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    • 4. 发明公开
    • ELECTRON TUBE
    • ELEKTRONENRÖHRE
    • EP1154457A4
    • 2003-01-22
    • EP99900652
    • 1999-01-21
    • HAMAMATSU PHOTONICS KK
    • SUYAMA MOTOHIROKAGEYAMA AKIHIROMURAMATSU MASAHARU
    • H01J29/92H01J31/26H01J31/49H01J29/44H01L27/14
    • H01J31/26H01J29/92H01J31/49H01J2229/922H01J2231/50068
    • In an electron tube (1), a space (S) between the periphery (15b) of a semiconductor device (15) and a stem (11) is filled with an insulating resin (20). Therefore, the insulating resin (20) functions as a reinforcing member even during the assembly of the electron tube (1) under high-temperature condition, thereby preventing a bump (16) from coming off a bump connection part (19). Since the space (S) is only partly closed by the resin (20), the space between the semiconductor device (15) and the stem (11) is ensured a ventilability. That is, no air reservoir is formed between an electron incidence part (15a) at the center of the semiconductor device (15) and the surface (C) of the stem (11), whereby air expanding at high temperature does not damage the electron incidence part (15a) of the back-incidence semiconductor device (15).
    • 在电子管(1)中,用绝缘树脂(20)填充半导体器件(15)的周边(15b)和芯柱(11)之间的空间(S)。 因此,即使在高温条件下组装电子管(1)期间,绝缘树脂(20)也用作加强件,从而防止凸起(16)从凸起连接部分(19)脱落。 由于空间(S)仅被树脂(20)部分地封闭,所以半导体器件(15)与芯柱(11)之间的空间确保了通风性。 也就是说,在半导体器件(15)的中心处的电子入射部分(15a)和杆(11)的表面(C)之间不形成储气器,由此在高温下膨胀的空气不会损坏电子 背入射半导体器件(15)的入射部分(15a)。
    • 10. 发明公开
    • ELECTRON TUBE
    • ELEKTRONENSTRAHLRÖHRE
    • EP1152448A1
    • 2001-11-07
    • EP99901128.1
    • 1999-01-21
    • Hamamatsu Photonics K.K.
    • SUYAMA, MotohiroKAGEYAMA, AkihiroMURAMATSU, Masaharu
    • H01J29/44H01J31/26H01J31/49H01L27/148
    • H01J31/26H01J31/49H01J2231/50073
    • An electron tube 10 mainly includes a sleeve 12, an input plate 14 having a photocathode surface 18, a stem 16 and a CCD 20. A vacuum is provided in an interior of the electron tube 10. The CCD 20 is fixed onto the stem such that a rear surface B faces the photocathode surface 18. In the CCD 20, on a single conductive type semiconductor substrate 64, a buried layer 66, a barrier region 68, a SiO 2 layer 70, a storage electrode layer 72, a transmission electrode layer 74, and a barrier electrode layer 76 are formed at their predetermined positions. A PSG film 78 is formed at an entire front surface A over these layers to flatten the surface of the CCD 20. Further, SiN film 106 mainly composed of SiN is formed above the PSG film over the entire front surface A.
    • 电子管10主要包括套筒12,具有光电阴极表面18的输入板14,杆16和CCD 20.在电子管10的内部设有真空。CCD 20固定在杆上 后表面B面对光电阴极表面18.在CCD 20中,在单个导电型半导体衬底64上,埋层66,势垒区68,SiO 2层70,存储电极层72,透射电极层 74和阻挡电极层76形成在其预定位置。 在这些层的整个前表面A上形成PSG膜78,以平坦化CCD 20的表面。此外,在整个前表面A上形成主要由SiN构成的SiN膜106在PSG膜之上。