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1. 发明公开

EP0510808A2 Press fit solder cup 失效
标题翻译： Einpress-Lötkelch。
公开(公告)号：EP0510808A2
公开(公告)日：1992-10-28
申请号：EP92302442.6
申请日：1992-03-20
申请人： THE WHITAKER CORPORATION
发明人： Dorwart, Charles Edward, Jr. , Parker, William Theodore , Showers, Jeffrey Lynn
IPC分类号： H01R9/11 , H01R13/115 , H01R4/20
CPC分类号： H01R4/20 , H01R4/02
摘要： A solder cup (24) adapted to be secured to the shank (44) of a contact (22) received in a connector (20) has a generally cylindrical body having a bore (90) sized to receive the shank (44) of the contact (22) therein. The body has at least one retention feature (108) proximate a first end (92) that defines an effective diameter within the bore (90) that is less than the cross section measurement of the shank (44) of a contact (22) to be received therein. Upon insertion of the shank (44) of a contact (22) into the bore (90) of the solder cup (24), an interference fit is achieved between the shank (44) and retention features (108) of the solder cup (24) to provide electrical engagement therebetween and to secure the solder cup (24) on the shank (44).
摘要翻译：适于固定到容纳在连接器（20）中的接触件（22）的柄部（44）的焊杯（24）具有大致圆柱形的主体，该主体具有孔（90），其尺寸适于接纳触点（22）。本体具有靠近第一端（92）的至少一个保持特征（108），该保持特征限定孔（90）内的有效直径小于接触件（22）的柄部（44）的截面测量在其中收到。在将触点（22）的柄（44）插入焊杯（24）的孔（90）中之后，在柄（44）和焊杯（44）的保持特征（108）之间实现过盈配合 24）以在其间提供电接合并且将焊杯（24）固定在柄部（44）上。

2. 发明公开

EP0510808A3 Press fit solder cup 失效
标题翻译：压配合锡杯
公开(公告)号：EP0510808A3
公开(公告)日：1993-06-16
申请号：EP92302442.6
申请日：1992-03-20
申请人： THE WHITAKER CORPORATION
发明人： Dorwart, Charles Edward, Jr. , Parker, William Theodore , Showers, Jeffrey Lynn
IPC分类号： H01R9/11 , H01R13/115 , H01R4/20
CPC分类号： H01R4/20 , H01R4/02
摘要： A solder cup (24) adapted to be secured to the shank (44) of a contact (22) received in a connector (20) has a generally cylindrical body having a bore (90) sized to receive the shank (44) of the contact (22) therein. The body has at least one retention feature (108) proximate a first end (92) that defines an effective diameter within the bore (90) that is less than the cross section measurement of the shank (44) of a contact (22) to be received therein. Upon insertion of the shank (44) of a contact (22) into the bore (90) of the solder cup (24), an interference fit is achieved between the shank (44) and retention features (108) of the solder cup (24) to provide electrical engagement therebetween and to secure the solder cup (24) on the shank (44).
摘要翻译：适于固定到容纳在连接器（20）中的触头（22）的柄部（44）的焊料杯（24）具有大体上圆柱形的本体，该本体具有孔（90），该孔的尺寸设定成容纳接触（22）在其中。本体具有至少一个靠近第一端部（92）的保持特征（108），该第一端部限定孔（90）内的有效直径，其小于触头（22）至被收到其中。在将触点（22）的柄部（44）插入焊料杯（24）的孔（90）中时，在焊料杯（44）和保持部件（108）之间实现干涉配合 24）以在其间提供电接合并将焊料杯（24）固定在柄部（44）上。

3. 发明授权

EP0510808B1 Press fit solder cup 失效
标题翻译：压接焊杯
公开(公告)号：EP0510808B1
公开(公告)日：1996-08-14
申请号：EP92302442.6
申请日：1992-03-20
申请人： THE WHITAKER CORPORATION
发明人： Dorwart, Charles Edward, Jr. , Parker, William Theodore , Showers, Jeffrey Lynn
IPC分类号： H01R9/11 , H01R13/115 , H01R4/20
CPC分类号： H01R4/20 , H01R4/02

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