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    • 7. 发明公开
    • Press fit solder cup
    • 压配合锡杯
    • EP0510808A3
    • 1993-06-16
    • EP92302442.6
    • 1992-03-20
    • THE WHITAKER CORPORATION
    • Dorwart, Charles Edward, Jr.Parker, William TheodoreShowers, Jeffrey Lynn
    • H01R9/11H01R13/115H01R4/20
    • H01R4/20H01R4/02
    • A solder cup (24) adapted to be secured to the shank (44) of a contact (22) received in a connector (20) has a generally cylindrical body having a bore (90) sized to receive the shank (44) of the contact (22) therein. The body has at least one retention feature (108) proximate a first end (92) that defines an effective diameter within the bore (90) that is less than the cross section measurement of the shank (44) of a contact (22) to be received therein. Upon insertion of the shank (44) of a contact (22) into the bore (90) of the solder cup (24), an interference fit is achieved between the shank (44) and retention features (108) of the solder cup (24) to provide electrical engagement therebetween and to secure the solder cup (24) on the shank (44).
    • 适于固定到容纳在连接器(20)中的触头(22)的柄部(44)的焊料杯(24)具有大体上圆柱形的本体,该本体具有孔(90),该孔的尺寸设定成容纳 接触(22)在其中。 本体具有至少一个靠近第一端部(92)的保持特征(108),该第一端部限定孔(90)内的有效直径,其小于触头(22)至 被收到其中。 在将触点(22)的柄部(44)插入焊料杯(24)的孔(90)中时,在焊料杯(44)和保持部件(108)之间实现干涉配合 24)以在其间提供电接合并将焊料杯(24)固定在柄部(44)上。