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    • 1. 发明公开
    • Methods, systems and devices for electrostatic discharge protection
    • 方法,系统和装置用于防止静电放电
    • EP2328174A1
    • 2011-06-01
    • EP10192188.0
    • 2010-11-23
    • NXP B.V.
    • Berglund, Stefan BengtHolland, SteffenPodschus, Uwe
    • H01L27/02
    • H01L27/0248H01L27/0652H01L27/0761H01L29/7304
    • A resistor-equipped transistor includes a package that provides an external collector connection node (114, 134), an external emitter connection node (120, 140) and an external base connection node (106, 126). The package contains a substrate upon which a transistor (102, 122), first and second resistors, and first and second diodes are formed. The transistor has an internal collector (118, 138), an internal emitter (120, 140) and an internal base (116, 136) with the first resistor (104, 124) being electrically connected between the internal base and the external base connection node and the second resistor (108, 128) being electrically connected between the internal base and the internal emitter. The first and second diodes are electrically connected in series between the external base connection node and the external collector connection node with the first diode (112, 132) having a first cathode-anode orientation that is opposite of a second cathode-anode orientation corresponding to the second diode (110, 130).
    • 电阻器配备晶体管包括:封装,其提供到外部集电极连接节点(114,134)到外部发射极连接点(120,140)和外部基极连接的节点(106,126)。 包包含在其上的晶体管(102,122),第一和第二电阻器,以及第一和第二二极管形成的基材。 该晶体管具有以内部发射器的内部集电体(118,138)(120,140)和内部基极(116,136)与所述第一电阻器(104,124)被电连接在内部基极和外部基极连接之间 节点和所述第二电阻器(108,128)被电连接在内部基极和内部发射极之间。 第一和第二二极管串联电连接,外部基极连接节点和与所述第一二极管(112,132)具有第一阴极 - 阳极取向没有外部集电极连接节点之间是相对的第二阴极 - 阳极取向对应于 第二二极管(110,130)。
    • 10. 发明公开
    • Semiconductor protective device
    • 半导体保护器件
    • EP0103306A3
    • 1985-08-28
    • EP83109072
    • 1983-09-14
    • KABUSHIKI KAISHA TOSHIBA
    • Fujita, Katsuji
    • H01L27/02
    • H01L27/0248H01L29/7304H01L2924/0002H01L2924/00
    • A semiconductor protective device has a semiconductor substrate (1) of one conductivity type, the first island region being of a conductivity type opposite to that of the semiconductor substrate; second and third regions (3, 4) formed in a surface layer of the first region (2) and being of the same conductivity type as that of the semiconductor substrate (1); a first transistor emitter region (5) formed in the surface region of the second region (3) and being of a conductivity type opposite to that of the semiconductor substrate (1); a low-resistance region (6) formed across the second region (3) and the third region (4) ; a first electrode (8) formed on the first transistor emitter region (5); a second electrode (9); a third electrode (10) connected to the second electrode (9) by the low-resistance region (6); a first wiring layer (11) connecting the first electrode (8) and the third electrode (10) and connected to an external terminal, the resistance of the semiconductor region between the first electrode (8) and the first transistor emitter region (5) being lower than that of the semiconductor region between the first electrode (8) and the third electrode (10); and a second wiring layer (12) connected between an internal circuit and the second electrode (9). By a combination of resistors and bipolar transistors, the semiconductor protective device can absorb both positive and negative external surge inputs, thereby protecting the internal circuit.