专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP3386934A1 KUPFER-KERAMIK-SUBSTRAT, KUPFERHALBZEUG ZUR HERSTELLUNG EINES KUPFER-KERAMIK-SUBSTRATS UND VERFAHREN ZUR HERSTELLUNG EINES KUPFER-KERAMIK-SUBSTRATS 有权
公开(公告)号：EP3386934A1
公开(公告)日：2018-10-17
申请号：EP16816594.2
申请日：2016-12-06
申请人： Aurubis Stolberg GmbH & Co. KG
发明人： ZEIGER, Karl , CAPPI,Benjamin , LEHMANN, Helge , KOCH, Robert
IPC分类号： C04B37/02 , B32B7/02 , B32B9/00 , B32B9/04 , B32B15/01
CPC分类号： C04B37/021 , B32B7/02 , B32B9/005 , B32B9/041 , B32B15/01 , C04B2237/32 , C04B2237/407 , C04B2237/54 , C04B2237/55 , C04B2237/588 , C04B2237/706 , C04B2237/86
摘要： The present invention relates to a copper-ceramic substrate (1) comprising - a ceramic support (2) and - a copper layer (3, 4) joined to a surface of the ceramic support (2), where - the copper layer (3, 4) has at least one first layer (5, 6) which faces the ceramic support and has an averaged first particle size, and a second layer (7, 8) disposed on the side of the copper layer (3, 4) that faces away from the ceramic support (2), and having an averaged second particle size, where - the second particle size is smaller than the first particle size. The first layer (5, 6) has on average a particle size of greater than 100 μm, preferably about 250 to 1000 μm, and - the second layer (7, 8) has on average a particle size of less than 100 μm, preferably about 50 μm, or - the first layer (5, 6) has on average a particle size of greater than 150 pm, preferably about 250 to 2000 μm, and the - second layer (7, 8) has on average a particle size of less than 150 pm, preferably about 50 pm. Preference is given to using Cu-ETP and Cu-OF or Cu-OFE.

2. 发明公开

EP3053899A4 CU/CERAMIC MATERIAL JOINT, METHOD FOR MANUFACTURING CU/CERAMIC MATERIAL JOINT, AND SUBSTRATE FOR POWER MODULE 审中-公开
标题翻译： CU / KERAMIKMATERIALVERBINDUNG，VERFAHREN ZUR HERSTELLUNG EINER CU / KERAMIKMATERIALVERBINDUNG UND SUBSTRATFÜRLEISTUNGSMODUL
公开(公告)号：EP3053899A4
公开(公告)日：2017-07-19
申请号：EP14849002
申请日：2014-09-25
申请人： MITSUBISHI MATERIALS CORP
发明人： TERASAKI NOBUYUKI , NAGATOMO YOSHIYUKI
IPC分类号： C04B37/02 , B32B9/00 , B32B9/04 , B32B15/04 , B32B15/20 , B32B18/00 , H01L23/12 , H01L23/13 , H01L23/36 , H01L23/373 , H01L23/40 , H01L23/473 , H01L25/07 , H01L25/18
CPC分类号： B32B9/005 , B32B7/12 , B32B9/041 , B32B15/20 , B32B2264/105 , B32B2457/14 , B32B2457/18 , B32B2605/00 , C04B37/026 , C04B2235/6567 , C04B2237/125 , C04B2237/127 , C04B2237/343 , C04B2237/345 , C04B2237/36 , C04B2237/366 , C04B2237/407 , C04B2237/55 , C04B2237/60 , C04B2237/704 , C04B2237/706 , C04B2237/708 , C04B2237/72 , H01L23/3735 , H01L23/3736 , H01L23/4006 , H01L23/473 , H01L25/07 , H01L25/18 , H01L2023/4062 , H01L2224/32225 , H01L2924/0002 , H01L2924/00
摘要： A Cu/ceramic bonded body according to the present invention is formed by bonding a copper member made of copper or a copper alloy and a ceramic member made of AlN or Al 2 O 3 using a bonding material containing Ag and Ti, in which a Ti compound layer made of a Ti nitride or a Ti oxide is formed at a bonding interface between the copper member and the ceramic member, and Ag particles are dispersed in the Ti compound layer.
摘要翻译：根据本发明的Cu /陶瓷粘合体通过使用包含Ag和Ti的粘合材料粘合由铜或铜合金制成的铜构件和由AlN或Al 2 O 3制成的陶瓷构件而形成，其中Ti 在铜构件和陶瓷构件之间的接合界面处形成由Ti氮化物或Ti氧化物构成的化合物层，并且Ag颗粒分散在Ti化合物层中。

4. 发明公开

EP2872280A1 VERFAHREN ZUM FÜGEN VON KERAMIKKÖRPERN MITTELS EINES AKTIVHARTLOTS, BAUGRUPPE MIT MINDESTENS ZWEI MITEINANDER GEFÜGTEN KERAMIKKÖRPERN, INSBESONDERE DRUCKMESSZELLE 有权转让
标题翻译：至少有两个连在一起的陶瓷体，包括压力测量电池组件; 用于制备这种ASSEMBLY
公开(公告)号：EP2872280A1
公开(公告)日：2015-05-20
申请号：EP13729930.1
申请日：2013-06-07
申请人： Endress+Hauser GmbH+Co. KG
发明人： PONATH, Nils , ROßBERG, Andreas , SCHMIDT, Elke
IPC分类号： B23K1/00 , B23K1/19 , C04B37/00 , G01L9/00
CPC分类号： G01L9/0075 , B23K1/0008 , B23K1/19 , C04B37/003 , C04B37/006 , C04B2237/122 , C04B2237/126 , C04B2237/343 , C04B2237/55 , C04B2237/597 , C04B2237/708 , C04B2237/72 , Y10T403/479
摘要： The invention relates to an assembly comprising two ceramic bodies (1, 2) connected by means of a joint (3-5) that has an active hard solder (5), said active hard solder (5) having a cohesive core volume that is at a distance of at least 1 μm, in particular at least 2 μm from the respective ceramic bodies (1, 2), the joint (3-5) having boundary layers (3, 4) that border the ceramic bodies (1, 2). The core volume, which comprises at least 50% of the volume of the joint (3-5), is devoid of crystalline phases with a size of greater than 6 μm, in particular greater than 4 μm and preferably greater than 2 μm.

5. 发明公开

EP2866534A1 CIRCUIT BOARD AND ELECTRONIC APPARATUS PROVIDED WITH SAME 有权
标题翻译：电路板和电子设备提供相同
公开(公告)号：EP2866534A1
公开(公告)日：2015-04-29
申请号：EP13807421.6
申请日：2013-06-21
申请人： Kyocera Corporation
发明人： OHASHI,Yoshio , SHIKATA,Kunihide
IPC分类号： H05K3/38 , H05K1/09 , H05K3/12
CPC分类号： H05K1/181 , C04B37/025 , C04B2237/10 , C04B2237/343 , C04B2237/407 , C04B2237/55 , C04B2237/59 , C04B2237/86 , H01L2224/48091 , H01L2224/73265 , H05K1/0306 , H05K1/092 , H05K1/111 , H05K3/388 , H05K2201/10462 , H05K2201/2063 , Y02P70/611 , H01L2924/00014
摘要： [Object] To provide a highly reliable circuit board which can be used for a long period of time and an electronic apparatus including this circuit board and an electronic component mounted thereon.
[Solution] The circuit board includes a ceramic sintered body (11) and a metal wiring layer (13) provided on at least one primary surface (11a) thereof with a glass layer (12) interposed therebetween, and when the cross section of the circuit board perpendicular to the primary surface (11a) of the ceramic sintered body (11) is viewed, the ratio of the length of an interface (15) between the glass layer (12) and the metal wiring layer (13) to a length (12a) of the glass layer (12) in a direction along the primary surface (11a) is 1.25 to 1.80. As a result, good heat dissipation characteristics can be obtained, and the metal wiring layer (13) is not likely to be peeled away from the ceramic sintered body (11) due to operation of an electronic component (21) and/or cooling/heating cycles performed by repeated on-off operations thereof, so that a highly reliable circuit board which can be used for a long period of time can be provided.
摘要翻译：本发明的目的在于提供一种能够长期使用的高可靠性的电路基板以及搭载该电路基板和电子部件的电子设备。该电路板包括陶瓷烧结体（11）和设置在其至少一个主表面（11a）上的金属布线层（13），其间插入玻璃层（12），并且当观察垂直于陶瓷烧结体（11）的主表面（11a）的电路板，玻璃层（12）和金属布线层（13）之间的界面（15）的长度与长度所述玻璃层（12）的沿着所述主面（11a）的方向的宽度（12a）为1.25〜1.80。结果，可以获得良好的散热特性，并且由于电子部件（21）的操作和/或冷却/冷却，金属布线层（13）不容易从陶瓷烧结体（11）通过反复开关操作进行加热循环，从而可以提供可长期使用的高度可靠的电路板。

6. 发明公开

EP2496201A2 HAFTVERMITTLER ZWISCHEN OXIDKERAMIK UND EINEM VERBLENDWERKSTOFF, INSBESONDERE FÜR DENTALE ZWECKE, VERFAHREN ZU SEINER ANWENDUNG SOWIE KIT ZU SEINER HERSTELLUNG UND APPLIKATION 审中-公开
标题翻译： BONDING BETWEEN氧化物陶瓷和饰面特定FOR DENTAL目的，及其应用的制造方法的使用及KIT AND
公开(公告)号：EP2496201A2
公开(公告)日：2012-09-12
申请号：EP10795608.8
申请日：2010-11-01
申请人： Glückauf Technologies KG
发明人： GÖBEL, Roland , GLÜCK, Olaf
IPC分类号： A61K6/00
CPC分类号： A61K6/0023 , A61K6/0205 , C03C8/02 , C04B37/005 , C04B41/4535 , C04B41/50 , C04B41/502 , C04B41/5024 , C04B41/5035 , C04B2235/3418 , C04B2235/3472 , C04B2235/3481 , C04B2235/96 , C04B2237/062 , C04B2237/341 , C04B2237/343 , C04B2237/348 , C04B2237/55
摘要： The aim of the invention is to improve the bond between the oxide ceramic and the veneer material and to increase the durability of said bond. According to the invention, an adhesion promoter (mixture of silicate ceramic and quartz) is applied as a sol to a main body that is to be veneered and that has not yet been densely sintered, the main body being made of oxide ceramic or starting materials thereof. The main body is then sintered to a final state together with the worked-in adhesion promoter, and afterwards the veneer material is applied. The invention is used, for example, to produce dental crowns and bridges having a high load-bearing capacity.

7. 发明授权

EP1786586B1 PROCEDE DE BRASAGE DE PIECES EN MATERIAU COMPOSITE 有权转让
标题翻译：方法用于焊接复合材料部件
公开(公告)号：EP1786586B1
公开(公告)日：2009-03-11
申请号：EP05778794.7
申请日：2005-06-22
申请人： Snecma Propulsion Solide
发明人： BOUILLON, Eric , JIMENEZ, Sébastien , THEBAULT, Jacques
IPC分类号： B23K1/20 , B23K1/08
CPC分类号： B23K1/20 , B23K1/08 , B23K2203/16 , C04B37/005 , C04B2235/428 , C04B2235/616 , C04B2237/08 , C04B2237/083 , C04B2237/16 , C04B2237/365 , C04B2237/38 , C04B2237/385 , C04B2237/52 , C04B2237/55 , C04B2237/592 , C04B2237/72 , Y10T156/10 , Y10T156/1062
摘要： The invention relates to a method for assembling two parts (10, 20) by soldering consisting in inserting a reinforcement (30) formed by a refractory fibrous texture between two surfaces (S10, S20) of jointable parts, wherein said reinforcement is brought at least partially into contact with a soldering composition (40), in subsequently carrying out a heat treatment for liquefying said soldering composition (40) in such a way that the molten soldering composition is capillary distributed along the totality of a soldering surface between two parts (10, 20) covered by the reinforcement.

8. 发明公开

EP1253123A1 Method of manufacturing a diamond-silicon carbide-silicon composite and a composite produced by this method 失效
标题翻译：钻石-Siliziumkarbid-Silizium-Komposit
公开(公告)号：EP1253123A1
公开(公告)日：2002-10-30
申请号：EP02012420.2
申请日：1998-07-16
申请人： Frenton Limited
发明人： Gordeev, Sergey Konstantinovitch , Zhukov, Sergey Germanovitch , Danchukova, Lija Vladimirovna , Elkström, Thommy
IPC分类号： C04B35/573 , B23B27/14 , C04B37/00 , C04B41/87
CPC分类号： C04B35/532 , C04B35/52 , C04B35/573 , C04B35/62839 , C04B35/6316 , C04B35/65 , C04B35/653 , C04B37/005 , C04B37/026 , C04B41/009 , C04B41/5096 , C04B41/85 , C04B2235/3826 , C04B2235/40 , C04B2235/402 , C04B2235/404 , C04B2235/405 , C04B2235/407 , C04B2235/408 , C04B2235/421 , C04B2235/425 , C04B2235/427 , C04B2235/428 , C04B2235/483 , C04B2235/5436 , C04B2235/5472 , C04B2235/614 , C04B2235/77 , C04B2235/783 , C04B2235/786 , C04B2235/80 , C04B2235/96 , C04B2237/086 , C04B2237/124 , C04B2237/16 , C04B2237/36 , C04B2237/363 , C04B2237/365 , C04B2237/401 , C04B2237/406 , C04B2237/55 , C04B2237/60 , C04B2237/61 , C04B2237/704 , C04B2237/708 , C04B2237/72 , C04B2237/76 , C22C26/00 , F16C33/043 , C04B41/4515 , C04B41/4523 , C04B41/4556 , C04B41/5059
摘要： The present invention relates to a method for manufacturing a diamond-silicon carbide-silicon composite from diamond particles, comprising the steps of forming a work piece,
heating the work piece and controlling the heating temperature and heating time so that a certain desired amount of graphite is created by graphitization of diamond particles, thereby creating an intermediate body, and
infiltrating silicon into the intermediate body.
The invention also relates to a diamond-silicon carbide-silicon composite produced by this method.
摘要翻译：本发明涉及从金刚石颗粒制造金刚石 - 碳化硅 - 硅复合材料的方法，包括以下步骤：形成工件，加热工件并控制加热温度和加热时间，以便确定所需量的石墨由金刚石颗粒的石墨化形成，从而产生中间体，并将硅渗入中间体。本发明还涉及通过该方法制备的金刚石 - 碳化硅 - 硅复合材料。

9. 发明公开

EP1047524A1 PASTE ZUM VERSCHWEISSEN VON KERAMIKEN MIT METALLEN UND VERFAHREN ZUR HERSTELLUNG EINER SCHWEISSVERBINDUNG 有权
标题翻译：粘贴焊接金属和陶瓷用于生产焊接
公开(公告)号：EP1047524A1
公开(公告)日：2000-11-02
申请号：EP99952279.0
申请日：1999-08-04
申请人： ROBERT BOSCH GMBH
发明人： DE LA PRIETA, Claudio , GLANZ, Uwe , SCHMIEDEL, Carmen , KITIRATSCHKY, Petra , ZAPPEL, Bernhard
IPC分类号： B23K35/32 , C04B37/02 , B23K35/02
CPC分类号： C04B37/026 , C04B35/632 , C04B37/025 , C04B2235/5436 , C04B2235/5445 , C04B2237/064 , C04B2237/09 , C04B2237/125 , C04B2237/126 , C04B2237/343 , C04B2237/348 , C04B2237/40 , C04B2237/55 , C04B2237/592 , C04B2237/72
摘要： The invention relates to a paste for welding ceramic materials to metal contact surfaces or metals, containing a precious metal, an aluminium compound, a silicon compound and a compound selected from the following group: barium compounds, calcium compounds and magnesium compounds. A binder, solvent, plasticizer, thixotropic agent and a dispersing agent can also be added to the paste. Said paste is used to produce a welded joint between ceramic materials and a metal contact surface. Preferably, the inventive paste is pressed onto the ceramic material. The ceramic material is subsequently sintered with said paste and the metal contact surface or metal is welded thereto.

10. 发明公开

EP0982278A1 Joined bodies, high-pressure discharge lamps and a method for manufacturing the same 有权
标题翻译： VerbundenerKörper，Hochdruckentladungslampen und ein Verfahren zu deren Herstellung
公开(公告)号：EP0982278A1
公开(公告)日：2000-03-01
申请号：EP99306801.4
申请日：1999-08-26
申请人： NGK INSULATORS, LTD.
发明人： Niimi, Norikazu
IPC分类号： C04B37/02 , H01J61/36 , H01J5/36
CPC分类号： H01J5/36 , C04B37/025 , C04B37/026 , C04B2235/6567 , C04B2235/6581 , C04B2235/6582 , C04B2235/6588 , C04B2237/062 , C04B2237/064 , C04B2237/066 , C04B2237/068 , C04B2237/12 , C04B2237/122 , C04B2237/34 , C04B2237/343 , C04B2237/345 , C04B2237/40 , C04B2237/403 , C04B2237/55 , C04B2237/597 , C04B2237/61 , C04B2237/62 , C04B2237/72 , C04B2237/76 , C04B2237/765 , C04B2237/84 , C04B2237/88 , H01J61/361
摘要： A joined structure and joining method of a member of a ceramics or a cermet and a member of a metal such as molybdenum, in which the members may be joined with a high strength, the joined structure has improved air-tightness and resistance to corrosion and repeated thermal cycles does not result in the fracture of the joined structure.
A joined body comprises a joining portion 6 interposed between a first member, made of a metal, and a second member 4, made of a ceramics or a cermet, for joining the first and second members.
The joining portion 6 comprises main phase 14 contacting the first member and an intermediate glass layer 13 existing between the second member 4 and the main phase 14. The main phase 14 is composed of a porous bone structure 15, with open pores and made of a sintered product of metal powder, and glass phase 10 impregnated into the open pores in the porous bone structure. Preferably, the intermediate glass layer 13 and impregnated glass phase 10 is composed of glasses of the substantially same composition.
摘要翻译：陶瓷或金属陶瓷的构件和诸如钼的金属构件的接合结构和接合方法，其中构件可以以高强度接合，接合结构具有改善的气密性和耐腐蚀性，重复的热循环不会导致接合结构的断裂。接合体包括插入在由金属制成的第一构件和由陶瓷或金属陶瓷制成的第二构件4之间的用于接合第一构件和第二构件的接合部分6。接合部分6包括与第一部件接触的主相14和存在于第二部件4和主相14之间的中间玻璃层13.主相14由多孔骨结构15组成，具有开孔，由金属粉末的烧结产品和浸渍在多孔骨结构中的开孔中的玻璃相10。优选地，中间玻璃层13和浸渍的玻璃相10由具有相同组成的玻璃组成。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式