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1. 发明公开

EP2934073A4 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME 审中-公开
公开(公告)号：EP2934073A4
公开(公告)日：2016-08-17
申请号：EP13862689
申请日：2013-12-06
申请人： TYCO ELECTRONICS AMP KOREA LTD
发明人： CHOI YANG YOON , BEAK OK KY
IPC分类号： H05K1/09 , H05K3/46 , H05K7/20
CPC分类号： H05K1/053 , H05K1/0201 , H05K1/0207 , H05K1/0278 , H05K1/09 , H05K3/06 , H05K3/285 , H05K3/385 , H05K3/421 , H05K3/425 , H05K3/429 , H05K3/4608 , H05K2201/0323 , H05K2203/072 , H05K2203/0723 , H05K2203/073

2. 发明公开

EP2934073A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：EP2934073A1
公开(公告)日：2015-10-21
申请号：EP13862689.0
申请日：2013-12-06
申请人： Tyco Electronics AMP Korea Ltd.
发明人： CHOI, Yang Yoon , BEAK, Ok Ky
IPC分类号： H05K1/09 , H05K3/46 , H05K7/20
CPC分类号： H05K1/053 , H05K1/0201 , H05K1/0207 , H05K1/0278 , H05K1/09 , H05K3/06 , H05K3/285 , H05K3/385 , H05K3/421 , H05K3/425 , H05K3/429 , H05K3/4608 , H05K2201/0323 , H05K2203/072 , H05K2203/0723 , H05K2203/073
摘要： Disclosed are a printed circuit board capable of improving heat dissipation and strength against warping through the use of aluminum, and a method of manufacturing same. The printed circuit board may be configured to include: a core portion formed of an aluminum material; a base layer formed of an aluminum material and bonded on both side surfaces of the core portion; a bonding member interposed between the core portion and the base layer in order to bond the base layer to the core portion; a via hole formed through the core portion, the bonding member, and the base layer; a substitution layer formed to ionize a portion exposed to the surface of the base layer and the inside of the via hole; and a plate layer formed on the substitution layer and having a circuit pattern formed thereon.
摘要翻译：本发明公开了一种印刷电路板及其制造方法，该印刷电路板能够通过使用铝改善散热和抗翘曲强度。印刷电路板可以被配置为包括：由铝材料形成的芯部; 由铝材料形成并粘结在所述芯部的两侧表面上的基底层; 结合构件，介于所述核心部分和所述基层之间以将所述基层粘合到所述核心部分; 贯通所述芯部，所述接合部件和所述基底层而形成的通孔; 被形成为使暴露于基极层的表面和通孔内部的部分电离的置换层; 以及形成在所述置换层上并具有形成在其上的电路图案的板层。

3. 发明公开

EP2591645A4 METHODS OF TREATING COPPER SURFACES FOR ENHANCING ADHESION TO ORGANIC SUBSTRATES FOR USE IN PRINTED CIRCUIT BOARDS 有权转让
标题翻译： METHOD FOR铜表面，用于FOR USE用于电路板有机底物的增加的责任处理
公开(公告)号：EP2591645A4
公开(公告)日：2015-10-21
申请号：EP10854525
申请日：2010-07-06
申请人： ESIONIC 3000 INC
发明人： WEI JEN-CHIEH , LIU ZHIMING , SHI STEVEN Z , KUHR WERNER G
IPC分类号： H05K3/38 , H05K3/46
CPC分类号： H05K3/385 , H05K1/09 , H05K3/389 , H05K3/4652 , H05K2203/1157 , Y10T156/10
摘要： Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.

4. 发明授权

EP2334496B1 IMPROVEMENTS IN OR RELATING TO PRINTING 有权
标题翻译：改进技术或打印此RESPECT
公开(公告)号：EP2334496B1
公开(公告)日：2014-05-07
申请号：EP09785590.2
申请日：2009-09-07
申请人： J P Imaging Limited
发明人： ADAMSON, John, David , BENNETT, Peter, Andrew, Reath , POTTS, Rodney, Martin
IPC分类号： B41C1/10 , G03F7/004 , B41N1/08 , B41N1/12 , B41N1/20 , B41N1/22 , B41N1/00
CPC分类号： B41C1/1041 , B41M1/06 , B41N1/006 , B41N1/083 , G03F7/0043 , H05K3/1275 , H05K3/385 , H05K2203/0315
摘要： A method of preparing a printing form precursor for printing, or a printed circuit board precursor or a semiconductor precursor, the method comprising the step of applying electromagnetic radiation having a pulse duration of not greater than 1×10−6 seconds, in an imagewise manner, to an imagable surface of the precursor. The imaging process may cause ablation of the coating of the precursor or permit its development in a developer. In each case the imaging radiation needs not be tuned to imaging chemistry (if any) present in the coating. Alternatively the imaging process may induce a change of hydrophilicity or hydrophobicity, or other change of state, of an uncoated substrate.

5. 发明授权

EP2394975B1 Verfahren zum Herstellen von doppelseitig metallisierten Metall-Keramik-Substraten 有权
标题翻译：的制造方法双面金属化金属陶瓷基片
公开(公告)号：EP2394975B1
公开(公告)日：2013-04-17
申请号：EP11004835.2
申请日：2011-06-14
申请人： IXYS Semiconductor GmbH
发明人： Weidenauer, Werner , Spann, Thomas , Knoll, Heiko
IPC分类号： C04B37/02 , H05K3/38
CPC分类号： C04B37/021 , C04B37/025 , C04B2235/9623 , C04B2237/06 , C04B2237/341 , C04B2237/407 , C04B2237/54 , C04B2237/56 , C04B2237/561 , C04B2237/568 , C04B2237/62 , C04B2237/704 , H05K1/0306 , H05K3/007 , H05K3/385 , H05K2203/016

7. 发明授权

EP1037511B1 Surface treatment of copper to prevent microcracking in flexible circuits 有权
标题翻译：表面处理的铜为在柔性电路防止形成微裂纹
公开(公告)号：EP1037511B1
公开(公告)日：2012-07-18
申请号：EP00302147.4
申请日：2000-03-16
申请人： JX Nippon Mining & Metals Corp.
发明人： Merchant, Harish D. , Poutasse, Charles A. , Lee, Chin-Ho
IPC分类号： H05K1/00 , H05K3/38
CPC分类号： B32B15/08 , B32B15/20 , B32B2311/12 , B32B2457/08 , H05K1/028 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/389 , H05K2201/0317 , H05K2201/0355 , H05K2203/0315 , H05K2203/0723

8. 发明授权

EP2051820B1 PROCESS FOR IMPROVING THE ADHESION OF POLYMERIC MATERIALS TO METAL SURFACES 有权
标题翻译：方法改进聚合物材料对金属表面的责任
公开(公告)号：EP2051820B1
公开(公告)日：2012-04-25
申请号：EP07796088.8
申请日：2007-06-14
申请人： MacDermid, Incorporated
发明人： CORDANI, John, L., Jr.
IPC分类号： H05K3/38 , C23C22/36 , C23C18/16 , C23C18/31 , C23C18/32 , C23C28/00 , C23C22/00
CPC分类号： H05K3/385 , C23C18/1831 , C23C18/24 , C23C18/31 , C23C18/32 , C23C22/362 , C23C28/00 , C23C28/04 , H05K3/383 , H05K3/384 , H05K2203/072 , H05K2203/073
摘要： A process is disclosed for the purpose of increasing the adhesion of a polymeric material to a metal surface. The process comprises plating the metal surface with a layer of electroless nickel, electroless cobalt or electroless (or immersion) tin followed by phosphating the plated layer prior to bonding the polymeric material thereto. The process is particularly suited to treating printed circuit board inner-layers and lead frames.

9. 发明公开

EP2394975A1 Verfahren zum Herstellen von doppelseitig metallisierten Metall-Keramik-Substraten 有权
标题翻译：埃尔法罕·泽姆·赫斯特伦·冯·多普
公开(公告)号：EP2394975A1
公开(公告)日：2011-12-14
申请号：EP11004835.2
申请日：2011-06-14
申请人： IXYS Semiconductor GmbH
发明人： Weidenauer, Werner , Spann, Thomas , Knoll, Heiko
IPC分类号： C04B37/02 , H05K3/38
CPC分类号： C04B37/021 , C04B37/025 , C04B2235/9623 , C04B2237/06 , C04B2237/341 , C04B2237/407 , C04B2237/54 , C04B2237/56 , C04B2237/561 , C04B2237/568 , C04B2237/62 , C04B2237/704 , H05K1/0306 , H05K3/007 , H05K3/385 , H05K2203/016
摘要： Die Erfindung betrifft ein Verfahren zum Herstellen von doppelseitig metallisierten Metall-Keramik-Substraten nach dem Direct-Bonding-Prozess. Das erfindungsgemäße Verfahren ermöglicht es, mindestens ein Keramiksubstrat 1 an der Ober- und Unterseite in nur einem Prozessdurchlauf mit jeweils einer Metallplatte- bzw. -folie 2, 3 zu verbinden. Dies wird dadurch erreicht, dass sich der zu fügende Verbund auf einem besonders ausgestalteten Träger 4 befindet. Dieser Träger ist erfindungsgemäß dadurch gekennzeichnet, dass der Träger an der Oberseite unter Bildung einer Vielzahl von Auflagepunkten strukturiert ist. Aufgrund der besonderen Strukturierung des erfindungsgemäßen Trägers wird erreicht, dass sich der Verbund von Metallplatten und Keramiksubstrat nach dem Bondprozess rückstandsfrei von dem Träger lösen lässt. Der erfindungsgemäßen Träger bietet den Vorteil, dass eine zusätzliche Trennschicht nicht erforderlich ist.
摘要翻译：通过直接接合工艺（直接铜接合）制造双面金属化陶瓷衬底的方法，用于作为电路载体的半导体功率模块，包括放置第一金属板和第二金属板以及布置的陶瓷衬底的布置在支撑体（4）上的第一和第二金属板之间，并且通过加热将布置在支撑体上的布置与双面金属化陶瓷基板结合。通过形成接触点，支撑体在上侧构成，面向排列。通过直接接合工艺（直接铜接合）制造双面金属化陶瓷衬底的方法，用于作为电路载体的半导体功率模块，包括放置第一金属板和第二金属板以及布置的陶瓷衬底的布置在支撑体（4）上的第一和第二金属板之间，并且通过加热将布置在支撑体上的布置与双面金属化陶瓷基板结合。通过形成沿着排列方向逐渐变细的接触点，支撑件在面向结构的上侧构造。突出的组合件（4A）沿着该装置的方向延伸到一个点（4B），并且是锥形，金字塔形和半球形的主体。该组合件以一致的间隔分布地布置在支撑件的上侧，面向该装置。金属板在施加到陶瓷基板上之前被氧化。在第一金属板和/或第二金属板在定位在陶瓷基板上之前被穿孔，其中孔具有0.4-0.6mm的直径，并且以一定距离间隔排列成行。

10. 发明公开

EP2340169A1 IMPROVEMENTS IN OR RELATING TO PRINTING 有权
标题翻译：的改进或与打印
公开(公告)号：EP2340169A1
公开(公告)日：2011-07-06
申请号：EP09785591.0
申请日：2009-09-07
申请人： J P Imaging Limited
发明人： ADAMSON, John David , BENNETT, Peter Andrew Reath , HUTCHINSON, Richard Arthur , POTTS, Rodney Martin
IPC分类号： B41C1/10 , G03F7/004
CPC分类号： B41C1/1041 , B41M1/06 , B41N1/006 , B41N1/083 , G03F7/0043 , H05K3/1275 , H05K3/385 , H05K2203/0315
摘要： A method of preparing a printing form precursor for printing, or a printed circuit board precursor or a semiconductor precursor, the method comprising the step of applying electromagnetic radiation having a pulse duration of not greater than 1×10−6 seconds, in an imagewise manner, to an imagable surface of the precursor. The imaging process may cause ablation of the coating of the precursor or permit its development in a developer. In each case the imaging radiation needs not be tuned to imaging chemistry (if any) present in the coating. Alternatively the imaging process may induce a change of hydrophilicity or hydrophobicity, or other change of state, of an uncoated substrate.

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