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1. 发明授权

EP2826831B2 Use of hot-melt adhesive for the collation of containers and bottles for beverages or food into shelf ready packs of various items 有权
公开(公告)号：EP2826831B2
公开(公告)日：2024-01-10
申请号：EP13176743.6
申请日：2013-07-16
发明人： Schneider, Jörg
IPC分类号： C09J133/08 , C09J131/04 , C09J125/08 , B29L31/00 , B29C65/48 , C08J5/12 , C09J153/02

2. 发明公开

EP4129658A1 ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING, STRUCTURE, AND MANUFACTURING METHOD OF STRUCTURE 审中-实审
公开(公告)号：EP4129658A1
公开(公告)日：2023-02-08
申请号：EP21780590.2
申请日：2021-03-31
申请人： LINTEC CORPORATION
发明人： TSUCHIBUCHI Koji , TAYA Naoki
IPC分类号： B32B27/00 , C09J5/06 , C09J11/04 , C09J123/00 , C09J125/08 , B29C65/32 , C09J7/10 , C09J7/30 , C09J7/35 , H05B6/54
摘要： A high-frequency dielectric heating adhesive contains a thermoplastic resin (A), in which the thermoplastic resin (A) contains a styrene copolymer resin (a1), an amount of the styrene copolymer resin (a1) contained in the thermoplastic resin (A) is 40% or more by volume and 100% or less by volume, the styrene copolymer resin (a1) has a styrene monomer unit content of 10% or more by mass and 90% or less by mass, the high-frequency dielectric heating adhesive has a tensile modulus of 20 MPa or more, and the high-frequency dielectric heating adhesive has a dielectric property (tan δ/ε'r) of 0.005 or more, where tan δ is a dielectric loss tangent at 23 degrees C and a frequency of 40.68 MHz, and ε'r is a relative dielectric constant at 23 degrees C and a frequency of 40.68 MHz.

3. 发明授权

EP3504287B1 ADHESIVE FOR BINDING POLYOLEFIN MEMBRANE TO GLASS FIBERS 有权
公开(公告)号：EP3504287B1
公开(公告)日：2023-01-25
申请号：EP16913736.1
申请日：2016-08-23
发明人： CHEN, Yongchun , WU, Hang , HAN, Tao , YU, Haiyang
IPC分类号： C09J123/26 , C09J125/08 , B32B27/32 , C09J153/00 , C08K5/00 , C09J151/00

4. 发明授权

EP3333234B1 HOT-MELT ADHESIVE RESIN FILM AND PRODUCTION METHOD THEREOF 有权
公开(公告)号：EP3333234B1
公开(公告)日：2020-07-15
申请号：EP16840892.0
申请日：2016-08-03
申请人： Fujimori Kogyo Co., Ltd.
发明人： TAKEI, Kunihiro , MARUYAMA, Yuiko , IIZUKA, Hirokazu
IPC分类号： B32B27/00 , B32B27/32 , B32B27/38 , C09J123/26 , C09J125/08 , C09J163/00 , C09J7/35 , C09J151/06

5. 发明授权

EP2955211B1 TEMPORARY ADHESIVE MATERIAL FOR WAFER PROCESSING, WAFER PROCESSING LAMINATE, AND METHOD FOR MANUFACTURING THIN WAFER USING SAME 有权
标题翻译：临时键合材料晶圆加工，晶圆加工层压板和方法SO生产薄晶圆
公开(公告)号：EP2955211B1
公开(公告)日：2016-11-30
申请号：EP15001695.4
申请日：2015-06-08
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Yasuda, Hiroyuki , Sugo, Michihiro
IPC分类号： C09J7/00 , C09J5/04 , C09J5/06 , C09J183/10 , C09J125/08 , B32B27/30 , H01L21/18
CPC分类号： C09J183/14 , C08G77/442 , C09J5/04 , C09J5/06 , C09J7/00 , C09J7/10 , C09J125/08 , C09J153/005 , C09J153/025 , C09J183/10 , C09J2201/134 , C09J2203/326 , C09J2425/00 , C09J2453/003 , C09J2483/00 , H01L21/187 , H01L21/304 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y02P20/582 , Y10T428/2848 , Y10T428/287 , Y10T428/2874 , Y10T428/2878
摘要： The present invention is adhesive material for a wafer processing used for temporarily bonding a supporting substrate to a wafer having a front surface includes a circuit formed thereon and a back surface to be processed, including a first temporary adhesive layer composed of a layer (A) of a silicone-modified styrene base thermoplastic elastomer, and a second temporary adhesive layer composed of a thermosetting polymer layer (B) laminated on the first temporary adhesive layer, wherein the layer (A) is capable of releasably adhering to the front surface of the wafer, and the layer (B) is capable of releasably adhering to the supporting substrate. Thereby, there can be provided a temporary adhesive material for a wafer processing, a wafer processing lamination, and a method for manufacturing a thin wafer using the same, which facilitates temporary adhesion between a supporting substrate and a wafer having a circuit, is highly compatible with steps of forming a TSV and forming a wiring on the back surface of the wafer, allows easy delamination, and is capable of increasing productivity of thin wafers,

6. 发明公开

EP3022270A2 HOT-MELT ADHESIVE AND USE THEREOF 有权
标题翻译：热熔胶，用于饮料或食物在不同对象的上架PACKS整理容器和瓶子
公开(公告)号：EP3022270A2
公开(公告)日：2016-05-25
申请号：EP14739455.5
申请日：2014-07-16
申请人： IP & Patent Management UG (haftungsbeschränkt) , KHS GmbH
发明人： SCHNEIDER, Jörg
IPC分类号： C09J133/08 , C09J131/04 , C09J125/08
CPC分类号： C08J5/128 , B29C65/4815 , B29L2031/7158 , C08J2367/02 , C08J2423/08 , C08J2453/02 , C09J133/08 , C09J153/02 , C09J153/025
摘要： The present invention relates to the use of a hot-melt adhesive for adhesive bonding of at least a first packaging and a second packaging, the hot-melt adhesive comprising: (a) 7-48 parts per weight of a polymer component, the polymer component com-prising a styrene block copolymer; (b) 1 5-52 parts per weight of a tackifying component, wherein the tackifying component comprises thermoplastic adhesive resin, aliphatic hydrocarbon, cycloaliphatic hydrocarbon, aromatic hydrocarbon, the respective hydrocarbon optionally being modified and/or hydrogenated, terpenes, the terpenes optionally being modified or hydrogenated, rosins, the rosins optionally being modified or hydrogenated, or mixtures thereof; (c) 5-25 parts per weight of a plasticizer component, wherein the piasticizer component comprises paraffinic oils, naphthenic oils, polybuten, polybutadien, dibasic esters, polyols or mixtures thereof; and d) G.02 - 1.2 parts per weight of a stabilizer component, wherein the stabilizer component is a light stabilizer, preferably as a sterically hindered phenolic antioxidant and/or a sterically hindered amine, most preferably is pentaerythritol tetrakis(3-(3,5-di-tert-butyl-4- Iwdroxyphenyl propionate).
摘要翻译：热熔粘合剂混合物，其包含：（a）用关于该混合物包含至少一种苯乙烯类嵌段共聚物，乙烯丙烯酸丁酯/乙酸乙烯酯的总重量计在7-48的重量份的范围内的聚合物组分，催化的弹性体或它们的混合物; （B）在15-52重量份相对于所述混合物包含热塑性粘合剂树脂，脂肪族烃，环脂族烃，芳族烃的总重量，范围A增粘成分，改性烃，氢化形式; 萜烯，萜烯改性，氢化形式; 松香，松香衍生物，它们的氢化或混合物形式; （C）在5-25重量份相对于所述混合物包括石蜡油，环烷油，聚丁烯的总重量的范围A增塑剂成分，二元酯，多元醇或它们的混合物，d）在范围A稳定剂组分的0点02分 - 1.2重量份相对于所述混合物包含空间位阻的总重量的受阻酚抗氧化剂和/或受阻胺光稳定剂。

7. 发明公开

EP2189499A4 AQUEOUS SYNTHETIC RESIN EMULSION, RE-EMULSIFIABLE EMULION POWDER, AND ADHESIVE COMPOSITION CONTAINING THE SAME 有权转让
标题翻译： ÄE E E E IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT
公开(公告)号：EP2189499A4
公开(公告)日：2011-04-13
申请号：EP08778167
申请日：2008-07-14
申请人： NIPPON SYNTHETIC CHEM IND
发明人： SUGAYA MAMORU , NISHIHASHI YOICHIRO , IWASAKI HIROYUKI
IPC分类号： C08L25/02 , C08F2/26 , C08L25/04 , C08L33/08 , C09J125/04 , C09J125/08 , C09J129/04 , C09J133/08
CPC分类号： C08F2/24 , C08F261/04 , C08L1/08 , C08L25/04 , C08L29/04 , C08L33/08 , C08L2205/03 , C08L2666/04 , C09J125/14 , C09J133/08
摘要： Provided are an aqueous synthetic resin emulsion, a re-emulsifiable emulsion powder, and an aqueous synthetic resin emulsion obtained by re-emulsifying the re-emulsifiable emulsion powder, the emulsions and the powder being capable of forming a film excellent in water resistance, warm-water resistance, boiling resistance, toughness, and durability. Also provided is an adhesive composition. They are an aqueous synthetic resin emulsion containing a synthetic resin dispersed and stabilized with a polyvinyl alcohol-based resin (a) having a 1,2-diol bond in a side chain thereof, wherein the synthetic resin comprises, as a polymerizable monomer which constitutes the synthetic resin, a hydrophobic monomer having a solubility in water at 20°C of 0.1% or less in an amount of 30% by weight or more based on all polymerizable monomers, the hydrophobic monomers comprising a styrene-based monomer; a re-emulsifiable emulsion powder; and an aqueous synthetic resin emulsion obtained by re-emulsifying the re-emulsifiable emulsion powder.
摘要翻译：提供了一种水性合成树脂乳液，可再乳化的乳液粉末和通过再乳化可再乳化的乳液粉末获得的水性合成树脂乳液，乳液和粉末能够形成耐水性优异的膜耐水性，耐沸腾性，韧性和耐久性。还提供了粘合剂组合物。它们是含有合成树脂的水性合成树脂乳液，其含有侧链中具有1,2-二醇键的聚乙烯醇系树脂（a）分散稳定的合成树脂，其中，所述合成树脂包含构成合成树脂，在20℃下在水中的溶解度为0.1％以下的疏水性单体，相对于所有可聚合单体，其含量为30重量％以上，所述疏水单体包含苯乙烯类单体; 可再乳化的乳液粉末; 和通过再乳化再乳化乳液粉末而得到的水性合成树脂乳液。

8. 发明公开

EP0957147A4 HOT MELT ADHESIVE COMPOSITIONS 失效
标题翻译：热熔粘合剂组合物
公开(公告)号：EP0957147A4
公开(公告)日：2000-09-13
申请号：EP98900677
申请日：1998-01-21
申请人： MITSUI CHEMICALS INC
发明人： MORIZONO KENICHI , OKADA KEIJI , TOKITA SUGURU
IPC分类号： C08L23/02 , C08L23/06 , C08L23/08 , C08L53/02 , C08L91/06 , C09J109/06 , C09J123/08 , C09J125/02 , C09J125/08 , C09J151/06 , C09J153/00 , C09J153/02 , C09J123/00 , C09J125/00 , C09J201/00
CPC分类号： C09J153/025 , C08L23/06 , C08L23/0838 , C08L53/02 , C08L91/06 , C08L2666/02 , C08L2666/04 , C08L2666/24 , C08L2666/28 , C09J109/06 , C09J123/0838 , C09J125/02 , C09J125/08 , C09J151/06 , C09J153/00 , C09J153/005 , C09J153/02 , Y10S526/935
摘要： A hot-melt adhesive composition comprises 100 parts by weight of a tackifier (B), and 1 to 900 parts by weight of an alpha -olefin/aromatic vinyl compound random copolymer (C). A hot-melt adhesive composition comprises 100 parts by weight of a base polymer (A), 1 to 900 parts by weight of component (B), and 1 to 1,000 parts by weight of component (C). A hot-melt adhesive composition comprises 100 parts by weight of component (A), 10 to 300 parts by weight of component (B), and 10 to 400 parts by weight of component (C). The component (A) is preferably at least one polymer selected from the group consisting of a polyolefin (a-1), a polar group containing polymer (a-2) and an aromatic vinyl compound/conjugated diene copolymer (a-3). These hot-melt adhesive compositions exhibit excellent adhesive strength and can be used as an adhesive for styrene resins.

9. 发明公开

EP0770654A3 Colored film 失效
标题翻译：有色膜
公开(公告)号：EP0770654A3
公开(公告)日：1998-08-05
申请号：EP96104081
申请日：1996-03-14
申请人： LINTEC CORP
发明人： OITA KATSUYUKI , TACHIKAWA KOHEI , GARCIA LEONARDO M , PATEL CHANDRAKANT C , MINAGAWA TOSHIO
IPC分类号： C09J7/02 , C09J11/08 , C09J125/08 , C09J201/00
CPC分类号： C09J7/22 , C09J7/38 , Y10T428/28 , Y10T428/2826 , Y10T428/2891
摘要： Described is a colored film formed of a transparent film and at least one colored adhesive layer arranged on one side of the transparent film. The adhesive layer has been colored by a colorant composed of a pigment and a dispersant. The dispersant comprises a (meth)acrylate ester polymer formed, as essential monomer components, of an aromatic vinyl monomer, a primary to tertiary amino-containing (meth)acrylate ester monomer and a (meth)acrylate ester monomer containing an ammonium group quaternized with an aromatic compound.

10. 发明公开

EP0604120A1 Hot-melt adhesive composition 失效
标题翻译： Heissschmelzklebezusammensetzung。
公开(公告)号：EP0604120A1
公开(公告)日：1994-06-29
申请号：EP93310157.8
申请日：1993-12-16
申请人： MITSUI PETROCHEMICAL INDUSTRIES, LTD.
发明人： Kuroiwa, Toshiaki, c/o Mitsui Petrochemical , Muro, Tuneaki, c/o Mitsui Petrochemical , Tokita, Suguru, c/o Mitsui Petrochemical , Inagaki, Hajime, c/o Mitsui Petrochemical
IPC分类号： C09J125/08 , C09J145/00 , C09J153/02
CPC分类号： C09J125/02 , C08L53/02 , C08L101/00 , C08L2666/02 , C09J145/00
摘要： A hot-melt adhesive composition containing, (A) 10 to 80 parts by weight of a base polymer, (B) 10 to 80 parts by weight of a stickiness-imparting agent which is a copolymer of a particular styrene-type monomer and a particular indene-type monomer, the molar ratio of the indene-type monomer to the styrene-type monomer being from 99/1 to 30/70, and the weight average molecular weight of said copolymer being from 300 to 5000. The hot-melt adhesive composition exhibits excellent heat-resistant adhesiveness and heat-resistant creeping property, and has a low-molecular weight and exhibits good hue.
摘要翻译：一种热熔粘合剂组合物，其包含（A）10至80重量份的基础聚合物，（B）10至80重量份的粘性赋形剂，其是特定苯乙烯类单体和特定的茚类单体，茚类单体与苯乙烯类单体的摩尔比为99/1〜30/70，所述共聚物的重均分子量为300〜5000。粘合剂组合物表现出优异的耐热粘合性和耐热蠕变性，并且具有低分子量并且表现出良好的色调。

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