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    • 1. 发明专利
    • Display device, and method of manufacturing same
    • 显示装置及其制造方法
    • JP2007059663A
    • 2007-03-08
    • JP2005243955
    • 2005-08-25
    • Hitachi Displays Ltd株式会社 日立ディスプレイズ
    • SAITO KAZUNARISAITO YOSHIYUKIKUWATA MASAHIROSHIINA MASAHIDEODA TETSUO
    • H01L21/316H01L21/76H01L21/8234H01L27/08H01L27/088
    • PROBLEM TO BE SOLVED: To achieve microfabrication of semiconductor chips used in a drive circuit and reduce its cost, by using each element isolation film for isolating active regions from each other.
      SOLUTION: In a method of manufacturing a display device, the semiconductor chip is isolated into a low breakdown voltage region and a high breakdown voltage region; and both the low breakdown voltage region and the high breakdown voltage region have element isolation films, each of which comprises an oxide film and have their respective active regions two of which are isolated from each other by the element isolation film. More specifically, this manufacturing method has a step for so oxidizing selectively the semiconductor substrate of the semiconductor chip as to form in the principal surfaces of both the low breakdown voltage region, and the high breakdown voltage region the oxide films of the semiconductor chip by each of which the active regions are isolated from each other; a step for forming thereafter each silicon film on each oxide film; a step for so oxidizing the semiconductor substrate as to form gate oxide films on the active regions of both the low breakdown voltage region and the high breakdown voltage region, and as to form element separating films of the low breakdown voltage region and the high breakdown voltage region; a step for so etching the low breakdown voltage region as to remove the gate oxide films present on the low breakdown voltage region; and a step for so oxidizing the principal surface of the low breakdown voltage region as to form each gate oxide film on each active region of the low breakdown voltage region.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:为了实现用于驱动电路中的半导体芯片的微细加工,并且通过使用每个元件隔离膜来隔离有源区域来降低其成本。 解决方案:在制造显示装置的方法中,将半导体芯片隔离成低击穿电压区域和高击穿电压区域; 并且低击穿电压区域和高击穿电压区域都具有元件隔离膜,每个元件隔离膜包括氧化膜并且其各自的有源区域通过元件隔离膜彼此隔离。 更具体地说,该制造方法具有如下步骤:选择性地氧化半导体芯片的半导体衬底,以便在低击穿电压区域和高击穿电压区域中形成半导体芯片的氧化物膜的每个 其中活性区域彼此隔离; 在每个氧化膜上形成每个硅膜的步骤; 使半导体基板氧化以在低击穿电压区域和高击穿电压区域的有源区域上形成栅极氧化膜的步骤,以及形成低击穿电压区域和高击穿电压的元件分离膜 地区; 用于蚀刻低击穿电压区域以去除存在于低击穿电压区域上的栅极氧化膜的步骤; 以及使低击穿电压区域的主表面氧化以在低击穿电压区域的每个有源区上形成每个栅极氧化膜的步骤。 版权所有(C)2007,JPO&INPIT
    • 2. 发明专利
    • Liquid crystal display and method of manufacturing the same
    • 液晶显示器及其制造方法
    • JP2010160255A
    • 2010-07-22
    • JP2009001606
    • 2009-01-07
    • Hitachi Displays Ltd株式会社 日立ディスプレイズ
    • SAITO KAZUNARIOBARA KATSUMIITAKURA SEIJI
    • G02F1/1333G09F9/00G09F9/30
    • G02F1/1333
    • PROBLEM TO BE SOLVED: To reduce a thickness of a liquid crystal display, and to prevent the generation of cracks, in a miniaturized liquid crystal display.
      SOLUTION: A portion of a TFT substrate 10 to which a lower polarizer 15 is adhered has a thin thickness, and the periphery of the TFT substrate including a terminal 40 has a thick thickness. A portion of a counter substrate 20 to which an upper polarizer 25 is adhered has a thin thickness, and the periphery of the counter substrate except for one side has a thick thickness in a U shape. Accordingly, in adhering the upper polarizer 25 to the counter substrate 20, a foreign material is hardly entangled. By applying chemical polishing to edges of the TFT substrate 10 and edges of the counter substrate 20, the edges 13 are rounded, whereby a probability of the generation of cracks caused by an impact or the like from the outside can be reduced.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:为了减小液晶显示器的厚度并防止在小型化液晶显示器中产生裂纹。 解决方案:附着有下偏振片15的TFT基板10的一部分具有薄的厚度,并且包括端子40的TFT基板的周边具有厚的厚度。 上偏光镜25所附着的对置基板20的一部分的厚度较薄,相对基板的除一面以外的周边的厚度为U字形。 因此,在将上偏振片25粘贴到对置基板20时,异物几乎不缠结。 通过对TFT基板10的边缘和对置基板20的边缘进行化学抛光,边缘13是圆形的,从而可以减少从外部产生由冲击等引起的裂纹的可能性。 版权所有(C)2010,JPO&INPIT
    • 3. 发明专利
    • Display device
    • 显示设备
    • JP2008191348A
    • 2008-08-21
    • JP2007024967
    • 2007-02-05
    • Hitachi Displays Ltd株式会社 日立ディスプレイズ
    • NAGAO MASASHISAITO KAZUNARI
    • G09G3/36G02F1/133G09G3/20
    • PROBLEM TO BE SOLVED: To make the cost lower than before when an electronic variable resistor for reference common voltage control and a memory circuit storing an adjustment value thereof are incorporated in a drive circuit.
      SOLUTION: A display device has the drive circuit which drives a plurality of pixels, which each have a pixel electrode and an opposite electrode opposed to the pixel electrode. The drive circuit has a common voltage generating circuit which inputs a common voltage to the opposite electrode, and the common voltage generating circuit has a reference common voltage generating circuit which generates a common reference voltage and a memory circuit. The reference common voltage generating circuit has the electronic variable resistor for reference common voltage control, and the memory circuit has a fuse memory element having a plurality of storage cells and stores the adjustment value of the electronic variable resistor. The memory circuit has the fuse memory element having the plurality of storage cells, a register, and a control circuit.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:当将用于参考公共电压控制的电子可变电阻器和存储其调节值的存储器电路并入驱动电路时,使成本低于以前。 解决方案:显示装置具有驱动电路,其驱动多个像素,每个像素具有像素电极和与像素电极相对的相对电极。 驱动电路具有向对置电极输入公共电压的公共电压发生电路,公共电压发生电路具有产生公共基准电压的基准公共电压发生电路和存储电路。 参考公共电压发生电路具有用于参考公共电压控制的电子可变电阻器,并且存储器电路具有具有多个存储单元的熔丝存储元件,并存储电子可变电阻器的调整值。 存储电路具有具有多个存储单元的熔丝存储元件,寄存器和控制电路。 版权所有(C)2008,JPO&INPIT