专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP3037475A4 PHENOXY CYCLOTRIPHOSPHAZENE ACTIVE ESTER, HALOGEN-FREE RESIN COMPOSITION AND USE THEREOF 审中-公开
标题翻译： AKTIVER PHENOXYCLOTRIPHOSPHAZENESTER，HALOGENFREIE HARZZUSAMMENSETZUNG UND VERWENDUNG DAVON
公开(公告)号：EP3037475A4
公开(公告)日：2017-06-07
申请号：EP14894791
申请日：2014-06-13
申请人： SHENGYI TECHNOLOGY CO LTD
发明人： HE YUESHAN
IPC分类号： C08L63/00 , C07F9/6581 , C07F9/6593 , C08G59/30 , C08G63/692 , C08J5/24 , C08K5/5399 , C08L79/02 , C09K21/14 , H01B3/40 , H05K1/03
CPC分类号： C07F9/65812 , C07F9/65815 , C08G59/304 , C08J5/043 , C08J5/24 , C08J2363/00 , C08J2363/08 , C08J2371/00 , C08J2375/00 , C08J2379/00 , C08J2379/02 , C08J2435/06 , C08J2463/08 , C08K5/5399 , C08L63/08 , C08L71/00 , C08L75/00 , C08L79/02 , C08L2201/02 , C08L2201/22 , C08L2203/20 , C08L2205/03 , C09K21/12 , C09K21/14 , H05K1/0373 , H05K2201/012 , H05K2201/0145 , H05K2201/0209
摘要： The present invention discloses a phenoxycyclotriphosphazene active ester, a halogen-free resin composition and uses thereof. The phenoxycyclotriphosphazene active ester comprises at least 65 mol.% of a substance having the following structural formula. The halogen-free resin composition comprises 5-50 parts by weight of a phenoxycyclotriphosphazene active ester, 15-85 parts by weight of a thermosetting resin, 1-35 parts by weight of a curing agent, 0-5 parts by weight of a curing accelerator and 0-100 parts by weight of an inorganic filler. The present invention discloses introducing phenoxycyclotriphosphazene active ester into a thermosetting resin, reacting active esters with thermosetting resins, such as epoxy resin, without producing hydroxy groups, which not only satisfies the requirements on being halogen-free and flame retardancy, but also improves the electrical properties (decreasing and stabilizing Dk and Df) of the system, so as to make non-halogenation of high frequency and high speed substrate materials possible.
摘要翻译：本发明公开了一种苯氧基环三磷腈活性酯，一种无卤树脂组合物及其用途。苯氧基环三磷腈活性酯包含至少65摩尔％的具有以下结构式的物质。该无卤树脂组合物包含5-50重量份苯氧基环三磷腈活性酯，15-85重量份热固性树脂，1-35重量份固化剂，0-5重量份固化促进剂和0-100重量份的无机填料。本发明公开了将苯氧基环三磷腈活性酯引入到热固性树脂中，使活性酯与环氧树脂等热固性树脂反应而不产生羟基，这不仅满足了无卤素和阻燃性的要求，而且还改善了电气使系统的性能（降低和稳定Dk和Df），从而使高频和高速衬底材料成为可能的非卤化。

2. 发明公开

EP3157974A1 PROCEDE DE PREPARATION D'UNE COMPOSITION DE CAOUTCHOUC COMPRENANT UN ELASTOMERE EPOXYDE RETICULE PAR UN POLY-ACIDE CARBOXYLIQUE 审中-公开
标题翻译：方法用于生产具有A A橡胶组合物联网的多元EPOXIDELASTOMER
公开(公告)号：EP3157974A1
公开(公告)日：2017-04-26
申请号：EP15729823.3
申请日：2015-06-16
申请人： Compagnie Générale des Etablissements Michelin , MICHELIN Recherche et Technique S.A.
发明人： SCHNELL, Benoit , FLEURY, Etienne
IPC分类号： C08G59/02 , C08G59/42 , C08G59/50 , C08L15/00 , C08K5/092 , C08K5/3445 , C08L63/08
CPC分类号： C08L15/00 , C08G59/027 , C08G59/4253 , C08G59/5073 , C08K5/092 , C08K5/3445 , C08L63/08
摘要： The present invention relates to a process for preparation of a rubber composition made from at least one majority elastomer comprising epoxide functional groups, a reinforcing filler and a cross-linking system of said elastomer comprising a polycarboxylic acid and an imidazole, characterized in that the composition is prepared via a thermal mechanical mixing phase in the course of which all of the ingredients other than the cross-linking system are introduced together with, optionally, a part of the cross-linking system or all of the cross-linking system, at low temperature, i.e. at a maximum temperature of between 110 °C and 130 °C, the temperature at which the mixing is stopped.
摘要翻译：本发明涉及一种用于制备包含环氧化物官能团，增强填料和所述弹性体的，其包括多元羧酸和咪唑的交联系统从至少一个多数弹性体由橡胶组合物，在DASS模具组合物，特征的通过在其中的过程中的热机械混合阶段制备的所有比的交联体系的其它成分的与一起引入，任选地，所述交联系统的一部分或全部的交联体系的，在低温度，即在110℃和130℃，在其中混合停止温度之间的最大温度。

3. 发明授权

EP1153972B2 RUBBER COMPOSITION 有权
标题翻译：的橡胶混合物
公开(公告)号：EP1153972B2
公开(公告)日：2012-01-11
申请号：EP00962847.0
申请日：2000-09-26
申请人： Asahi Kasei Kabushiki Kaisha
发明人： SAITO, Akira , YAMADA, Haruo , KUBO, Nobuaki , NAKAFUTAMI, Yasunobu
IPC分类号： C08L9/00 , C08L91/00 , C08K3/36 , C08K3/34 , C08C19/44
CPC分类号： C08L63/08 , C08C19/44 , C08K3/36 , C08L19/006 , Y10S526/912
摘要： A diene-based rubber composition which has excellent processability and an improved balance between low rolling resistance and wet skid resistance and is improved in strength properties, etc. The composition comprises: 100 parts by weight of (A) a raw rubber comprising a diene-based rubbery polymer which is (A-1) a rubbery conjugated-diene polymer or rubbery conjugated-diene/styrene copolymer and in which (1) more than 60 wt.% thereof has been modified by reacting active ends of the rubbery polymer with a polyfunctional compound having two or more epoxy groups per molecule, (2) the molecular weight distribution Mw/Mn of the polymer is 1.05 to 3.0, and (3) the weight-average molecular weight of the polymer is 100,000 to 2,000,000; 1 to 100 parts by weight of (B) an extender oil for rubbers; 25 to 100 parts by weight of (C) reinforcing silica; and 1.0 to 20 parts by weight of (D) a combination of a vulcanizing agent and a vulcanization accelerator.

4. 发明授权

EP1792935B1 Thermosetting resin composition and method of producing the same 有权
标题翻译：热固性组合物和制造方法
公开(公告)号：EP1792935B1
公开(公告)日：2009-07-08
申请号：EP06023426.7
申请日：2006-11-10
申请人： Nissin Kogyo Co., Ltd
发明人： Noguchi, Toru c/o Nissin Kogyo Co., Ltd , Magario, Akira c/o Nissin Kogyo Co., Ltd
IPC分类号： C08K3/04 , C08L63/00 , C08J5/00
CPC分类号： B82Y30/00 , C08G59/4035 , C08K3/04 , C08K3/041 , C08K7/06 , C08K9/08 , C08L63/00 , C08L63/08 , C08L2666/22
摘要： A thermosetting resin composition including: a matrix including a thermosetting resin and an elastomer; and carbon nanofibers dispersed in the matrix. The elastomer includes an unsaturated bond or a group having affinity to the carbon nanofibcrs.

5. 发明授权

EP0877057B1 A POLYALKYLENE RESIN COMPOSITION CONTAINING AN EPOXY-MODIFIED BLOCK COPOLYMER 失效
标题翻译：聚亚烷基树脂组合物中的环氧 - 改性嵌段共聚物含有
公开(公告)号：EP0877057B1
公开(公告)日：2007-05-02
申请号：EP98202416.8
申请日：1994-07-20
申请人： DAICEL CHEMICAL INDUSTRIES, LTD.
发明人： Ohtsuka, Yoshihiro
IPC分类号： C08F8/08 , C08L53/02 , C08L63/08 , C08L67/02 , C08L69/00 , C08L95/00
CPC分类号： C09J153/025 , C08F8/08 , C08L53/025 , C08L63/08 , C08L67/02 , C08L69/00 , C08L95/00 , C08L2666/02 , C08L2666/14 , C08L2666/18 , C08L53/00 , C08L71/00 , C08F297/04 , C08F297/046 , C08F8/04
摘要： Disclosed is a compatible blend which comprises (a) a resin having an affinity to an aromatic vinyl polymer, (b) a resin having reactivity to an epoxy group and (c) a compatibilizing agent comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer in which (i) a polymer block consisting of an aromatic vinyl compound and (ii) a polymer block consisting of a compound having a conjugated double bond are included, wherein remaining double bonds are partially or completely epoxidized. The compatible blend exhibits small particle sizes dispersion in a scanning electron microscopic structure observation and an excellent homogeneity in outer appearance, resulting in exhibiting an improved flow property together with improved mechanical properties such as impact strength, compared to a compatible blend having a conventional compatibilizing agent which is an aromatic-conjugated diene block copolymer or an aromatic vinyl-conjugated diene block copolymer having epoxy groups at terminals. Furthermore, the present invention relates to various resin compositions which comprise various resins and a modifier or stabilizer which is an epoxy-modified aromatic vinyl-conjugated diene block copolymer.

6. 发明公开

EP1598398A1 CURABLE COMPOSITION 有权
标题翻译：可固化组合物
公开(公告)号：EP1598398A1
公开(公告)日：2005-11-23
申请号：EP04711746.0
申请日：2004-02-17
申请人： KURARAY CO., LTD.
发明人： HIRATA, Kei, c/o Kuraray Co., Ltd. , KITAYAMA, Koji, c/o Kuraray Co., Ltd. , MAEDA, Mizuho, c/o Kuraray Co., Ltd.
IPC分类号： C08L63/08
CPC分类号： C08G59/027 , C08F283/10 , C08L63/08 , G03F7/038
摘要： A curable composition includes (A) a (meth)acrylate, (B) a radical polymerization initiator, (C) an epoxidized polyisoprene containing an epoxy group at 0.15 to 2.5 meq/g in the molecule and having a number-average molecular weight of 15000 to 200000, and (D) a curing accelerator. The curable composition shows high elongation and excellent rubber elasticity even in a cured state and has superior compatibility, transparency, waterproofness and flexibility, so that cracks and separation of cured products are reduced. Accordingly, the composition is suitable for use as adhesives, coating agents, encapsulating materials, inks, sealing materials and the like.
摘要翻译：（A）（甲基）丙烯酸酯，（B）自由基聚合引发剂，（C）分子中含有0.15〜2.5meq / g的环氧基的环氧化聚异戊二烯，其数均分子量为（D）固化促进剂。该固化性组合物即使在固化状态下也显示出高伸长率和优异的橡胶弹性，并且具有优异的相容性，透明性，防水性和柔韧性，从而减少固化产物的裂纹和分离。因此，该组合物适合用作粘合剂，涂层剂，封装材料，油墨，密封材料等。

7. 发明授权

EP0836627B2 POLYMERWERKSTOFF, VERFAHREN ZU SEINER HERSTELLUNG UND DESSEN VERWENDUNG 失效
标题翻译：高分子材料，用于生产它和它的用途
公开(公告)号：EP0836627B2
公开(公告)日：2005-06-01
申请号：EP96922761.0
申请日：1996-07-05
申请人： Bio-Composites And More GmbH
发明人： SCHÖNFELD, Uwe
IPC分类号： C08G59/34 , C08L63/08 , C08G59/42
CPC分类号： C04B26/18 , C08G59/027 , C08G59/42 , C08L63/08 , C09K3/10 , C09K2200/0441 , C09K2200/0447 , C09K2200/0645
摘要： The invention concerns a polymer material based on renewable raw materials and containing a reaction product comprising 10 to 90 mass % of a triglyceride having at least two epoxy and/or aziridine groups, and 5 to 90 mass % of a polycarboxylic acid anhydride with 0.01 to 20 mass % of a polycarboxylic acid.

8. 发明公开

EP1452566A1 THERMOSETTING RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND SUSPENSION-FORM MIXTURE 审中-公开
标题翻译： HITZEHÄRTBAREHARZZUSAMMENSETZUNG，VERFAHREN ZU IHRER HERSTELLUNG UND MISCHUNG in SUSPENSIONSFORM
公开(公告)号：EP1452566A1
公开(公告)日：2004-09-01
申请号：EP02730720.6
申请日：2002-05-27
申请人： Nippon Petrochemicals Company, Limited
发明人： TAKASHIMA, Tsutomu , FUJIMURA, Kouji , NOMURA, Hideki
IPC分类号： C08L101/00 , C08L23/30 , C08L63/00
CPC分类号： C08G59/027 , C08L23/30 , C08L63/00 , C08L63/08 , C08L101/00 , H01L23/293 , H01L2924/0002 , C08L2666/04 , H01L2924/00
摘要： This invention relates a thermosetting resin composition which is produced by curing a composition containing a thermosetting resin and a reactive mono-olefin polymer, and its phase structure is sea-island structure which comprises a continuous phase mainly composed of a cured composition containing a thermosetting resin and, if necessary, further curing agent and dispersed phases mainly composed of a reactive mono-olefin polymer and said dispersed phases contain a plurality of finer dispersed phases and/or at least one layer of interfacial phases surrounding said dispersed phases, thereby providing a thermosetting resin composition that is suitable for use in sealing or encapsulating semiconductor devices, which composition has improved impact strength, resistance to thermal cracking, resistance to deterioration by oxidation, without losing thermal stability.
摘要翻译：本发明涉及通过固化含有热固性树脂和反应性单烯烃聚合物的组合物制备的热固性树脂组合物，其相结构是海岛结构，其包含主要由含有热固性树脂的固化组合物组成的连续相并且如果需要，另外的固化剂和主要由反应性单烯烃聚合物组成的分散相和所述分散相包含多个更细的分散相和/或包围所述分散相的至少一层界面相，从而提供热固性适合用于密封或封装半导体器件的树脂组合物，该组合物具有改善的冲击强度，耐热裂纹性，耐氧化劣化性，而不损失热稳定性。

9. 发明公开

EP1288259A4 NONCRYSTALLINE CYCLIC POLYOLEFIN/EPOXIDIZED DIENE BLOCK COPOLYMER COMPOSITION AND SHEET THEREOF 审中-公开
标题翻译：不CRYSTAL环状聚烯烃/环氧DIENBLOCKCOPOLYMERZUSAMMENSETZUNG和物品获得的板材
公开(公告)号：EP1288259A4
公开(公告)日：2003-07-02
申请号：EP01930068
申请日：2001-05-11
申请人： DAICEL CHEM
发明人： YABUI AKIHIRO
IPC分类号： C08F8/00 , C08L63/08 , C08L45/00 , C08J5/18 , C08L23/18
CPC分类号： C08L63/08 , C08F8/08 , C08L2666/04 , C08F297/04
摘要： A composition comprising as essential ingredients (A) 80 to 95 wt.% noncrystalline cyclic polyolefin and (B) 20 to 5 wt.% epoxidized diene block copolymere. The composition gives a noncrystalline cyclic polyolefin sheet which has a degree of heat distortion of 5% or lower at a heat fusion temperature of 95 to 160°C. The sheet is excellent in moldability, dimensional stability, and bonding strength in fusion bonding and is excellent also in impact resistance, flexing resistance, and suitability for embossing.

10. 发明公开

EP1176159A1 THERMOSETTING RESIN COMPOSITION AND FLEXIBLE-CIRCUIT OVERCOATING MATERIAL COMPRISING THE SAME 有权
标题翻译：固化树脂组合物及柔性涂层材料，电路，这包括成分
公开(公告)号：EP1176159A1
公开(公告)日：2002-01-30
申请号：EP00919155.2
申请日：2000-04-21
申请人： Ajinomoto Co., Inc.
发明人： ORIKABE, Hiroshi, Aminoscience Lab. , SAKAMOTO, Hiroshi, Aminoscience Lab. , YOKOTA, Tadahiko, Aminoscience Lab.
IPC分类号： C08G59/20 , C08G59/40 , H01L21/60 , H01L23/29 , H01L23/31
CPC分类号： H01L23/49894 , C08G59/40 , C08L19/006 , C08L63/08 , C08L2205/02 , H01L23/293 , H01L2924/0002 , H05K3/285 , C08L2666/08 , H01L2924/00
摘要： Herein is disclosed thermosetting resin composition comprising an epoxy resin (Component (A)) which has a number average molecular weight of 800 to 35,000, an average functional group number of more than 2 per one molecule, and a functional group equivalent of 150 to 2,000 g/mol, and which may have a polybutadiene or hydrogenated polybutadiene skeleton, and a resin (Component (B)) which has a number average molecular weight of 800 to 35,000, an average functional group number of more than 2 per one molecule, and a functional group equivalent of 150 to 2,000 g/mol, which has one or more functional groups selected from amino group, carboxyl group, acid anhydride group, mercapto group, hydroxyl group, isocyanate group and hydrazide group, and no blocked carboxyl group, and which may have a polybutadiene or hydrogenated polybutadiene skeleton, wherein the ratio of the Component (B) to the Component (A) is from 0.5 to 2.0 in terms of the overall equivalent number of the functional group(s) of Component (B) capable of reacting with the epoxy group of the Component (A) to the overall equivalent number of the epoxy group of the Component (A), whose cured products are adjusted in crosslinking density by using an epoxy resin whose molecular weight and functional group number per one molecule are restricted to a certain range, as a component of the above thermosetting resin composition. This composition is useful as an epoxy resin-based overcoating agent for flexible circuit boards or for film carriers for the TAB method, and the like, providing basic properties required of general insulation protective films, since the cured coated films are excellent in adhesiveness, electric insulation property, chemical resistance, thermal resistance, and the like, reduced in warp caused by cure shrinkage, and excellent in flexibility.
摘要翻译：在被盘游离缺失热固性树脂组合物，含有环氧树脂（成分（A）），其具有800至35,000的数均分子量，在超过2平均官能团数每分子，和官能团当量为150〜2000的克/摩尔，并且其可对超过2平均官能团数每分子聚丁二烯或氢化聚丁二烯骨架，和树脂（成分（B）），其具有800至35,000的数均分子量，和的官能团当量为150至2,000克/摩尔，具有一个或从氨基，羧基，酸酐基，巯基，羟基，异氰酸酯基和酰肼基团选择的多个官能团，并没有阻塞的羧基，和可以具有聚丁二烯或氢化聚丁二烯骨架，在官能团的总当量数的worin组分（B）的比例与组分（A）为0.5至2.0（S）组分（B）能够与环氧基的组分（A）与环氧基的组分（A）的整体当量数的反应的，谁的固化产物通过使用环氧树脂，其分子量的交联密度进行调节的和每一个分子官能团数被限制在一定的范围，作为上述热固性树脂组合物的组分。这种组合物是有用的，如基于环氧树脂的保护涂层试剂为柔性电路板或用于膜载体的TAB方法等，从而提供一般绝缘保护膜的要求的基本性质，由于固化的涂膜具有优异的密合性，电绝缘性，耐化学性，耐热性等，降低经纱由固化收缩引起的，并且具有优异的柔韧性。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式