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1. 发明授权

EP2544368B1 Surface mountable multi-layer ceramic filter 失效
标题翻译：表面安装多层陶瓷过滤器
公开(公告)号：EP2544368B1
公开(公告)日：2016-08-24
申请号：EP12175435.2
申请日：2012-07-06
申请人： Kemet Electronics Corporation
发明人： Bultitude, John , Laps, Mark R. , Magee, James R. , Jones, Lonnie G.
IPC分类号： H03H1/00 , H03H3/00 , H03H7/01 , H01P1/20 , H01F17/00 , H01F41/04 , H01G4/40 , H01P1/203 , H03H9/00
CPC分类号： H03H7/0115 , H01F41/046 , H01F2017/0026 , H01G4/40 , H01P1/20345 , H03H1/0007 , H03H3/00 , H03H9/00 , H03H2001/0085 , Y10T29/4913

2. 发明公开

EP3005382A2 APPARATUS AND METHODS FOR VECTOR INDUCTORS 审中-公开
标题翻译：用于矢量电感器的装置和方法
公开(公告)号：EP3005382A2
公开(公告)日：2016-04-13
申请号：EP14733446.0
申请日：2014-05-27
申请人： Newlans, Inc.
发明人： SI MOUSSA, Mehdi , LAI, Zhiguo , GUPTA, Dev, V.
IPC分类号： H01F17/00 , H03H5/00
CPC分类号： H01F17/0013 , H01F2017/0026 , H01G4/38 , H01G4/40 , H01G5/38 , H01L23/642 , H01L27/0811 , H01L28/10 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/83385 , H01L2924/0002 , H01L2924/15311 , H03H5/003 , H03H7/01 , H03H7/0115 , H03H7/0138 , H03H7/0153 , H03H7/09 , H03H7/38 , H03H7/48 , H03H11/1291 , H03H2210/025 , H03H2210/036 , H03H2240/00 , H01L2924/00014 , H01L2924/00
摘要： Apparatus and methods for vector inductors are provided herein. In certain configurations, an apparatus includes a vector inductor comprising a plurality of conductors arranged in a stack and separated from one another by dielectric. The conductors are tightly coupled to one another to provide a relatively high amount of mutual inductance. For example, adjacent conductors in the stack can be mutually coupled with a coupling coefficient k that is at least 0.5, or more particularly, 0.9 or greater. In certain implementations, the conductors are electrically connected in parallel with one another to provide the vector inductor with low resistance. However, tight coupling between the conductors in the stack can result in vector inductor having an overall inductance that is similar to that of a self- inductance of an individual conductor in the stack. The Q-factor of the vector inductor can be increased by the inclusion of additional conductors in the stack.
摘要翻译：这里提供了用于矢量电感器的装置和方法。在某些配置中，一种装置包括矢量电感器，该矢量电感器包括布置成堆叠并且通过电介质彼此分开的多个导体。导体彼此紧密耦合以提供相对高的互感量。例如，堆叠中的相邻导体可以以至少0.5，或者更具体地，0.9或更大的耦合系数k相互耦合。在某些实施方式中，导体彼此并联电连接以提供具有低电阻的矢量电感器。然而，堆叠中的导体之间的紧密耦合可以导致具有与堆叠中的单个导体的自感相似的总电感的矢量电感。矢量电感的Q因子可以通过在叠层中包含额外的导体来增加。

3. 发明公开

EP2007009A3 Planar emi filter 审中-公开
标题翻译： Planares Emi过滤器
公开(公告)号：EP2007009A3
公开(公告)日：2009-12-02
申请号：EP08252033.9
申请日：2008-06-12
申请人： City University of Hong Kong
发明人： Hui, Shu Yuen Ron , Lui, Xun , Lee, Chi Kwan
IPC分类号： H03H1/00 , H03H7/09 , H03H7/01 , H03H11/04 , H01F17/00 , H05K1/16 , H01G4/30
CPC分类号： H01F17/0013 , H01F2017/0026 , H01F2017/0073 , H03H7/427 , H03H2001/0078 , H03H2001/0085
摘要： An EMI filter for use between a power source and an electronic product is formed of at least one planar element comprising a pair of opposed coreless spiral planar windings, and a planar capacitor. This enables the integration of common mode and differential mode filters into integrated planar structures. Furthermore the planar EMI filter may be combined with an active filter element to provide a hybrid EMI filter comprising both passive and active elements with superior performance.

4. 发明授权

EP1087524B1 Laminated chip component and manufacturing method 有权
标题翻译：一种层叠芯片部件和制造工艺
公开(公告)号：EP1087524B1
公开(公告)日：2008-01-30
申请号：EP00308288.0
申请日：2000-09-22
申请人： TOKO, INC.
发明人： Muramatsu, Nobuaki, Toko KK Tamagawa Kojo , Ogawa, Takahiro, Toko KK Tamagawa Kojo
IPC分类号： H03H7/01 , H03H1/00
CPC分类号： H05K1/16 , H01F2017/0026 , H01G4/232 , H01G4/30 , H03H1/00 , H03H7/0115 , H03H2001/0085 , H05K3/4617

5. 发明公开

EP1654763A4 COMPLEX LAMINATED CHIP ELEMENT 审中-公开
标题翻译： KOMPLEXES LAMINIERTES CHIPELEMENT
公开(公告)号：EP1654763A4
公开(公告)日：2008-01-16
申请号：EP04774129
申请日：2004-07-15
申请人： INNOCHIPS TECHNOLOGY CO LTD , PARK IN-KIL , HWANG SOON-HA , KIM DUK-HEE
发明人： PARK IN-KIL , HWANG SOON-HA , KIM DUK-HEE
IPC分类号： H03H7/01 , H01C1/148 , H01C7/00 , H01C7/18 , H01C13/02 , H01F17/00 , H01G4/232 , H01G4/40 , H01L27/02
CPC分类号： H01G4/40 , H01C1/148 , H01C7/008 , H01C7/18 , H01C13/02 , H01F17/0006 , H01F27/40 , H01F2017/0026 , H01G4/232 , H01G4/35 , H03H1/02 , H03H2001/0014 , H03H2001/0085 , H03H2001/0092
摘要： The present invention relates to a laminated chip element which can be manufactured to have desired electric properties by combining various elements in accordance with the desired objectives. More p articularly, t he present invention relates to a laminated chip element which has superior high frequency properties and can be manufactured to control capacitance and/or inductance of the laminated chip element to a desired value. There is provided a laminated chip element, comprising at least one first sheet on which first and second conductive patterns are formed, the first and second conductive patterns being spaced apart from each other in a direction of both ends of the first sheet; and at least one second sheet on which a third conductive pattern is formed, the third conductive pattern being formed in a transverse direction of both the ends of the first sheet; wherein one ends of the first and second conductive patterns are connected to first and second external terminals, respectively, at least one end of the third conductive pattern is connected to a third external terminal, and the first and second sheets are laminated. There is also provided a laminated chip element, comprising: at least one first sheet on which a first conductive pattern is formed, the first conductive pattern consisting of first to third portions, the first and second portions being spaced apart from each other in a direction of both ends of the first sheet, the second portion connecting the first and second portions to each other to have a predetermined inductance; and at least one second sheet on which a second conductive pattern is formed in a transverse direction of both the ends of the first sheet; wherein the first and second portions are connected to first and second external terminals, respectively, at least one ends of the second conductive pattern is connected to a third external terminal, and the first and second sheets are laminated.

6. 发明公开

EP1223591A3 Multilayer electronic component and communication apparatus 审中-公开
标题翻译：多层电子元件和通信设备
公开(公告)号：EP1223591A3
公开(公告)日：2007-06-06
申请号：EP02000463.6
申请日：2002-01-08
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Yamakawa, Takehiko , Ishizaki, Toshio , Yamada, Toru , Kitazawa, Shoichi , Iwasaki, Tomoyuki
IPC分类号： H03H7/01 , H01F17/00 , H01G4/40
CPC分类号： H03H7/175 , H01F17/0013 , H01F27/362 , H01F2017/0026 , H01G4/40 , H03H7/1758 , H03H7/1766 , H03H7/1791 , H03H7/463 , H03H2001/0085
摘要： A multilayer electronic component has a multilayered product laminating a plurality of dielectric sheets as one piece,
a plurality of grounded electrodes provided among the dielectric sheets being different inside the multilayered product, and
inductor electrodes provided on the dielectric sheet surfaces not having the plurality of grounded electrodes inside the multilayered product,
wherein all or part of the inductor electrodes are placed so as not to be sandwiched by the plurality of grounded electrodes.

7. 发明授权

EP0844625B1 Multilayer electronic part and method for producing the same 失效
标题翻译：的多层电子部件和其制备方法
公开(公告)号：EP0844625B1
公开(公告)日：2003-03-12
申请号：EP97120473.0
申请日：1997-11-21
申请人： TDK Corporation
发明人： Kumagai, Shuumi , Sasaki, Kouzou , Kobayashi, Makoto , Saito, Noriyuki , Abe, Hisayuki , Takahashi, Toru , Shibata, Kenji
IPC分类号： H01F17/00 , H01F27/29 , H01F41/04
CPC分类号： H03H7/0115 , H01F17/0013 , H01F27/292 , H01F41/043 , H01F41/046 , H01F2017/0026 , H03H2001/0057 , H03H2001/0085 , Y10T29/43 , Y10T29/435 , Y10T29/49002 , Y10T29/49126 , Y10T29/4913 , Y10T29/49135 , Y10T29/49142 , Y10T29/49144 , Y10T29/49147 , Y10T29/49179 , Y10T29/49208 , Y10T29/49222

8. 发明公开

EP0844625A3 Multilayer electronic part and method for producing the same 失效
标题翻译：的多层电子部件和其制备方法
公开(公告)号：EP0844625A3
公开(公告)日：1999-02-10
申请号：EP97120473.0
申请日：1997-11-21
申请人： TDK Corporation
发明人： Kumagai, Shuumi , Sasaki, Kouzou , Kobayashi, Makoto , Saito, Noriyuki , Abe, Hisayuki , Takahashi, Toru , Shibata, Kenji
IPC分类号： H01F17/00 , H01F27/29 , H01F41/04
CPC分类号： H03H7/0115 , H01F17/0013 , H01F27/292 , H01F41/043 , H01F41/046 , H01F2017/0026 , H03H2001/0057 , H03H2001/0085 , Y10T29/43 , Y10T29/435 , Y10T29/49002 , Y10T29/49126 , Y10T29/4913 , Y10T29/49135 , Y10T29/49142 , Y10T29/49144 , Y10T29/49147 , Y10T29/49179 , Y10T29/49208 , Y10T29/49222
摘要： A multilayer electronic part having the shape of a substantially rectangular parallelopiped is constituted which has a multilayer body formed by superposing coil conductors and green sheets of a magnetic or nonmagnetic material. Terminal electrodes are formed respectively on both ends of the multilayer body along the direction of the magnetic flux generating when current is caused to flow through the coil conductors in the multilayer body. The terminal electrodes each has a conductive substrate formed within the area of the end of the multilayer body and consisting of a lamination body as a component of the multilayer body.

9. 发明公开

EP0844625A2 Multilayer electronic part and method for producing the same 失效
标题翻译： Mehrschichtiges elektronisches Bauelement und Verfahren zu seiner Herstellung
公开(公告)号：EP0844625A2
公开(公告)日：1998-05-27
申请号：EP97120473.0
申请日：1997-11-21
申请人： TDK Corporation
发明人： Kumagai, Shuumi , Sasaki, Kouzou , Kobayashi, Makoto , Saito, Noriyuki , Abe, Hisayuki , Takahashi, Toru , Shibata, Kenji
IPC分类号： H01F17/00 , H01F27/29 , H01F41/04
CPC分类号： H03H7/0115 , H01F17/0013 , H01F27/292 , H01F41/043 , H01F41/046 , H01F2017/0026 , H03H2001/0057 , H03H2001/0085 , Y10T29/43 , Y10T29/435 , Y10T29/49002 , Y10T29/49126 , Y10T29/4913 , Y10T29/49135 , Y10T29/49142 , Y10T29/49144 , Y10T29/49147 , Y10T29/49179 , Y10T29/49208 , Y10T29/49222
摘要： A multilayer electronic part having the shape of a substantially rectangular parallelopiped is constituted which has a multilayer body formed by superposing coil conductors and green sheets of a magnetic or nonmagnetic material. Terminal electrodes are formed respectively on both ends of the multilayer body along the direction of the magnetic flux generating when current is caused to flow through the coil conductors in the multilayer body. The terminal electrodes each has a conductive substrate formed within the area of the end of the multilayer body and consisting of a lamination body as a component of the multilayer body.
摘要翻译：构成具有大致矩形的平行六面体形状的多层电子部件，其具有通过叠加线圈导体和磁性或非磁性材料的生片形成的多层体。当电流流过多层体中的线圈导体时，沿着磁通量产生的方向分别在多层体的两端形成端子电极。端子电极各自具有形成在多层体的端部的区域内的导电性基板，并且由作为多层体的部件的层叠体构成。

10. 发明公开

EP0443512A1 Composite electric part of stacked multi-layer structure 失效
标题翻译： Elektrischer Formgegenstand mit gestapelter Mehrschichtstruktur。
公开(公告)号：EP0443512A1
公开(公告)日：1991-08-28
申请号：EP91102336.4
申请日：1991-02-19
申请人： TDK Corporation
发明人： Takaya, Minoru , Yasuda, Katsuharu
IPC分类号： H01F5/00 , H01F17/00
CPC分类号： H01F17/0013 , H01F17/0006 , H01F2017/0026
摘要： A composite electric part of a stacked multi-layer structure is composed of a capacor layer and a coil layer. The coil layer comprises a plurality of coils buried in a magnetic material. At least one of the coils includes a plurality of coil conductors which comprises combinations each of two coil conductors wound spirally in opposite directions around respective winding axes extending substantially coaxially with each other, and mutually connected such that magnetic fields are generated in a same direction by the two coil conductors. A miniature size of composite electric part exhibiting a high inductance value is realized.
摘要翻译：层叠多层结构的复合电气部件由电容层和线圈层构成。线圈层包括埋在磁性材料中的多个线圈。线圈中的至少一个包括多个线圈导体，其包括两个线圈导体的组合，每个线圈导体围绕彼此大致同轴延伸的相应绕组轴线螺旋地卷绕，并且相互连接，使得通过相同方向产生磁场两个线圈导体。实现了具有高电感值的复合电气部件的微型尺寸。

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