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2. 发明公开

EP1966823A1 THREE-DIMENSIONAL PACKAGE MODULE, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING PASSIVE DEVICE APPLIED TO THE THREE-DIMENSIONAL PACKAGE MODULE 审中-公开
标题翻译：三维封装，PROCESS用于生产无源元件上的三个封装应用PRODUCING AND METHOD
公开(公告)号：EP1966823A1
公开(公告)日：2008-09-10
申请号：EP06716201.6
申请日：2006-03-03
申请人： Wavenics Inc.
发明人： KWON, Young-se , KIM, Kyoung Min
IPC分类号： H01L23/02
CPC分类号： H01L23/66 , H01L21/4857 , H01L23/3121 , H01L23/49822 , H01L23/5389 , H01L23/645 , H01L24/24 , H01L24/82 , H01L25/072 , H01L25/162 , H01L2223/6616 , H01L2223/6627 , H01L2223/6644 , H01L2224/24227 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/12044 , H01L2924/15153 , H01L2924/1517 , H01L2924/15787 , H01L2924/19033 , H01L2924/19041 , H01L2924/19042 , H05K1/053 , H05K1/185 , H01L2924/00
摘要： Provided is a three-dimensional aluminum package module including: an aluminum substrate; an aluminum oxide layer formed on the aluminum substrate and having at least one first opening of which sidewalls are perpendicular to an upper surface of the aluminum substrate; a semiconductor device mounted in the first opening using an adhesive; an organic layer covering the aluminum oxide layer and the semiconductor device; and a first interconnection line and a passive device circuit formed on the organic layer and the aluminum oxide layer.

3. 发明公开

EP0731525A2 Three-wire-line vertical interconnect structure for multilevel substrates 失效
标题翻译：垂直连接电缆的组件带有三根导线多级基板
公开(公告)号：EP0731525A2
公开(公告)日：1996-09-11
申请号：EP96102800.8
申请日：1996-02-24
申请人： Hughes Aircraft Company
发明人： Gulick, Jon J. , Wooldridge, John J.
IPC分类号： H01R9/00
CPC分类号： H01L23/5384 , H01L23/49827 , H01L23/66 , H01L2223/6616 , H01L2223/6627 , H01L2224/16 , H01L2924/10329 , H01L2924/15173 , H01L2924/1903 , H01L2924/19033 , H01L2924/3011 , H01L2924/3025
摘要： A vertical interconnect structure (10) comprising a three-wire-line transmission line structure (10) for providing electrical continuity between different levels of a multilevel substrate (15). The present invention provides a means for transferring power between various levels of the substrate (15) without introducing excessive additional RF losses. First and second coplanar transmission line structures (13,14) are disposed on first and second surfaces of the substrate (15). A vertical interconnect structure (10) is disposed in the multilevel RF substrate (15) and is coupled between the first and second transmission line structures (13,14). The vertical interconnect structure (10) comprises three conductors (12a,12b,12c) having predetermined cross-sectional dimensions and predetermined separations therebetween that are adapted to transfer RF power between the first and second transmission line structures (13,14). In a completed electronic circuit employing the present invention, an electronic device (21) is electrically coupled between two coplanar transmission line structures (13,14) disposed on one surface of the substrate (15), and the vertical interconnect structure (10) couples power to the electronic circuit (21) by way of the coplanar transmission line structure (10) disposed another surface of the substrate (15). The impedance of the vertical interconnect structure (10) is determined by the relative dimensions of the three conductors (12a12b,12c) and their relative separations. The three-wire-line transmission line structure (10) supports a highly desirable TEM mode of energy propagation. The present invention is relatively easy to fabricate, in that vertical wires having a circular geometry are easily accommodated as part of the fabrication process for the substrate (15). The present invention provides for relatively low loss, because of the nature of the currents that flow on the conductors. The propagation characteristics are well-understood, and the vertical interconnect structure supports a highly desirable TEM mode of energy propagation.
摘要翻译：垂直互连结构（10），包括不同级别的多级的基板（15）的之间提供电连续性三线线传输线结构（10）。本发明提供了在不引入过多额外的RF损失各级基板（15）之间传递环功率的装置。第一和第二共面传输线结构（13,14）被设置在基板（15）的第一和第二表面。垂直互连结构（10），在所述多级RF基板（15）被布置和耦合在第一和第二传输线结构（13,14）之间。垂直互连结构（10）包括三个导体（12A，12B，12C），其具有预定的横截面尺寸和预定的分离之间有angepasst做到第一和第二传输线结构（13,14）之间传送RF功率。在完成的电子电路采用本发明，给电子装置（21）被耦合电两个共面传输线结构（13,14）布置在所述基片（15）的一个表面上，并且垂直互连结构（10）之间耦合功率由共面传输线结构（10）的方式将电子电路（21）设置在所述基板（15）的另一表面上。垂直互连结构（10）的阻抗由确定性三个导体（12a12b，12C）和它们的相对分离的相对尺寸开采。三线线传输线结构（10）支撑能量传播的高度期望的TEM模式。本发明相对容易制造，具有圆形的几何形状DASS垂直线被容易地容纳作为底物（15）的制造工艺的一部分。本发明提供了一种相对较低的损耗，因为没有电流在导体上流动的性质。所述传播特性的很好理解的，并且垂直互连结构支持能量传播的高度期望的TEM模式。

4. 发明公开

EP2614524A1 MONOLITHIC MICROWAVE INTEGRATED CIRCUIT 有权
标题翻译：单片微波电路
公开(公告)号：EP2614524A1
公开(公告)日：2013-07-17
申请号：EP11758292.4
申请日：2011-08-25
申请人： Raytheon Company
发明人： REZA, Shahed , SWIDERSKI, Edward , ALM, Roberto, W.
IPC分类号： H01L23/66
CPC分类号： H01L23/66 , H01L23/36 , H01L23/42 , H01L2223/6627 , H01L2224/131 , H01L2224/16225 , H01L2224/16235 , H01L2224/291 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/1423 , H01L2924/19033 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： A monolithic microwave integrated circuit structure having a semiconductor substrate structure with a plurality of active devices and a microwave transmission line having an input section, an output section and a interconnecting section electrically interconnecting the active devices on one surface and a metal layer on an opposite surface overlaying the interconnection section and absent from overlaying at least one of the input section and the output section.

5. 发明公开

EP2325879A2 Three-dimensional package module, method of fabricating the same, and method of fabricating passive device applied to the three-dimensional package module 审中-公开
标题翻译：三维封装模块，其制备和工艺的无源部件，其被施加到三维封装的制造过程
公开(公告)号：EP2325879A2
公开(公告)日：2011-05-25
申请号：EP11156130.4
申请日：2006-03-03
申请人： Wavenics Inc.
发明人： Kwon, Young-Se , Kim, Kyoung Min
IPC分类号： H01L23/02 , H01L23/538
CPC分类号： H01L23/66 , H01L21/4857 , H01L23/3121 , H01L23/49822 , H01L23/5389 , H01L23/645 , H01L24/24 , H01L24/82 , H01L25/072 , H01L25/162 , H01L2223/6616 , H01L2223/6627 , H01L2223/6644 , H01L2224/24227 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/12044 , H01L2924/15153 , H01L2924/1517 , H01L2924/15787 , H01L2924/19033 , H01L2924/19041 , H01L2924/19042 , H05K1/053 , H05K1/185 , H01L2924/00
摘要： Provided is a three-dimensional aluminum package module including : an aluminum substrate; an aluminum oxide layer formed on the aluminum substrate and having at least one first opening of which sidewalls are perpendicular to an upper surface of the aluminum substrate; a semiconductor device mounted in the first opening using an adhesive; an organic layer covering the aluminum oxide layer and the semiconductor device; and a first interconnection line and a passive device circuit formed on the organic layer and the aluminum oxide layer.
摘要翻译：提供是包括三维铝封装模块：的铝基底; 形成在铝基底和具有侧壁中的至少一个第一开口的铝氧化物层的垂直于在铝衬底的上表面上; 安装在使用于粘合剂第一开口的半导体器件; 的覆盖氧化铝层和半导体器件有机层; 和第一互连线和无源器件电路形成在所述有机层和氧化铝层上。

6. 发明授权

EP0731525B1 Three-wire-line vertical interconnect structure for multilevel substrates 失效
标题翻译：垂直连接电缆的组件带有三根导线多级基板
公开(公告)号：EP0731525B1
公开(公告)日：2002-07-03
申请号：EP96102800.8
申请日：1996-02-24
申请人： RAYTHEON COMPANY
发明人： Gulick, Jon J. , Wooldridge, John J.
IPC分类号： H01P5/00 , H01R9/00
CPC分类号： H01L23/5384 , H01L23/49827 , H01L23/66 , H01L2223/6616 , H01L2223/6627 , H01L2224/16 , H01L2924/10329 , H01L2924/15173 , H01L2924/1903 , H01L2924/19033 , H01L2924/3011 , H01L2924/3025

7. 发明公开

EP2428989A3 High-frequency circuit package and high-frequency circuit device 有权
标题翻译： RF电路壳体和高频电路
公开(公告)号：EP2428989A3
公开(公告)日：2015-07-29
申请号：EP11169866.8
申请日：2011-06-14
申请人： Fujitsu Limited
发明人： Masuda, Satoshi
IPC分类号： H01L23/057 , H01L23/66 , H01L23/498 , H01P1/04 , H01P5/02 , H01P3/00
CPC分类号： H01L23/057 , H01L23/49822 , H01L23/49827 , H01L23/49861 , H01L23/66 , H01L2223/6611 , H01L2223/6627 , H01L2223/6633 , H01L2924/0002 , H01L2924/09701 , H01L2924/14 , H01L2924/16152 , H01L2924/166 , H01L2924/167 , H01L2924/16787 , H01L2924/1903 , H01L2924/19033 , H01L2924/19039 , H01L2924/19107 , H01L2924/30105 , H01L2924/3025 , H01P3/006 , H01P5/028 , H01L2924/00
摘要： A high-frequency circuit package including a dielectric substrate (10); a signal line (31), a first ground conductor layer (32), a second ground conductor layer (33), and a frame-shaped dielectric layer (16) formed on the dielectric substrate; a fourth ground conductor layer (35) formed on the frame-shaped dielectric layer; a first recess (29) formed in the frame-shaped dielectric layer and including a first (29b) surface and a second surface (29c) that are located above the first ground conductor layer (32) and the second ground conductor layer (33) and extend laterally at an oblique angle with respect to the length direction of the signal line; a first ground line (38a) formed on the first surface and electrically connecting the second ground conductor layer (33) with the fourth ground conductor layer (35); and a second ground line (38b) formed on the second surface and electrically connecting the third ground conductor layer (34) with the fourth ground conductor layer (35).

8. 发明公开

EP2242101A2 Receive circuit for connectors with variable complex impedance 有权
标题翻译：接收电路的连接器与可变复阻抗
公开(公告)号：EP2242101A2
公开(公告)日：2010-10-20
申请号：EP10160034.4
申请日：2010-04-15
申请人： Oracle America, Inc.
发明人： Drost, Robert J. , Hopkins, Robert D. , Chow, Alex
IPC分类号： H01L23/60 , H01L23/64 , H01L23/66 , H01L25/065 , H01L21/60 , H01L23/00
CPC分类号： H01L23/66 , H01L23/3171 , H01L23/48 , H01L23/5223 , H01L23/5225 , H01L23/552 , H01L23/585 , H01L23/60 , H01L23/642 , H01L23/645 , H01L23/647 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/72 , H01L24/90 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L27/0251 , H01L2223/6622 , H01L2223/6627 , H01L2223/6655 , H01L2224/02166 , H01L2224/0401 , H01L2224/05556 , H01L2224/05624 , H01L2224/13099 , H01L2224/95145 , H01L2225/06527 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01074 , H01L2924/014 , H01L2924/12032 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/19033 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19051 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/351 , H03H7/38 , H01L2924/00
摘要： Embodiments of a circuit for use with an inter-chip connection that has a variable complex impedance (which can be conductive, capacitive or both), a system that includes the circuit, and a communication technique are described. This inter-chip connection may be formed between a microspring or an anisotropic film and a metal connector on or proximate to a surface of a chip. Moreover, the circuit may mitigate signal distortion associated with the variable complex impedance. For example, the circuit may include an internal impedance that is electrically coupled in series with the metal connector, and that has an impedance which dominates the variable complex impedance over a range of operating frequencies. Separately or additionally, the circuit may be adapted to correct for the signal distortion.

9. 发明公开

EP1939980A1 Adjustable integrated circuit antenna structure 审中-公开
标题翻译： Antennenstruktur mit einstellbarer integrierter Schaltung
公开(公告)号：EP1939980A1
公开(公告)日：2008-07-02
申请号：EP07019213.3
申请日：2007-09-28
申请人： Broadcom Corporation
发明人： Rofougaran, Ahmadreza
IPC分类号： H01Q1/22 , H01Q1/38 , H01Q3/24 , H01Q9/06 , H01Q23/00 , H01L23/66
CPC分类号： H01Q1/50 , H01L23/66 , H01L25/0655 , H01L25/0657 , H01L2223/6627 , H01L2223/6677 , H01L2225/06527 , H01L2924/0002 , H01L2924/19033 , H01L2924/3011 , H01P11/00 , H01Q1/2283 , H01Q1/38 , H01Q3/242 , H01Q9/065 , H01Q23/00 , H04B1/18 , Y10T29/49018 , H01L2924/00
摘要： An adjustable integrated circuit antenna structure includes a plurality of antenna elements (534), a coupling circuit (536), a ground plane (540), and a transmission line circuit (538). The coupling circuit is operable to couple at least one of the plurality of antenna elements into an antenna based on an antenna structure characteristic signal, wherein the antenna has at least one of an effective length, a bandwidth, an impedance, a quality factor, and a frequency band in accordance with the antenna characteristic signal. The ground plane is proximal to the plurality of antenna elements. The transmission line circuit is coupled to provide an outbound radio frequency (RF) signal to the antenna and receive an inbound RF signal from the antenna.
摘要翻译：可调集成电路天线结构包括多个天线元件（534），耦合电路（536），接地平面（540）和传输线路电路（538）。耦合电路可操作以基于天线结构特征信号将多个天线元件中的至少一个耦合到天线中，其中天线具有有效长度，带宽，阻抗，品质因数和根据天线特性信号的频带。接地平面靠近多个天线元件。传输线电路被耦合以向天线提供出站射频（RF）信号并从天线接收入站RF信号。

10. 发明授权

EP1744363B1 Monolithisch integrierte Schaltung mit integrierter Entstörvorrichtung 有权
标题翻译：集成了干扰抑制单片集成电路
公开(公告)号：EP1744363B1
公开(公告)日：2008-03-26
申请号：EP06014307.0
申请日：2006-07-11
申请人： ATMEL Germany GmbH
发明人： Fischer, Harald
IPC分类号： H01L23/66
CPC分类号： H01L23/5225 , H01L23/66 , H01L2223/6627 , H01L2924/0002 , H01L2924/1903 , H01L2924/19033 , H01L2924/3011 , H01P1/20336 , H01L2924/00

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