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    • 2. 发明公开
    • Semiconductor memory chip, and a memory device including such chips
    • Halbleiterspeicherbaustein und Speicheranordnung mit solchen Bausteinen。
    • EP0037734A2
    • 1981-10-14
    • EP81301494.1
    • 1981-04-07
    • FUJITSU LIMITED
    • Yamada, KatsuyukiIsogai, Hideaki
    • G11C11/40G11C7/00
    • G11C11/414
    • Circuitry is provided for clamping bit line voltage, when a chip is non-selected, to a level (RL) higher than the bit line voltage level (R) during read operation when the chip is selected.
      For example, data lines D, D, which carry read voltage R in a read operation when the chip is selected, are connected to the bases of read transistors 0, o , Q 11 which are connected in turn to bit lines Boo, B 01 ; B 10 , B 11 .
      A clamp circuit CL is connected to the lines D, D. The clamp circuit has a multi-emitter transistor Q 8 , emitters of which are connected to the data lines D, D. The collector of Q 8 is connected to power supply line V DD , and the base is connected to a circuit point P 1 which is high level when the chip is non-selected, and low level when the chip is selected. When P, is high level transistor Q 8 is turned ON and a high level voltage Voo - V BE is applied to the data lines D, D to clamp the bit line voltage to RL. (VSE is the base-emitter potential of Q a ).
    • 提供电路,用于当芯片未被选择时将位线电压钳位到高于选择芯片的读取操作期间的位线电压电平(R)的电平(RL)。 例如,当选择芯片时,在读取操作中携带读取电压R的数据线D,D连接到依次连接到位线B00的读取晶体管Q10,Q11的基极; B01 B10,B11。 钳位电路CL连接到线路D,D。钳位电路具有多发射极晶体管Q8,其发射极连接到数据线D,D。Q8的集电极连接到电源 电源线VDD,并且基极连接到当芯片未被选择时为高电平的电路点P1,并且当选择芯片时,基极连接到低电平。 当P1是高电平晶体管Q8导通时,高电平电压VDD-VBE被施加到数据线D,D以将位线电压钳位到RL。 (VBE是Q8的基极 - 发射极电位)。
    • 5. 发明授权
    • HIGH DENSITY MEMORY SYSTEM
    • 高密度记忆体系统
    • EP0016827B1
    • 1984-12-05
    • EP79901181.2
    • 1979-08-28
    • NCR CORPORATION
    • WARD, William Pearson
    • G11C13/00
    • G11C11/414G06F13/4243G11C7/22G11C11/409Y02D10/14Y02D10/151
    • A high density memory system is formed by reducing the number of electrical conductors that are needed to connect individual memory devices into an operable memory system. The reduction is accomplished by serially reading and writing data from and into selected memory elements on one function conductor while eliminating the need for additional control conductors by causing the state of the signal on a clock conductor as compared to the state of the signal on the function conductor at selected times to control the operating mode of the memory system.
    • 高密度存储器系统包括多个可寻址电路板(201至202)。 每个板包括一对芯片阵列(22),每个芯片阵列(22)包括成组布置的多个存储元件(56)。 每个存储器元件(56)是包括多个存储环路的电荷耦合器件。 在操作中,地址线(32)上的地址信号使与所选阵列(22)相关联的解码器(28)向包括多个单独时钟驱动器(241至24n)的时钟驱动器装置(24)提供比较信号, 其中一个由行地址信号选择,由此提供改变的时钟脉冲宽度信号,该信号检测到该改变,从而启用一组存储元件(56)。 功能驱动器电路(26)提供模式控制信号,其将使能的存储器元件(56)置于读取或写入操作模式。 高密度存储系统的实现是因为只使用少量的电互连导体。