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1. 发明公开

EP2226934A1 COMPOSITE PIEZOELECTRIC SUBSTRATE MANUFACTURING METHOD 有权
标题翻译： VERFAHREN ZUR HERSTELLUNG EINES PIEZOELEKTRISCHEN VERBUNDSUBSTRATS
公开(公告)号：EP2226934A1
公开(公告)日：2010-09-08
申请号：EP08863984.4
申请日：2008-10-23
申请人： Murata Manufacturing Co. Ltd.
发明人： KANDO, Hajime , YOSHII, Yoshiharu
IPC分类号： H03H3/08 , H01L41/09 , H01L41/18 , H01L41/22 , H03H3/02 , H03H9/17
CPC分类号： H01L41/27 , G02F1/035 , H01L41/187 , H01L41/25 , H01L41/257 , H01L41/312 , H01L41/335 , H01L41/337 , H03H3/02 , H03H3/08 , H03H2003/021 , H03H2003/023 , H03H2003/027 , Y10T29/42 , Y10T29/49005 , Y10T29/49155
摘要： The present invention provides a method for manufacturing a composite piezoelectric substrate capable of forming an ultrathin piezoelectric film having a uniform thickness by efficiently using a piezoelectric material. a) A piezoelectric substrate (2) and a supporting substrate (10) are prepared, b) ions are implanted from a surface (2a) of the piezoelectric substrate (2) to form a defective layer (4) in a region having a predetermined depth from the surface (2a) of the piezoelectric substrate (2), c) impurities adhering to at least one of the surface (2a) of the piezoelectric substrate (2) in which the defective layer (4) is formed and a surface (10a) of the supporting substrate (1) are removed to directly expose the constituent atoms of the surfaces (2a and 10a) and activate them, d) the supporting substrate (10) is bonded to the surface (2a) of the piezoelectric substrate (2) to form a substrate bonded body (40), e) the substrate bonded body (40) is separated at the defective layer (4) formed in the piezoelectric substrate (2) so that a separation layer (3) between the surface (2a) of the piezoelectric substrate (2) and the defective layer (4) is separated from the piezoelectric substrate (2) and bonded to the supporting substrate (10) to form a composite piezoelectric substrate (30), and f) the surface (3a) of the separation layer (3) of the composite piezoelectric substrate (30) is smoothed.
摘要翻译：本发明提供一种能够通过有效地使用压电材料形成具有均匀厚度的超薄压电膜的复合压电基片的制造方法。 a）制备压电基板（2）和支撑基板（10），b）从压电基板（2）的表面（2a）注入离子，在具有预定的区域的区域中形成缺陷层（4）从压电基板（2）的表面（2a）的深度，c）附着到其中形成有缺陷层（4）的压电基板（2）的表面（2a）中的至少一个的杂质和表面去除支撑基板（1）的直径10a（10a）以直接暴露表面（2a和10a）的构成原子并激活它们，d）支撑基板（10）结合到压电基板的表面（2a） 2）形成基板接合体（40），e）在形成在压电基板（2）的缺陷层（4）处分离基板接合体（40），使得在表面压电基板（2）的缺陷层（2a）和缺陷层（4）与压电基板（2）分离结合到支撑基板（10）上以形成复合压电基板（30），以及f）复合压电基板（30）的分离层（3）的表面（3a）被平滑化。

2. 发明授权

EP1811582B1 Piezoelectric actuator 有权
标题翻译：压电致动器
公开(公告)号：EP1811582B1
公开(公告)日：2008-12-10
申请号：EP06250325.5
申请日：2006-01-20
申请人： Delphi Technologies, Inc.
发明人： Cooke, Michael
IPC分类号： H01L41/083 , H01L41/047 , H01L41/22
CPC分类号： H01L41/297 , H01L41/0471 , H01L41/0833 , H01L41/273 , H01L41/335

3. 发明公开

EP1811582A1 Piezoelectric actuator 有权
标题翻译：压电致动器
公开(公告)号：EP1811582A1
公开(公告)日：2007-07-25
申请号：EP06250325.5
申请日：2006-01-20
申请人： Delphi Technologies, Inc.
发明人： Cooke, Michael
IPC分类号： H01L41/083 , H01L41/047 , H01L41/22
CPC分类号： H01L41/297 , H01L41/0471 , H01L41/0833 , H01L41/273 , H01L41/335
摘要： A piezoelectric actuator (20) comprises a stack of piezoelectric elements (21) defining an external actuator boundary of substantially rectangular form and having first and second sides (22, 24, 26, 28) with rounded or chamfered corners (29), and a plurality of internal electrode elements (30) arranged to form a positive polarity group (30a) of electrode elements and a negative polarity group (30b) of electrode elements. Each of the internal electrode elements (30) of one polarity is provided with an insulating region (40) arranged adjacent to an associated one of the first and second sides (22) of the external actuator boundary. The insulating region (40) is provided by a recess defining an internal electrode edge (42) which is substantially parallel to said associated one of the sides (22) of the external actuator boundary and its corners (29), such that the insulating region (40) has a substantially uniform width along said associated one of the sides (22) of the external actuator boundary.
摘要翻译：压电致动器（20）包括一叠压电元件（21），它们限定了基本为矩形的外部致动器边界，并具有带有倒圆角或倒角（29）的第一和第二侧面（22,24,26,28），以及布置成形成电极元件的正极性组（30a）和电极元件的负极性组（30b）的多个内部电极元件（30）。一个极性的每个内部电极元件（30）设置有与外部致动器边界的第一侧和第二侧（22）中相关联的一个相邻布置的绝缘区域（40）。绝缘区域（40）由限定内部电极边缘（42）的凹部提供，该内部电极边缘基本平行于外部致动器边界的所述相关的一个侧面（22）及其拐角（29），使得绝缘区域（40）沿着所述外部致动器边界的所述相关的一个侧面（22）具有基本均匀的宽度。

4. 发明公开

EP2777083A2 VERFAHREN ZUM ELEKTRISCHEN KONTAKTIEREN EINES ELEKTRONISCHEN BAUELEMENTS ALS STAPEL UND ELEKTRONISCHES BAUELEMENT MIT EINER KONTAKTIERUNGSSTRUKTUR 有权转让
标题翻译： METHOD FOR电接触的电子部件作为堆栈和电子元件的与接触结构
公开(公告)号：EP2777083A2
公开(公告)日：2014-09-17
申请号：EP13720962.3
申请日：2013-05-08
申请人： Continental Automotive GmbH
发明人： RICHTER, Thomas , LENK, Andreas , ZUMSTRULL, Claus
IPC分类号： H01L41/29
CPC分类号： H01L41/083 , B32B37/12 , B32B38/0008 , B32B38/0012 , B32B2307/20 , B32B2310/0843 , B32B2310/0875 , B32B2311/00 , B32B2457/00 , H01L41/0471 , H01L41/0472 , H01L41/277 , H01L41/293 , H01L41/297 , H01L41/335
摘要： The invention describes a method for making electrical contact with an electronic component in the form of a stack (1) which is formed from a plurality of material layers (2), which react upon application of an electric field, and a plurality of electrode layers (3, 4), wherein each material layer (2) is arranged between two of the electrode layers (3, 4). In the method according to the invention, an insulation structure (7, 8) is generated on at least one stack circumferential region (5, 6) of the stack (1), as a result of which each second electrode layer (3, 4) of the at least one stack circumferential region (5, 6) is exposed for electrical contact to be made. Furthermore, a contact-making structure (13, 14) is applied to the at least one stack circumferential region (5, 6) which is provided with the insulation structure (7, 8). The method according to the invention is distinguished in that, before the step of generating the contact-making structure (13, 14), the material layers (2) are partially removed by means of a material-removing method in such a way that the electrode layers (3, 4) are exposed close to the surface.

5. 发明公开

EP1502310A2 PIEZOAKTOR UND VERFAHREN ZU DESSEN HERSTELLUNG 有权
标题翻译：压电致动器方法及其
公开(公告)号：EP1502310A2
公开(公告)日：2005-02-02
申请号：EP03737871.8
申请日：2003-05-06
申请人： EPCOS AG
发明人： FLORIAN, Heinz , REICHMANN, Klaus , KAINZ, Gerald
IPC分类号： H01L41/083
CPC分类号： H01L41/293 , H01L41/0474 , H01L41/0536 , H01L41/083 , H01L41/273 , H01L41/335
摘要： The invention relates to a piezoactuator comprising a base body (4), which contains a stack (1) of superimposed piezoelectric layers (2) and electrode layers (3) situated therebetween. The piezoelectric layers (2) contain ceramic material and are sintered to the electrode layers (3). A hole passes through the base body (4) perpendicular to the electrode layers (3a, 3b), and a pin (5a, 5b, 5c, 5d) is inserted into said hole. The invention also relates to a method for producing a piezoactuator, comprising the following steps: a) constructing a layer stack (1) from superimposed ceramic green films (2) and electrode layers (3a, 3b); b) boring a hole into a layer stack (1), and; c) inserting a pin (5a, 5b, 5c, 5d) into the hole.

6. 发明公开

EP1314210A1 PIEZOAKTOR UND VERFAHREN ZUR HERSTELLUNG EINES PIEZOAKTORS 有权
标题翻译：压电致动器制造方法压电致动器
公开(公告)号：EP1314210A1
公开(公告)日：2003-05-28
申请号：EP01960115.2
申请日：2001-07-06
申请人： SIEMENS AKTIENGESELLSCHAFT
发明人： LUBITZ, Karl , SCHUH, Carsten
IPC分类号： H01L41/083 , H01L41/24
CPC分类号： H01L41/0835 , H01L41/0536 , H01L41/273 , H01L41/335 , H02N2/02
摘要： The invention relates to a piezoactuator (1) comprising a piezoelectric body (4) and elements for pre-tensioning the piezoelectric body, consisting of a first (2) and a second (3) connecting element for transferring forces to the piezoelectric body (4). The actuator is provided with an element (6) for transferring tensile/pressure forces between the connecting elements (2, 3), said element being at least partially located in a gap (5) in the form of a bore in the piezoelectric body (4). According to the invention, the piezoactuator (1) is set to a defined working curve using the pre-tensioning elements (2, 3, 6). The piezoelectric body (4) is preferably produced by the lamination of piezoelectric layers, into which a gap is drilled after lamination and the component is subsequently sintered.

7. 发明公开

EP1156011A1 SOLID-STATE MATERIAL 审中-公开
标题翻译： FESTKöRPERMATERIAL
公开(公告)号：EP1156011A1
公开(公告)日：2001-11-21
申请号：EP98967054.2
申请日：1998-12-30
申请人： Intellikraft Limited
发明人： KRUTOVA, Elena Igorevna , SPIRIN, Jury Leonidovich , DUBININ, Vladimir Stepanovich , FROLOV, Dmitry Vladimirovich
IPC分类号： B82B3/00
CPC分类号： H01L41/37 , B82Y30/00 , C04B41/009 , C04B41/4596 , C04B41/53 , C04B41/88 , C04B41/91 , C04B2111/00844 , H01L41/335 , C04B41/5116 , C04B41/5122 , C04B41/5127 , C04B35/00 , C04B35/486 , C04B38/00
摘要： A process for the treatment of solid state materials is described, in which pores with a cross section of up to 200nm are formed in the surface layer of the material, and these pores are filled with filaments of another material or of the same material. This produces an improvement in a number of characteristics of the material, including strength and acoustic losses.
The invention may be used most successfully in the production of piezo-ceramics.
摘要翻译：描述了一种用于处理固态材料的方法，其中在材料的表面层中形成横截面高达200nm的孔，并且这些孔被另外材料或相同材料的细丝填充。这产生了材料的许多特性的改进，包括强度和声学损失。本发明可以最有效地用于制造压电陶瓷。

8. 发明公开

EP3110628A4 VARIABLE THICKNESS DIAPHRAGM FOR A WIDEBAND ROBUST PIEZOELECTRIC MICROMACHINED ULTRASONIC TRANSDUCER (PMUT) 有权
公开(公告)号：EP3110628A4
公开(公告)日：2017-10-11
申请号：EP15754603
申请日：2015-02-27
申请人： UNIV CALIFORNIA
发明人： BOSER BERNHARD , HORSLEY DAVID , PRZYBYLA RICHARD , ROZEN OFER , SHELTON STEFON
IPC分类号： B06B1/06 , G10K9/122 , G10K13/00 , H01L41/09
CPC分类号： H01L41/335 , B06B1/0622 , B06B1/0666 , G10K9/121 , G10K9/122 , G10K13/00 , H01L41/083 , H01L41/0973 , H01L41/1138 , H01L41/187 , H01L41/332
摘要： A diaphragm for a piezoelectric micromachined ultrasonic transducer (PMUT) is presented having resonance frequency and bandwidth characteristics which are decoupled from one another into independent variables. Portions of at least the piezoelectric material layer and backside electrode layer are removed in a selected pattern to form structures, such as ribs, in the diaphragm which retains stiffness while reducing overall mass. The patterned structure can be formed by additive, or subtractive, fabrication processes.

9. 发明公开

EP2226934A4 COMPOSITE PIEZOELECTRIC SUBSTRATE MANUFACTURING METHOD 有权
标题翻译：方法生产压电复合衬底
公开(公告)号：EP2226934A4
公开(公告)日：2013-03-27
申请号：EP08863984
申请日：2008-10-23
申请人： MURATA MANUFACTURING CO
发明人： KANDO HAJIME , YOSHII YOSHIHARU
IPC分类号： H01L41/312 , H01L41/22 , H01L41/257 , H03H3/02 , H03H3/08
CPC分类号： H01L41/27 , G02F1/035 , H01L41/187 , H01L41/25 , H01L41/257 , H01L41/312 , H01L41/335 , H01L41/337 , H03H3/02 , H03H3/08 , H03H2003/021 , H03H2003/023 , H03H2003/027 , Y10T29/42 , Y10T29/49005 , Y10T29/49155
摘要： The present invention provides a method for manufacturing a composite piezoelectric substrate capable of forming an ultrathin piezoelectric film having a uniform thickness by efficiently using a piezoelectric material. a) A piezoelectric substrate (2) and a supporting substrate (10) are prepared, b) ions are implanted from a surface (2a) of the piezoelectric substrate (2) to form a defective layer (4) in a region having a predetermined depth from the surface (2a) of the piezoelectric substrate (2), c) impurities adhering to at least one of the surface (2a) of the piezoelectric substrate (2) in which the defective layer (4) is formed and a surface (10a) of the supporting substrate (1) are removed to directly expose the constituent atoms of the surfaces (2a and 10a) and activate them, d) the supporting substrate (10) is bonded to the surface (2a) of the piezoelectric substrate (2) to form a substrate bonded body (40), e) the substrate bonded body (40) is separated at the defective layer (4) formed in the piezoelectric substrate (2) so that a separation layer (3) between the surface (2a) of the piezoelectric substrate (2) and the defective layer (4) is separated from the piezoelectric substrate (2) and bonded to the supporting substrate (10) to form a composite piezoelectric substrate (30), and f) the surface (3a) of the separation layer (3) of the composite piezoelectric substrate (30) is smoothed.

10. 发明公开

EP1882920A1 Method of producing a film-type sensor 审中-公开
标题翻译： Herstellungsverfahren eines Folienensors
公开(公告)号：EP1882920A1
公开(公告)日：2008-01-30
申请号：EP06118107.9
申请日：2006-07-28
申请人： IEE INTERNATIONAL ELECTRONICS & ENGINEERING S.A.
发明人： Maoujoud, Mohammed , Schumacher, Alain
IPC分类号： G01L1/20 , G01L1/18 , H01L41/22 , H01L21/302
CPC分类号： G01L1/20 , G01L1/16 , G01L1/18 , H01L41/335 , H05K1/0393 , H05K1/16 , H05K3/027 , H05K3/043
摘要： In the production of a film-type sensor having a first carrier film, a second carrier film and an electric circuit arranged between the first and second carrier films, at least a part of the electric circuit is formed on the first carrier film, by providing a composite film including the first carrier film and a functional layer applied on the first carrier film and patterning the functional layer of the composite film by mechanical machining so as to achieve the desired electric circuit part on the first carrier film.
摘要翻译：在制造具有第一载体膜，第二载体膜和布置在第一和第二载体膜之间的电路的膜型传感器中，至少一部分电路形成在第一载体膜上，通过提供包括第一载体膜和施加在第一载体膜上的功能层的复合膜，并通过机械加工对复合膜的功能层进行图案化，以在第一载体膜上实现所需的电路部分。

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