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1. 发明公开

EP2645830A1 Method for manufacture of fine line circuitry 有权
标题翻译： HerstellungsverfahrenfürSchaltungen mit feinen Linien
公开(公告)号：EP2645830A1
公开(公告)日：2013-10-02
申请号：EP12075035.1
申请日：2012-03-29
申请人： Atotech Deutschland GmbH
发明人： Nichols, Richard , Jang, Don , Riebel, Harald , Brüning, Frank, Dr.
IPC分类号： H05K3/42 , H05K3/46 , C23C18/20
CPC分类号： H05K3/387 , C23C18/1653 , C23C18/2006 , C23C18/2066 , C23C18/30 , C23C18/40 , C23C18/405 , C25D3/38 , C25D5/022 , C25D5/56 , C25D7/00 , C25D7/06 , H05K3/06 , H05K3/108 , H05K3/381 , H05K3/388 , H05K3/389 , H05K3/421 , H05K3/4644 , H05K2203/0789 , H05K2203/0793 , H05K2203/0796
摘要： The present invention relates to a method for manufacture of fine line circuitry in the manufacture of printed circuit boards, IC substrates and the like. The method utilizes a first conductive layer (10) on the smooth surface of a build-up layer (1) and a second conductive layer (11) selected from electrically conductive polymers, colloidal noble metals and electrically conductive carbon particles on the roughened walls of at least one opening which are formed after depositing the first conductive layer.
摘要翻译：本发明涉及制造印刷电路板，IC基板等中的细线电路的制造方法。该方法利用在积层（1）的光滑表面上的第一导电层（10）和选自导电聚合物，胶体贵金属和导电碳颗粒的第二导电层（11）在沉积第一导电层之后形成的至少一个开口。

2. 发明公开

EP2594662A1 Aqueous composition for etching of copper and copper alloys 有权
标题翻译： WässrigeZusammensetzung zurÄtzungvon Kupfer und Kupferlegierungen
公开(公告)号：EP2594662A1
公开(公告)日：2013-05-22
申请号：EP11189954.8
申请日：2011-11-21
申请人： Atotech Deutschland GmbH
发明人： Lützow, Dr. Norbert , Thoms, Martin , Exner, Anika , Kloppisch, Mirko
IPC分类号： C23F1/18 , C23F1/46 , C23F1/44 , H05K3/06 , H05K3/10 , H01L21/3213
CPC分类号： C23F1/18 , C23F1/44 , C23F1/46 , C25D5/34 , H01L21/32134 , H05K3/067 , H05K3/108 , H05K2203/0789
摘要： The present invention relates to an aqueous composition and a process for etching of copper and copper alloys. The aqueous composition comprises Fe 3+ ions, an acid and a N-alkoxylated polyamide. The aqueous composition is particularly useful for making of fine structures in the manufacture of printed circuit boards, IC substrates and the like.
摘要翻译：本发明涉及一种水性组合物和一种用于蚀刻铜和铜合金的方法。含水组合物包含Fe 3+离子，酸和N-烷氧基化聚酰胺。含水组合物特别可用于制造印刷电路板，IC基板等中的精细结构。

3. 发明授权

EP1716949B1 Immersion method 有权
标题翻译：浸泡法
公开(公告)号：EP1716949B1
公开(公告)日：2008-08-27
申请号：EP06252129.9
申请日：2006-04-19
申请人： Rohm and Haas Electronic Materials, L.L.C.
发明人： Lau, Danny , Kwok, Raymund W. M. , Ting, Fai Lung , Crosby, Jeffrey N.
IPC分类号： B23B15/00 , C07F9/06 , C23F11/00 , C23C22/00
CPC分类号： C23F11/167 , C23C22/08 , C23C22/74 , C23C22/82 , C25D5/48 , H01L2224/48247 , H01L2224/85011 , H05K3/244 , H05K3/282 , H05K2203/0789

4. 发明公开

EP1879436A2 Method for manufacturing a composite of copper and resin 有权
标题翻译： Verfahren zur Herstellung eines Halbleitersubstrate mit Kupfer Leitungen
公开(公告)号：EP1879436A2
公开(公告)日：2008-01-16
申请号：EP07112480.4
申请日：2007-07-13
申请人： Rohm and Haas Electronic Materials LLC
发明人： Kondo, Masaki
IPC分类号： H05K3/42 , H05K3/26
CPC分类号： H05K3/421 , H05K3/0055 , H05K2203/0315 , H05K2203/0789 , H05K2203/1157
摘要： A metallic copper and resin composite body manufacturing method of forming a copper wiring layer that forms an inner layer circuit, establishing an insulating layer with a resin on said wiring layer, forming via holes which expose the copper surface under the insulative layer, and depositing a metal on the copper surface that is exposed at the bottom of the via holes. The method includes a step of: removing copper oxide which forms on the surface of the copper that is exposed in the bottom of the via holes using a phosphoric acid aqueous solution with a pH between 1 and 3. The method suppresses haloing is and via holes with excellent solder bonding are formed.
摘要翻译：一种金属铜和树脂复合体制造方法，其形成形成内层电路的铜布线层，在所述布线层上建立树脂绝缘层，形成在绝缘层下露出铜表面的通孔，在通孔底部暴露的铜表面上的金属。该方法包括以下步骤：使用pH在1和3之间的磷酸水溶液去除在孔的底部暴露于铜的表面上形成的氧化铜。该方法抑制晕圈和通孔形成了良好的焊接。

5. 发明授权

EP1069209B1 Process for plating plastics using a catalytic filler 有权
标题翻译：使用填充katalitischen电镀塑料的方法
公开(公告)号：EP1069209B1
公开(公告)日：2004-10-06
申请号：EP99202376.2
申请日：1999-07-16
申请人： Enthone-OMI (Benelux) B.V.
发明人： Hartogs, Matty J. , Pingler, Uwe , Heyer, Joachim , Hendriks, Jan J.M.
IPC分类号： C23C18/16
CPC分类号： C23C18/22 , C23C18/1641 , C23C18/2086 , H05K3/181 , H05K2201/0236 , H05K2203/0789 , H05K2203/0793

6. 发明公开

EP1209253A3 Process for treating adhesion promoted metal surfaces with epoxy resins 审中-公开
标题翻译：一种用于与环氧树脂治疗以及附着金属表面的方法
公开(公告)号：EP1209253A3
公开(公告)日：2004-02-25
申请号：EP01309899.1
申请日：2001-11-23
申请人： Shipley Co. L.L.C.
发明人： Montano, Joseph R. , Shelnut, James G.
IPC分类号： C23C22/52 , C23F1/18 , B05D7/14
CPC分类号： C23C22/83 , B05D7/14 , B05D7/148 , C08L63/00 , C09J5/02 , C09J2400/163 , C09J2463/00 , C23C22/52 , C23F1/18 , H05K3/383 , H05K3/385 , H05K3/386 , H05K3/4626 , H05K2201/0355 , H05K2201/0358 , H05K2203/0759 , H05K2203/0789 , H05K2203/0796 , H05K2203/124
摘要： A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material, The method involves post-treating the micro-roughened conversion coated metal surface with an epoxy resin composition after having formed the micro-roughened conversion coated metal surface with an adhesion promotion composition, The method can be employed in the circuit board industry to improve bonding between innerlayers in a multiplayer circuit board.

7. 发明公开

EP1331287A2 Treating metal surfaces with a modified oxide replacement composition 审中-公开
标题翻译： on zen zen zen zen zen zen zen zen zen zen zen zen zen zen zen
公开(公告)号：EP1331287A2
公开(公告)日：2003-07-30
申请号：EP03250467.2
申请日：2003-01-24
申请人： Shipley Co. L.L.C.
发明人： Bayes, Martin W.
IPC分类号： C23C22/52 , C23F1/18 , H05K3/38
CPC分类号： C23F1/18 , C23C22/52 , H05K3/064 , H05K3/383 , H05K2203/0789 , H05K2203/0796 , H05K2203/124
摘要： A method for treating a metal surface to microroughen the metal surface without forming a reddish brown to black oxide film on the metal surface. Modified oxide replacement compositions derived from oxide replacement compositions are prepared by altering the amount of at least one component in the oxide replacement composition to a level above or below an optimized amount of that component in the oxide replacement composition. The modified oxide replacement composition is then used to microroughen a metal surface without the oxide film forming on the metal. A temporary photoresist may be laminated on the treated metal surface and portions of the photorcist developed and stripped from the metal without concern for resist lock-in occurring.
摘要翻译：一种用于处理金属表面以使金属表面微反应而不在金属表面上形成红棕色至黑色氧化物膜的方法。通过将氧化物置换组合物中的至少一种组分的量改变至高于或低于氧化物置换组合物中该组分的优化量的水平来制备由氧化物置换组合物衍生的改性氧化物替代组合物。然后将修饰的氧化物置换组合物用于微金属表面，而不在金属上形成氧化膜。临时光致抗蚀剂可以层压在经处理的金属表面上，并且光电子体的部分从金属显影和剥离，而不用担心发生抗蚀剂锁定。

8. 发明公开

EP1209253A2 Process for treating adhesion promoted metal surfaces with epoxy resins 审中-公开
标题翻译：维尔法赫恩zur Behandlung von gut haftendenMetalloberflächenmit Epoxidharzen
公开(公告)号：EP1209253A2
公开(公告)日：2002-05-29
申请号：EP01309899.1
申请日：2001-11-23
申请人： Shipley Co. L.L.C.
发明人： Montano, Joseph R. , Shelnut, James G.
IPC分类号： C23C22/52 , C23F1/18 , B05D7/14
CPC分类号： C23C22/83 , B05D7/14 , B05D7/148 , C08L63/00 , C09J5/02 , C09J2400/163 , C09J2463/00 , C23C22/52 , C23F1/18 , H05K3/383 , H05K3/385 , H05K3/386 , H05K3/4626 , H05K2201/0355 , H05K2201/0358 , H05K2203/0759 , H05K2203/0789 , H05K2203/0796 , H05K2203/124
摘要： A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material, The method involves post-treating the micro-roughened conversion coated metal surface with an epoxy resin composition after having formed the micro-roughened conversion coated metal surface with an adhesion promotion composition, The method can be employed in the circuit board industry to improve bonding between innerlayers in a multiplayer circuit board.
摘要翻译：一种用于处理微粗化金属表面以改善金属表面和聚合物材料之间的结合的方法。该方法包括在形成微粗糙化转化涂层之后用环氧树脂组合物对微粗糙化转化涂覆的金属表面进行后处理具有粘附促进组合物的金属表面。该方法可用于电路板工业中，以改善多层电路板中的内层之间的结合。

9. 发明授权

EP0766908B1 VERFAHREN UND VORRICHTUNG ZUM BESCHICHTEN VON LEITERPLATTEN, INSBESONDERE ZUR HERSTELLUNG VON MULTI-CHIP-MODULEN 失效
标题翻译：方法和装置涂层印刷电路板，特别适合多芯片模块生产
公开(公告)号：EP0766908B1
公开(公告)日：1998-12-16
申请号：EP95923327.1
申请日：1995-06-14
申请人： Schäfer, Hans-Jürgen, Dipl.-Ing.
发明人： Schäfer, Hans-Jürgen, Dipl.-Ing.
IPC分类号： H05K3/00 , G03F7/16
CPC分类号： G03F7/168 , B05C1/006 , B05C1/0808 , G03F7/16 , H01L21/4857 , H05K3/0023 , H05K3/0091 , H05K3/108 , H05K3/181 , H05K3/227 , H05K3/4644 , H05K3/4661 , H05K2201/0209 , H05K2203/0143 , H05K2203/0773 , H05K2203/0789 , H05K2203/081 , H05K2203/1105 , H05K2203/1121 , H05K2203/1509 , H05K2203/1572
摘要： Described is a method of coating printed-circuit boards with a photo-crosslinkable coating material using a roller coating technique, as well as a device for carrying out the method and the further processing of the circuit boards to multi-chip modules. The method is characterized by the following operations: a photopolymerizable 70 to 95 % by wt. coating material containing 10 to 60 % by wt. of acid-soluble filler is held by means of a heated metering roller (3, 4) at a viscosity of 1 to 10 Pa.s and applied to circuit boards at a viscosity of 20 to 100 Pa.s by an application roller (1, 2) cooled to 5 to 20 °C to give a coat 10 to 200 νm thick. For the manufacture of multi-chip modules, 50 νm microholes are formed, over the conductor paths, in a coat of thickness 100 νm by photolithographs, the coat roughened with acid, the inside walls of the holes and the coat metallized with copper using an electrochemical technique and 100- to 200-νm-wide IC terminals produced, after the photo-lithography and electrochemical strengthening operations, by differential etching. The coated circuit boards are dried with a laminar-flow IR/convection drier with a 20- to 100-mm-high drying channel covered with panes of quartz glass, air being blown through the channel in countercurrent flow at a speed greater than 5 m/s and IR radiators being fitted above and below the drying channel in such a way that their position can be adjusted both horizontally and vertically to create a particular temperature profile.

10. 发明公开

EP0834391A1 PROCESS FOR PRODUCING RESIN MOLDING HAVING MINUTE CAVITIES ON THE SURFACE 失效
标题翻译： VERFAHREN ZUM HERSTELLEN VONKUNSTHARZGEGENSTÄNDENMITMIKROHOHLRÄUMENAN DEROBERFLÄCHE
公开(公告)号：EP0834391A1
公开(公告)日：1998-04-08
申请号：EP96907683.5
申请日：1996-03-28
申请人： National Starch and Chemical Investment Holding Corporation
发明人： KINASHI, Keiichi , CHIBA, Reiko , HAGIWARA, Yoshichi
IPC分类号： B29C69/00 , H05K3/38 , C25D5/56
CPC分类号： B29C59/00 , B29C70/64 , B29C2059/023 , B29C2791/001 , H05K3/0023 , H05K3/381 , H05K3/4661 , H05K2201/0209 , H05K2201/0212 , H05K2203/0773 , H05K2203/0789 , H05K2203/0796
摘要： The purpose of the present invention is to provide a method which is suitable for roughing the surface of a resin form, particularly a method suitable for certainly roughening the surface of an interlayer insulating resin for a multilayer printed circuit board to be prepared by a "build-up" method.
The process of the present invention comprises molding a mixture comprising chemical-soluble powder formulated in a resin composition, treating the surface layer of thus obtained resin form with a chemical solution that can dissolve the resin to remove the surface layer of the resin and to expose on the surface of the form at least a part of the powder contained in the form, and subsequently treating the surface with a chemical solution that can dissolve the powder to remove the powder exposed on the surface.
摘要翻译：本发明的目的是提供一种适用于对树脂表面进行粗加工的方法，特别是适用于通过“构建”制备的多层印刷电路板的层间绝缘树脂的表面确实粗糙化的方法 -up“方法。本发明的方法包括将包含配制在树脂组合物中的化学溶解性粉末的混合物成型，用可溶解树脂的化学溶液处理由此获得的树脂形式的表面层以除去树脂的表面层并暴露在形式的表面上形成包含在该形式中的至少一部分粉末，随后用可溶解粉末的化学溶液处理表面以除去暴露在表面上的粉末。

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