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1. 发明公开

EP1503409A3 Module with embedded semiconductor IC which has a narrow electrode pitch and method of fabricating the module 有权
标题翻译：包括模块具有嵌入的半导体芯片，该模块的窄电极间距和制造方法
公开(公告)号：EP1503409A3
公开(公告)日：2006-09-06
申请号：EP04254569.9
申请日：2004-07-30
申请人： TDK Corporation
发明人： Takaya, Minoru , Abe, Hisayuki , Suzuki, Kei , Takano, Kosuke , Kawabata, Kenichi , Endo, Toshikazu
IPC分类号： H01L21/60 , H01L21/68 , H01L23/538 , H01L23/31 , H01L23/498 , H05K1/18
CPC分类号： H01L24/82 , H01L21/568 , H01L23/5389 , H01L24/19 , H01L2221/68359 , H01L2221/68363 , H01L2224/04105 , H01L2224/05026 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/16237 , H01L2224/82039 , H01L2224/82138 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01057 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/30105 , H05K1/185 , H01L2924/00 , H01L2224/05599
摘要： A module with an embedded semiconductor IC includes a first resin layer, a second resin layer, post electrodes passing through the first and second resin layers, and a semiconductor IC mounted as embedded between the first resin layer and the second resin layer. Stud bumps are formed on land electrodes of the semiconductor IC and positioned with respect to the post electrodes. Owing to this positioning of the stud bumps formed on the semiconductor IC with respect to the post electrodes, the planar position of the stud bumps is substantially fixed. As a result, it is possible to use a semiconductor IC having a very narrow electrode pitch of 100 µm or smaller, particularly of around 60 µm.

2. 发明公开

EP1729341A3 Semiconductor IC and its manufacturing method, and module with embedded semiconductor IC and its manufacturing method 审中-公开
标题翻译：一种半导体集成电路，和它们的制备方法和模块具有嵌入半导体集成电路及其制造方法
公开(公告)号：EP1729341A3
公开(公告)日：2014-03-26
申请号：EP06252853.4
申请日：2006-06-01
申请人： TDK Corporation
发明人： Kawabata, Kenichi , Abe, Hisayuki
IPC分类号： H01L23/31 , H01L23/433 , H01L23/00
CPC分类号： H01L31/02002 , H01L23/3114 , H01L23/4334 , H01L24/19 , H01L24/82 , H01L2224/0401 , H01L2224/04026 , H01L2224/04105 , H01L2224/1134 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13171 , H01L2224/16 , H01L2224/32245 , H01L2224/73253 , H01L2224/73267 , H01L2224/92244 , H01L2224/94 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/3511 , H01L2924/3512 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2224/214
摘要： A semiconductor IC includes a semiconductor IC main body having a predetermined circuit formed on a main surface, a metal layer selectively provided on substantially the whole back surface of the semiconductor IC main body excluding the periphery. According to the present invention, the metal layer provided on the semiconductor IC main body can dissipate heat at a high level. Because the metal layer is selectively provided, even when the semiconductor IC main body is thinned by polishing, warpage does not occur easily in a wafer state. The metal layer is selectively provided at the center of the back surface of the semiconductor IC. Therefore, a laminate of a semiconductor wafer and a thick metal does not need to be diced. As a result, chipping on the disconnected surface can be prevented effectively.

3. 发明公开

EP2296451A1 Terminal structure, printed wiring board, module substrate, and electronic device 有权
标题翻译： Endgerätestruktur，Leiterplatte，Modulsubstrat und elektronische Vorrichtung
公开(公告)号：EP2296451A1
公开(公告)日：2011-03-16
申请号：EP10175344.0
申请日：2010-09-06
申请人： TDK Corporation
发明人： Sato, Atsushi , Abe, Hisayuki , Ota, Takashi , Yanagida, Miyuki , Kameda, Masumi
IPC分类号： H05K3/24 , H01L23/488
CPC分类号： H05K3/24 , H01G2/065 , H01G4/228 , H01L24/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01327
摘要： The present invention provides a terminal structure 14 including a terminal 12 having a conductor 40 containing at least one metal selected from the group consisting of gold, silver, and copper, a first layer containing phosphorus and nickel disposed on the conductor 40, and a second layer having a nickel/phosphorus atomic ratio smaller than that of the first layer and containing Ni 3 P disposed on the first layer; and solder 70 disposed on the second layer of the terminal 12, while the second layer has a thickness of at least 0.35 µm; and a module substrate 100 having the terminal structure.
摘要翻译：本发明提供一种端子结构14，其包括具有导体40的端子12，该导体40包含选自金，银和铜中的至少一种金属，设置在导体40上的含磷和镍的第一层，以及第二层层，其镍/磷原子比小于第一层的Ni / P原子比，并且包含设置在第一层上的Ni 3 P; 和设置在端子12的第二层上的焊料70，而第二层具有至少0.35μm的厚度; 以及具有端子结构的模块基板100。

4. 发明公开

EP2019395A3 Stacked electronic part and method of manufacturing the same 有权
标题翻译：多层组件及其制造方法
公开(公告)号：EP2019395A3
公开(公告)日：2010-10-13
申请号：EP08013190.7
申请日：2008-07-22
申请人： TDK Corporation
发明人： Kajino, Takashi , Abe, Hisayuki , Kakinuma, Akira , Itoh, Kazuhiko
IPC分类号： H01C7/02
CPC分类号： H01C7/02 , H01C1/14 , Y10T29/49082 , Y10T29/49085
摘要： Provided are a stacked electronic part (1) that can sufficiently suppress plating deposition on the surface of a porous green body (2) when a terminal electrode (7) is formed on an external electrode (5), thereby enabling a decrease in the reliability of products to be prevented, and a method of manufacturing the stacked electronic part (1). The stacked electronic part (1) is a PTC thermistor having a stacked body (4) containing a porous green body (2) made of ceramics and having a plurality of vacancies and a plurality of internal electrodes (3) formed within the porous green body (2), and is provided with at least one unit structure (10) in which the porous green body (2) and the internal electrode (3) are stacked. External electrodes (5) are connected to the internal electrode (2), and upon the external electrodes (5) are formed terminal electrodes (7) by plating. Resin is filled in the plurality of vacancies of the porous green body (2) at a filling ratio of not less than 60%.

5. 发明公开

EP2019395A2 Stacked electronic part and method of manufacturing the same 有权
标题翻译： Mehrschichtbauteil und Herstellungsverfahrendafür
公开(公告)号：EP2019395A2
公开(公告)日：2009-01-28
申请号：EP08013190.7
申请日：2008-07-22
申请人： TDK Corporation
发明人： Kajino, Takashi , Abe, Hisayuki , Kakinuma, Akira , Itoh, Kazuhiko
IPC分类号： H01C7/02
CPC分类号： H01C7/02 , H01C1/14 , Y10T29/49082 , Y10T29/49085
摘要： Provided are a stacked electronic part (1) that can sufficiently suppress plating deposition on the surface of a porous green body (2) when a terminal electrode (7) is formed on an external electrode (5), thereby enabling a decrease in the reliability of products to be prevented, and a method of manufacturing the stacked electronic part (1). The stacked electronic part (1) is a PTC thermistor having a stacked body (4) containing a porous green body (2) made of ceramics and having a plurality of vacancies and a plurality of internal electrodes (3) formed within the porous green body (2), and is provided with at least one unit structure (10) in which the porous green body (2) and the internal electrode (3) are stacked. External electrodes (5) are connected to the internal electrode (2), and upon the external electrodes (5) are formed terminal electrodes (7) by plating. Resin is filled in the plurality of vacancies of the porous green body (2) at a filling ratio of not less than 60%.
摘要翻译：提供了当在外部电极（5）上形成端子电极（7）时，可以充分抑制多孔生坯体（2）的表面上的电镀沉积的叠层电子部件（1），从而能够降低可靠性的产品，以及制造堆叠的电子部件（1）的方法。层叠电子部件（1）是具有堆叠体（4）的PTC热敏电阻，该层叠体包含由陶瓷制成的具有多个空位的多孔生坯（2）和形成在多孔生坯体内的多个内部电极（3）（2），并且设置有多孔生坯（2）和内部电极（3）堆叠在其中的至少一个单元结构（10）。外部电极（5）与内部电极（2）连接，外部电极（5）通过电镀形成端子电极（7）。树脂以不小于60％的填充率填充在多孔生坯（2）的多个空位中。

6. 发明授权

EP0844625B1 Multilayer electronic part and method for producing the same 失效
标题翻译：的多层电子部件和其制备方法
公开(公告)号：EP0844625B1
公开(公告)日：2003-03-12
申请号：EP97120473.0
申请日：1997-11-21
申请人： TDK Corporation
发明人： Kumagai, Shuumi , Sasaki, Kouzou , Kobayashi, Makoto , Saito, Noriyuki , Abe, Hisayuki , Takahashi, Toru , Shibata, Kenji
IPC分类号： H01F17/00 , H01F27/29 , H01F41/04
CPC分类号： H03H7/0115 , H01F17/0013 , H01F27/292 , H01F41/043 , H01F41/046 , H01F2017/0026 , H03H2001/0057 , H03H2001/0085 , Y10T29/43 , Y10T29/435 , Y10T29/49002 , Y10T29/49126 , Y10T29/4913 , Y10T29/49135 , Y10T29/49142 , Y10T29/49144 , Y10T29/49147 , Y10T29/49179 , Y10T29/49208 , Y10T29/49222

7. 发明公开

EP0844625A3 Multilayer electronic part and method for producing the same 失效
标题翻译：的多层电子部件和其制备方法
公开(公告)号：EP0844625A3
公开(公告)日：1999-02-10
申请号：EP97120473.0
申请日：1997-11-21
申请人： TDK Corporation
发明人： Kumagai, Shuumi , Sasaki, Kouzou , Kobayashi, Makoto , Saito, Noriyuki , Abe, Hisayuki , Takahashi, Toru , Shibata, Kenji
IPC分类号： H01F17/00 , H01F27/29 , H01F41/04
CPC分类号： H03H7/0115 , H01F17/0013 , H01F27/292 , H01F41/043 , H01F41/046 , H01F2017/0026 , H03H2001/0057 , H03H2001/0085 , Y10T29/43 , Y10T29/435 , Y10T29/49002 , Y10T29/49126 , Y10T29/4913 , Y10T29/49135 , Y10T29/49142 , Y10T29/49144 , Y10T29/49147 , Y10T29/49179 , Y10T29/49208 , Y10T29/49222
摘要： A multilayer electronic part having the shape of a substantially rectangular parallelopiped is constituted which has a multilayer body formed by superposing coil conductors and green sheets of a magnetic or nonmagnetic material. Terminal electrodes are formed respectively on both ends of the multilayer body along the direction of the magnetic flux generating when current is caused to flow through the coil conductors in the multilayer body. The terminal electrodes each has a conductive substrate formed within the area of the end of the multilayer body and consisting of a lamination body as a component of the multilayer body.

8. 发明公开

EP0844625A2 Multilayer electronic part and method for producing the same 失效
标题翻译： Mehrschichtiges elektronisches Bauelement und Verfahren zu seiner Herstellung
公开(公告)号：EP0844625A2
公开(公告)日：1998-05-27
申请号：EP97120473.0
申请日：1997-11-21
申请人： TDK Corporation
发明人： Kumagai, Shuumi , Sasaki, Kouzou , Kobayashi, Makoto , Saito, Noriyuki , Abe, Hisayuki , Takahashi, Toru , Shibata, Kenji
IPC分类号： H01F17/00 , H01F27/29 , H01F41/04
CPC分类号： H03H7/0115 , H01F17/0013 , H01F27/292 , H01F41/043 , H01F41/046 , H01F2017/0026 , H03H2001/0057 , H03H2001/0085 , Y10T29/43 , Y10T29/435 , Y10T29/49002 , Y10T29/49126 , Y10T29/4913 , Y10T29/49135 , Y10T29/49142 , Y10T29/49144 , Y10T29/49147 , Y10T29/49179 , Y10T29/49208 , Y10T29/49222
摘要： A multilayer electronic part having the shape of a substantially rectangular parallelopiped is constituted which has a multilayer body formed by superposing coil conductors and green sheets of a magnetic or nonmagnetic material. Terminal electrodes are formed respectively on both ends of the multilayer body along the direction of the magnetic flux generating when current is caused to flow through the coil conductors in the multilayer body. The terminal electrodes each has a conductive substrate formed within the area of the end of the multilayer body and consisting of a lamination body as a component of the multilayer body.
摘要翻译：构成具有大致矩形的平行六面体形状的多层电子部件，其具有通过叠加线圈导体和磁性或非磁性材料的生片形成的多层体。当电流流过多层体中的线圈导体时，沿着磁通量产生的方向分别在多层体的两端形成端子电极。端子电极各自具有形成在多层体的端部的区域内的导电性基板，并且由作为多层体的部件的层叠体构成。

9. 发明授权

EP2296451B1 Terminal structure, printed wiring board, module substrate, and electronic device 有权
标题翻译：终端结构，电路板，所述模块基板和电子装置
公开(公告)号：EP2296451B1
公开(公告)日：2016-05-11
申请号：EP10175344.0
申请日：2010-09-06
申请人： TDK Corporation
发明人： Sato, Atsushi , Abe, Hisayuki , Ota, Takashi , Yanagida, Miyuki , Kameda, Masumi
IPC分类号： H05K3/24 , H01L23/488
CPC分类号： H05K3/24 , H01G2/065 , H01G4/228 , H01L24/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01327

10. 发明公开

EP2410078A1 Coating and electronic component 有权转让
标题翻译： Beschichtung und elektronisches Bauteil
公开(公告)号：EP2410078A1
公开(公告)日：2012-01-25
申请号：EP11169812.2
申请日：2011-06-14
申请人： TDK Corporation
发明人： Yoshida, Kenichi , Horikawa, Yuhei , Sato, Atsushi , Abe, Hisayuki
IPC分类号： C23C28/02 , H01L23/12
CPC分类号： C23C18/1655 , C23C18/1637 , C23C18/1651 , C23C18/32 , C23C18/42 , C23C18/54 , C23C28/02 , H01L24/03 , H01L24/05 , H01L2224/03464 , H01L2224/0401 , H01L2224/04042 , H01L2224/05083 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05164 , H01L2224/05644 , H01L2924/01015 , H01L2924/14 , H01L2924/00
摘要： The present invention provides a coating 10 provided on a conductor 20, the coating 10 has a first layer 12 containing palladium and a second layer 14 containing gold from the conductor 20 side, the first layer 12 has a first region 31 on the conductor 20 side and a second region 32 arranged nearer to the second layer 14 than the first region 31, and the second region 32 has a higher phosphorus concentration than the first region 31.
摘要翻译：本发明提供了一种设置在导体20上的涂层10，涂层10具有包含钯的第一层12和从导体20侧含有金的第二层14，第一层12在导体20侧具有第一区域31 以及比第一区域31更靠近第二层14布置的第二区域32，并且第二区域32具有比第一区域31更高的磷浓度。

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