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1. 发明公开

EP2697824A1 VORRICHTUNG UND VERFAHREN ZUM ÜBERTRAGEN ELEKTRONISCHER BAUTEILE VON EINEM ERSTEN TRÄGER ZU EINEM ZWEITEN TRÄGER 有权转让
标题翻译：装置和方法，用于传输第一载波电子元器件第二载波
公开(公告)号：EP2697824A1
公开(公告)日：2014-02-19
申请号：EP12714231.3
申请日：2012-04-12
申请人： Mühlbauer AG
发明人： COURTS, Thomas , NIKLAS, Sigmund , SCHILLER, Gerhard , DOGARIU, Markus
IPC分类号： H01L21/67
CPC分类号： B65G47/53 , B32B38/10 , B32B43/006 , H01L21/67132 , Y10T156/1132 , Y10T156/1179 , Y10T156/1944 , Y10T156/1983
摘要： The aim of the invention relates to a device for transferring electronic components from a first carrier to a second carrier. At least one slide is connected to a slide-actuator. A cap comprises a support, a slide channel for the at least one slide, and a gripping device for the first carrier. A first receiving portion is designed to position the first carrier on the support, wherein the electronic components are provided on a side of the first carrier, which faces away from the support. A second receiving portion is designed to position the second carrier. The first receiving portion and the second receiving portion are arranged with respect to each other in such a manner that a gap separates the first carrier from the second carrier. In addition, the cap and/or the second receiving portion are designed so that it is possible to move from a first position into a second position, so that the gap between the first carrier and the second carrier becomes smaller. The at least one slide is designed so that it can be moved by the at least one slide-actuator relative to the support, to lift the first carrier, which is applied against the support, away from the support, and to move an electronic component provided on the first carrier, in the direction of the second carrier. In addition, the gripper device is designed to convey the first carrier to the support, in order to separate the electronic component from the first carrier.

2. 发明公开

EP2080220A1 FIXED JIG, CHIP PICKUP METHOD AND CHIP PICKUP APPARATUS 审中-公开
标题翻译：盛宴EINSPANNUNGSVORRICHTUNG，CHIP摄像处理芯片拾取装置
公开(公告)号：EP2080220A1
公开(公告)日：2009-07-22
申请号：EP07829746.2
申请日：2007-10-12
申请人： Lintec Corporation
发明人： WATANABE, Kenichi , SEGAWA, Takeshi , FUJIMOTO, Hironobu
IPC分类号： H01L21/683 , H01L21/301 , H01L21/52 , H01L21/67
CPC分类号： H01L21/6838 , H01L21/67132 , Y10S156/941 , Y10T156/1132 , Y10T156/1168 , Y10T156/1944 , Y10T156/1978
摘要： [PROBLEMS] To provide a fixed jig which can unmovably suck a chip group produced by segmenting a semiconductor wafer, and can suck one chip by stripping the chip selectively and surely from the chip group. [MEANS FOR SOLVING PROBLEMS] A fixed jig (3) is composed of a jig base (30) and an adhesion layer (31). A recess (2) is provided on one side of the jig base (30). The recess (2) is sectioned into small chambers (15) by a partition (12) of the substantially same height as that of a sidewall (35). The sidewall (35) is provided to cover the recess (2), and the adhesion layer (31) is provided on the upper edge of the partition (12). A through hole (17) communicating with the outside is formed in each small chamber (15).

3. 发明授权

EP1587138B1 Einrichtung für die Montage von Halbleiterchips und Verfahren zum Ablösen eines Halbleiterchips von einer Folie 有权
标题翻译：装置，用于安装半导体芯片和方法，用于从箔材分离的半导体芯片
公开(公告)号：EP1587138B1
公开(公告)日：2007-05-30
申请号：EP04106169.8
申请日：2004-11-29
申请人： Oerlikon Assembly Equipment AG, Steinhausen
发明人： Medding, Jonathan , Stalder, Roland , Lustenberger, Martina , Niederhauser, Marcel , Schnetzler, Daniel
IPC分类号： H01L21/68 , H01L21/00
CPC分类号： H01L21/67132 , H01L21/68 , H01L2221/6839 , Y10T156/1121 , Y10T156/1132 , Y10T156/1922 , Y10T156/1944

4. 发明公开

EP1754249A1 VERFAHREN UND VORRICHUNG ZUM ABLÖSEN EINES AUF EINE FLEXIBLE FOLIE GEKLEBTEN BAUTEILS 审中-公开
标题翻译：方法和VORRICHUNG用于去除柔性膜上粘COMPONENT
公开(公告)号：EP1754249A1
公开(公告)日：2007-02-21
申请号：EP04804931.6
申请日：2004-12-17
申请人： Alphasem AG
发明人： TRINKS, Joachim , MARTE, Andreas , HERBST, Wolfgang
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , Y10S438/976 , Y10T156/1132 , Y10T156/1944
摘要： The invention relates to a film (2) which comprises a component (1) to be detached therefrom. Said film is placed in the area of the component on a detaching tool (5) that is provided with at least one supporting element (6) for the film, which extends in a plane of support (11). The film is sucked against the support element (6) and partially under the plane of support by exerting negative pressure. The area of the supporting element is provided with at least one surface section (8) which extends in the plane of support when the detaching process begins, and which can be displaced, once the component (1) is grasped by a suction tool (4), plane-parallel to the plane of support while the negative pressure is maintained. The invention allows to control the detaching process of the film in a controlled movement without damaging or displacing the component.

5. 发明公开

EP1665364A2 APPARATUS AND METHOD FOR REMOVING SEMICONDUCTOR CHIP 有权
标题翻译：装置和方法用于移除半导体芯片
公开(公告)号：EP1665364A2
公开(公告)日：2006-06-07
申请号：EP04772963.7
申请日：2004-09-07
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： KABESHITA, Akira, c/o Matsushita Electric Ind.Co.L , HAMASAKI, Kurayasu, c/o Matsushita Electric Ind. C , MINAMITANI, Shozo, c/o Matsushita Electric Ind.d , MAKINO, Yoichi, c/o Matsushita Electric Ind. Co. , TANI, Noriyuki, c/o Matsushita Electric Ind. Co.
IPC分类号： H01L21/68
CPC分类号： H01L21/67132 , Y10T156/1132 , Y10T156/1944
摘要： While a vicinity of a bottom surface-side region of a pressure-sensitive adhesive sheet (3) corresponding to an adhesion region (R1) of a semiconductor chip (1) are sucked and held, a plurality of protruding portions (30) of a removing member (21) are brought into contact with the bottom surface of the semiconductor chip through the adhesive sheet at the region. Also, the adhesive sheet is sucked in between the respective protruding portions so as to change a surface bonding of the semiconductor chip to the adhesive sheet by adhesion to a point bonding, and further the removing member is moved along the bottom surface of the semiconductor chip so as to change a position of the point bonding and decrease bonding force to the adhesive sheet by the adhesion. Then, the semiconductor chip is removed from the adhesive sheet.

6. 发明公开

EP1324294A2 Method for disassembling image display apparatus and for producing image display apparatus support member 审中-公开
标题翻译：一种用于图像显示装置的分解和用于制造安装装置用于图像显示设备的过程
公开(公告)号：EP1324294A2
公开(公告)日：2003-07-02
申请号：EP02028871.8
申请日：2002-12-23
申请人： CANON KABUSHIKI KAISHA
发明人： Tajima, Hisao, c/oCanon Kabushiki Kaisha
IPC分类号： G09F7/18 , G09F9/30
CPC分类号： G09F7/18 , Y10T29/49821 , Y10T29/53274 , Y10T156/1059 , Y10T156/11 , Y10T156/1132 , Y10T156/1184 , Y10T156/1189
摘要： The invention provides a disassembling method for an image display apparatus, a producing method for an image display apparatus, a producing method for a support member and an image display unit, and a producing method for a working material. In particular, there is disclosed a configuration in which the disassembling of the image display apparatus is executed by inserting a substance between the image display unit and the support member.
摘要翻译：本发明提供了一种图像显示设备，用于产生图像显示设备，用于生产支撑构件和图像显示单元，以及一种用于制造加工材料的方法的方法的方法的拆卸方法。特别是，有盘在游离缺失了图像显示装置的拆卸是通过将图像显示单元和所述支撑构件之间的物质所执行的配置。

7. 发明公开

EP0884766A3 Method of die bonding electronic component and die bonding apparatus therefor 失效
标题翻译： Befestigungsverfahren und -einrichtungfürelektronischen Bauelements
公开(公告)号：EP0884766A3
公开(公告)日：2000-09-20
申请号：EP98304634.3
申请日：1998-06-11
申请人： Lintec Corporation
发明人： Tsujimoto, Masaki , Kobayashi, Kenji
IPC分类号： H01L21/00 , H01L21/78
CPC分类号： H01L21/6836 , H01L21/67132 , H01L2221/68327 , Y10S156/941 , Y10T29/49819 , Y10T29/49821 , Y10T29/49822 , Y10T156/11 , Y10T156/1132 , Y10T156/19
摘要： A method of die bonding electronic components in which a wafer (14) is mounted on a dicing tape (17) which comprises at least one layer of shrink film (21) and a pressure sensitive adhesive layer (22). The wafer is stuck to the pressure sensitive adhesive layer and diced into chips (16). The dicing tape (17) is then heated to cause the area of adhesion to shrink and to thereby decrease the adhesive strength between the chips and the adhesive layer. The chips (16), which are arranged at predetermined spacings, are then sucked one at a time by a suction collet (19) disposed above the chips to separate them from each other. The invention also provides an apparatus therefor. This method enables effective die bonding without damaging the chips.
摘要翻译：一种将包含至少一层收缩膜（21）和压敏粘合剂层（22）的切片胶带（17）上的晶片（14）的芯片接合电子部件的方法。将晶片粘贴到压敏粘合剂层并切成芯片（16）。然后加热切割胶带（17），使得粘合区域收缩，从而降低芯片和粘合剂层之间的粘合强度。以预定间隔布置的芯片（16）然后通过设置在芯片上方的吸入夹头（19）一次吸入，以使它们彼此分离。本发明还提供了一种装置。该方法能够有效地进行芯片接合而不损坏芯片。

8. 发明公开

EP0584021A1 Apparatus and method for label application using bernoulli effect 失效
标题翻译： Vorrichtung und Verfahren zum Etikettieren unter Ausnutzung des Bernoulli-Effekts。
公开(公告)号：EP0584021A1
公开(公告)日：1994-02-23
申请号：EP93420317.5
申请日：1993-07-23
申请人： EASTMAN KODAK COMPANY
发明人： Yokajty, Joseph Edward, c/o Eastman Kodak Comp.
IPC分类号： B65C9/18
CPC分类号： B65C9/28 , B65C9/0006 , B65C9/1815 , B65C9/1884 , Y10T156/1132 , Y10T156/171 , Y10T156/1768
摘要： A labeller head using the Bernoulli Effect is suited for applying thin, flexible, pressure sensitive labels (14, 106) of the type having a first, display side and a second, adhesive side, and includes a body having a rigid or resilient support surface (52, 64, 102, 104); a plenum (54) within the body; a plurality of bores (56, 74, 86-90, 114) extending from the plenum through the support surface, the bores being angled with respect to the support surface and arranged in an array so that jets of gas issuing from the array will cause the label to be drawn onto the support surface when the label is presented to the support surface and the first, display side is brought into close proximity of the jets, thereby causing a zone of reduced gas pressure to be formed between the support surface and the first, display side and establishing a pressure differential across the label to hold the label on a film of gas flowing over the support surface; a source of pressurized gas (58) for directing gas into the plenum and through the angled bores; and stops (60, 66, 76, 108-112) for stopping movement of the label relative to the support surface, each of the jets of gas issuing from the support surface being directed at least partially toward the stops. A corresponding method for applying a label is taught.
摘要翻译：使用伯努利效应的贴标头适用于施加具有第一显示侧和第二粘合剂侧的类型的薄柔性压敏标签（14,106），并且包括具有刚性或弹性支撑表面的主体（52,64,102,104）; 身体内的一个通气室（54）从气室经支撑表面延伸的多个孔（56,74,86-90,114），孔相对于支撑表面成角度并且排列成阵列，使得从阵列发出的气体喷射将导致当将标签呈现在支撑表面上时，被拉到支撑表面上的标签，并且第一显示侧被紧密地接近喷射，从而在支撑表面和支撑表面之间形成气压降低的区域首先是显示侧，并在标签上建立压力差，以将标签保持在在支撑表面上流动的气体膜上; 加压气体源（58），用于将气体引导到气室中并通过倾斜的孔; 并且停止（60,66,76,108-112）以停止标签相对于支撑表面的移动，从支撑表面发出的每个气体喷射部至少部分地朝向止挡件。教导了应用标签的相应方法。

9. 发明公开

EP2541587A4 SUBSTRATE SEPARATION DEVICE, LOAD LOCK DEVICE, SUBSTRATE ADHESION DEVICE AND SUBSTRATE SEPARATION METHOD 有权转让
标题翻译：基底分离装置，锁定装置，基板安装装置及基板分离
公开(公告)号：EP2541587A4
公开(公告)日：2017-04-05
申请号：EP11747064
申请日：2011-02-25
申请人： NIPPON KOGAKU KK
发明人： TANAKA KEIICHI , YOSHIHASHI MASAHIRO
IPC分类号： H01L21/02 , H01L21/67 , H01L21/683 , H01L21/687
CPC分类号： H01L21/67092 , H01L21/67748 , H01L21/68742 , Y10S156/932 , Y10S156/943 , Y10T156/11 , Y10T156/1132 , Y10T156/1168 , Y10T156/1179 , Y10T156/1189 , Y10T156/19 , Y10T156/1944 , Y10T156/1972 , Y10T156/1983
摘要： A substrate separating method includes: holding, in a predetermined position, a substrate sandwiched between a first holder and a second holder opposed to cach other; and relatively moving the first holder and the second holder while the substrate is held in the predetermined position. In holding the substrate, the substrate may be held in the predetermined position by effecting a pressurizing force or a suction force onto the substrate. Also in holding the substrate, the substrate may be held in contact with one of the first holder and the second holder.

10. 发明公开

EP3020066A1 VORRICHTUNG ZUM ENTFERNEN EINES RINGFÖRMIGEN VERSTÄRKUNGSRANDS VON EINEM GESCHLIFFENEN HALBLEITERWAFER 有权转让
标题翻译：装置脱除研磨的半导体晶片的环形增益HEM
公开(公告)号：EP3020066A1
公开(公告)日：2016-05-18
申请号：EP14744291.7
申请日：2014-07-10
申请人： Mechatronic Systemtechnik GmbH
发明人： SCHOBER, Walter
IPC分类号： H01L21/67
CPC分类号： H01L21/67132 , B32B38/10 , B32B43/006 , H01L21/67092 , H01L21/67115 , H01L21/6836 , H01L2221/68381 , Y10T156/1132 , Y10T156/1158 , Y10T156/1184 , Y10T156/1917 , Y10T156/1944 , Y10T156/1967
摘要： What is disclosed is an apparatus (1) for removing a ring-shaped reinforcement edge (2) from a ground semiconductor wafer (3), which is cohesively connected to an elastic carrier film (4) and is fixed to a circumferential wafer frame (11) via said carrier film (4), comprising a holding device (7), which has a support (8) having suction openings (9) for holding the semiconductor wafer (3) on the support surface (16) of the support (8), and comprising a separating device (6), which comprises means for integrally detaching the reinforcement edge (2) from the carrier film (4). In order to be able to detach the reinforcement edge from the carrier film (4) without damage, it is proposed that the holder device (7) has a clamping device (10) encompassing the support (8) and serving for clamping the wafer frame (11) and/or the carrier film (4), wherein the clamping device (10) interacts with the support (8) to stretch the carrier film (4), and that the separating device (6) has a tool guide (13) with a dividing tool (12) for moving the dividing tool (12) between carrier film (4) and reinforcement edge (2) in order to detach the reinforcement edge (2) in one piece from the carrier film (4) stretched by interaction of clamping device (10) and support (8).

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