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    • 9. 发明公开
    • Method for implementing a multi-chip module with a high-rate interface
    • 用于实现具有高速率接口的多芯片模块的方法
    • EP2720390A3
    • 2017-11-29
    • EP13004860.6
    • 2013-10-09
    • Avago Technologies General IP (Singapore) Pte. Ltd.
    • Woodruff, William
    • H04J3/06H04J3/04H04L29/06H04L12/741H04L12/931H04L12/935
    • H04L49/30H04J3/047H04J3/0697H04L45/745H04L49/40
    • A multi-chip module (MCM) may include a substrate, and first and second physical-layer (PHY) chips mounted on the substrate. In some implementations, the first PHY chip includes a multiplexer and a PHY circuit. The multiplexer is configured to receive a multiplexed data stream from a media access control (MAC) device, to demultiplex the multiplexed data stream into first and second data streams, to output the first data stream to the PHY circuit, and to output the second data stream to the second PHY chip. In some implementations, the first PHY includes a router and a PHY circuit. The router is configured to receive a plurality of data packets from a MAC device, to route one or more of the data packets having a first address to the PHY circuit, and to route one or more of the data packets having a second address to the second PHY chip.
    • 多芯片模块(MCM)可以包括衬底,以及安装在衬底上的第一和第二物理层(PHY)芯片。 在一些实现中,第一PHY芯片包括多路复用器和PHY电路。 复用器被配置为从媒体访问控制(MAC)设备接收复用数据流,将复用数据流解复用为第一和第二数据流,将第一数据流输出到PHY电路,并输出第二数据 流到第二PHY芯片。 在一些实现中,第一PHY包括路由器和PHY电路。 路由器被配置为从MAC设备接收多个数据分组,以将具有第一地址的一个或多个数据分组路由到PHY电路,并且将具有第二地址的一个或多个数据分组路由到 第二PHY芯片。
    • 10. 发明公开
    • CHIP AND TRANSMISSION SCHEDULING METHOD
    • 芯片和传输调度方法
    • EP3223479A1
    • 2017-09-27
    • EP17161529.7
    • 2017-03-17
    • Huawei Technologies Co., Ltd.
    • XIN, HengchaoLIN, HanXIA, Jing
    • H04L12/933G06F13/38
    • H04L49/30H04L43/08H04L49/109
    • Embodiments of the present invention relate to the field of chips, and provide a chip and a transmission scheduling method. The chip is formed by packaging at least two dies, and the at least two dies form at least one die group. The die group includes a first die and a second die. A first processing unit and n groups of ports are disposed on the first die, and a second processing unit and m groups of ports are disposed on the second die. The first processing unit is configured to: monitor a queue depth of a processing queue of outputting data from the first die to the second die, and when the queue depth reaches a first preset threshold, by means of handshaking with the second processing unit, switch at least one group of first type ports in the n groups of ports from input to output and switch a second type port that is in the m groups of ports and that is coupled to each group of the first type ports from output to input. A prior-art problem that a resource waste may be caused because interconnection resources of a physical layer interface between dies cannot be fully utilized is resolved.
    • 本发明实施例涉及芯片领域,提供一种芯片和传输调度方法。 芯片通过封装至少两个管芯而形成,并且至少两个管芯形成至少一个管芯组。 模组包括第一模具和第二模具。 第一处理单元和n组端口设置在第一管芯上,第二处理单元和m组端口设置在第二管芯上。 所述第一处理单元用于监测从所述第一裸片向所述第二裸片输出数据的处理队列的队列深度,当所述队列深度达到第一预设阈值时,通过与所述第二处理单元的握手,切换 所述n组端口中的至少一组第一类型端口从输入到输出并且切换第二类型端口,所述第二类型端口在所述m组端口中并且从输出到输入耦合到每组第一类型端口。 解决了由于裸片之间的物理层接口的互连资源不能被充分利用而可能导致资源浪费的现有技术问题。