuit-connecting tape so as to cover the portion, and extending/presenting from the final end part toward the winding core. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种粘合材料卷轴，其能够在卷绕状态下拉出电路连接带时能够充分地抑制粘合剂层向基材的背面的转印，并且可用于生产具有良好的连接可靠性的电路连接体。＆lt; P＆gt;解决方案：具有带状基板材料的粘合材料卷轴和形成在其一个侧表面上的粘合层的电路连接带和用于缠绕电路连接带的绕组芯设置有电路连接带具有从终端至起始端方向至少超过一个圆形长度的粘合剂层而不形成粘合剂层的部分，以及粘贴到电路连接带的终端部分的端部带以覆盖该部分，并且从最终端部朝向卷绕芯部延伸/呈现。版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2010212706A Circuit connecting material and method of manufacturing circuit board using the same, and circuit board 审中-公开
标题翻译：电路连接材料及使用其制造电路板的方法和电路板
公开(公告)号：JP2010212706A
公开(公告)日：2010-09-24
申请号：JP2010096169
申请日：2010-04-19
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ARIFUKU MASAHIRO , WATANABE ITSUO , KOBAYASHI KOJI , FUJINAWA MITSUGI , NAKAZAWA TAKASHI , KOJIMA KAZUYOSHI
IPC分类号： H05K1/14 , C09J4/00 , C09J9/02 , C09J11/04 , C09J175/04 , C09J175/16 , H01B5/16 , H01L21/60 , H05K3/32 , H05K3/36
摘要： PROBLEM TO BE SOLVED: To provide an electric and electronic circuit connecting material, which has more superior low-temperature rapid hardening property than a conventional epoxy resin material and also has excellent adhesive strength to a circuit member, to provide a method of manufacturing circuit board using the same, and to provide the circuit board.
SOLUTION: The circuit connecting material contains (1) a silicon denatured polyimide resin, (2) a radical polymerizable substance, and (3) a hardening agent heated to generate a free radical as essential components and further contains conductive particles. Specifically, the circuit connecting material contains (1) the silicon denatured polyimide resin by 2 to 75 parts by weight, (2) the radical polymerizable substance by 30 to 60 parts by weight, and (3) the hardening agent, heated to generate the free radical, by 0.1 to 30 parts by weight, and contains (4) film forming material by 0 to 40 parts by weight, and the conductive particles by 0.1 to 30 vol.% with respect to an adhesive component. The method of manufacturing the circuit board includes interposing the circuit connecting material between a first connection terminal and a second connection terminal which are arranged opposite each other, and heating and pressing the circuit connecting material to electrically connect the first connection terminal and the second connection terminal to each other.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种电气电子电路连接材料，其具有比常规环氧树脂材料更优异的低温快速硬化性能，并且还对电路部件具有优异的粘合强度，以提供一种方法制造电路板使用相同，并提供电路板。电路连接材料包含（1）硅变性聚酰亚胺树脂，（2）可自由基聚合物质，和（3）加热产生自由基作为必需组分的硬化剂，并且还含有导电颗粒。具体来说，电路连接材料含有（1）硅变性聚酰亚胺树脂2〜75重量份，（2）自由基聚合性物质30〜60重量份，（3）硬化剂，自由基，0.1〜30重量份，含有（4）成膜材料0〜40重量份，导电性粒子相对于粘合剂成分为0.1〜30体积％。制造电路板的方法包括将电路连接材料插入彼此相对布置的第一连接端子和第二连接端子之间，加热并按压电路连接材料以电连接第一连接端子和第二连接端子对彼此。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2010010142A Thermosetting circuit connection member and connection structure of electrode using it and connecting method of electrode 审中-公开
标题翻译：使用电极的电热连接构件和电极的连接结构及电极的连接方法
公开(公告)号：JP2010010142A
公开(公告)日：2010-01-14
申请号：JP2009233793
申请日：2009-10-07
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , HIROZAWA YUKIHISA , KOBAYASHI KOJI , OTA TOMOHISA , MATSUOKA HIROSHI , WATANABE ITSUO , TAKEMURA KENZO , SHIOZAWA NAOYUKI , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： H01R11/01 , B32B7/02 , B32B27/00 , B32B27/38 , C09J5/06 , C09J7/00 , C09J9/02 , C09J11/00 , C09J163/00 , C09J171/10 , H01R43/00
摘要： PROBLEM TO BE SOLVED: To provide a high-resolution thermosetting circuit connection member capable of retaining conductive particles by preventing them from easily flowing out from the surfaces of electrodes at the time of connection, capable of easily providing contact between the electrodes and the conductive particles, hardly containing bubbles in a connection part, excelling in long-time connection reliability, excelling in workability without needing correct positioning between the conductive particles and the electrodes, and useful for connection between the electrodes, as well as a connection structure and a connection method of electrodes using it. SOLUTION: Of the thermosetting circuit connection member, a multilayer connection member is composed by forming a layer containing epoxy resin, phenoxy resin and a curing agent as an insulating adhesion layer on at least one surface of a conductive adhesion layer comprising epoxy resin, phenoxy resin and curing agent as a binder and a conductive material, and having conductivity in a pressing direction, melting viscosity of a binder constituent at the time of connection is 500 poise or less, and the insulating adhesion layer has a melting viscosity equivalent to that of the conductive adhesion layer. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决问题：为了提供一种能够通过防止在连接时从电极表面容易地从电极表面流出而能够保持导电粒子的高分辨率的热固性电路连接部件，能够容易地提供电极与电极之间的接触在连接部中几乎不含气泡的导电性粒子，长时间的连接可靠性优异，加工性优异，不需要导电粒子与电极之间的正确定位，也可用于电极之间的连接，以及连接结构和使用它的电极的连接方法。解决方案：在热固性电路连接构件中，多层连接构件通过在包含环氧树脂的导电粘合层的至少一个表面上形成包含环氧树脂，苯氧基树脂和固化剂作为绝缘粘合层的层，苯氧基树脂和固化剂作为粘合剂和导电材料，并且在挤压方向上具有导电性，连接时粘合剂成分的熔融粘度为500泊以下，绝缘粘合层的熔融粘度等于导电粘合层的。版权所有（C）2010，JPO＆INPIT

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