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    • 3. 发明公开
    • VISUAL DISPLAY
    • 画面显示
    • EP1344241A1
    • 2003-09-17
    • EP01936628.5
    • 2001-05-31
    • Complete Substrate Solutions Limited
    • RODRIGUEZ, IngemarBISCHOFF, William, Paul
    • H01J31/12H01J3/02
    • H01J29/92H01J31/127H01J2329/92
    • A display has a cathode (1) and an anode (2). These are in plate form and held spaced apart by a peripheral frame (3), to which they are both sealed. The cathode has an emission layer (11) deposited on a front ceramic layer (12) with vias (14) to the emission layer. The foundation layer is fired, ground flat and has via apertures cut through it and filled (17) prior to lamination of the front layer. Onto the back face of the substrate, preferably prior to deposition of the emission layer, is spun on a dielectric layer (21), which is developed with the aid of a temporary mask (not shown) to provide etchable tracks. These are etched to leave grooves (22) corresponding to metallic interconnections (23) from the foundation layer vias (17) to vias (24) in the next dielectric layer (25), typically thicker than the previous one (21). The metallic interconnections (23) are formed by screen printing and firing. Then another pair of dielectric layers (26, 27) is laid down, developed, etched and filled with interconnections (28) and vias (29) for connection to next vias. The process is continued to build four pairs of dielectric layers behind the foundation layer (16). In each successive layer, the vias are progressively spaced further apart and their arrangement organised so that they can make contact, via metallic pads (31) provided in like manner to the interconnection tracks, with driver chip contacts.
    • 显示器具有阴极(1)和阳极(2)。 它们是平板形式并由周边框架(3)隔开,并且它们都被密封。 阴极具有沉积在前陶瓷层(12)上的发射层(11),其具有通向发射层的通孔(14)。 基础层被烧制,磨平并且具有穿过它的开孔并且在层压前层之前被填充(17)。 在衬底的背面上,优选在沉积发射层之前,旋涂在介电层(21)上,介电层(21)借助临时掩模(未示出)显影以提供可蚀刻轨道。 这些被蚀刻以留下对应于从基础层通孔(17)到下一电介质层(25)中的通孔(24)的金属互连(23)的沟槽(22),通常比前一个(21)更厚。 金属互连(23)通过丝网印刷和烧制形成。 然后放置另一对电介质层(26,27),显影,蚀刻并填充互连(28)和通孔(29)以连接到下一个通孔。 该过程继续在基础层(16)后面建立四对介电层。 在每个连续的层中,通孔逐渐间隔开并且它们的布置被组织,使得它们可以经由以类似方式提供到互连轨道的金属垫(31)与驱动器芯片触点接触。