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    • 10. 发明公开
    • Method for implementing a multi-chip module with a high-rate interface
    • 用于实现具有高速率接口的多芯片模块的方法
    • EP2720390A3
    • 2017-11-29
    • EP13004860.6
    • 2013-10-09
    • Avago Technologies General IP (Singapore) Pte. Ltd.
    • Woodruff, William
    • H04J3/06H04J3/04H04L29/06H04L12/741H04L12/931H04L12/935
    • H04L49/30H04J3/047H04J3/0697H04L45/745H04L49/40
    • A multi-chip module (MCM) may include a substrate, and first and second physical-layer (PHY) chips mounted on the substrate. In some implementations, the first PHY chip includes a multiplexer and a PHY circuit. The multiplexer is configured to receive a multiplexed data stream from a media access control (MAC) device, to demultiplex the multiplexed data stream into first and second data streams, to output the first data stream to the PHY circuit, and to output the second data stream to the second PHY chip. In some implementations, the first PHY includes a router and a PHY circuit. The router is configured to receive a plurality of data packets from a MAC device, to route one or more of the data packets having a first address to the PHY circuit, and to route one or more of the data packets having a second address to the second PHY chip.
    • 多芯片模块(MCM)可以包括衬底,以及安装在衬底上的第一和第二物理层(PHY)芯片。 在一些实现中,第一PHY芯片包括多路复用器和PHY电路。 复用器被配置为从媒体访问控制(MAC)设备接收复用数据流,将复用数据流解复用为第一和第二数据流,将第一数据流输出到PHY电路,并输出第二数据 流到第二PHY芯片。 在一些实现中,第一PHY包括路由器和PHY电路。 路由器被配置为从MAC设备接收多个数据分组,以将具有第一地址的一个或多个数据分组路由到PHY电路,并且将具有第二地址的一个或多个数据分组路由到 第二PHY芯片。