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1. 发明公开

EP3164776A1 SYSTEMS AND METHODS FOR THERMALLY REGULATING SENSOR OPERATION 有权转让
标题翻译：用于热调节传感器操作的系统和方法
公开(公告)号：EP3164776A1
公开(公告)日：2017-05-10
申请号：EP15871312.3
申请日：2015-04-20
申请人： SZ DJI Technology Co., Ltd.
发明人： PAN, Guoxiu , SHI, Renli
IPC分类号： G05D23/30 , G01C25/00 , B64C39/00
CPC分类号： G01P21/00 , B64C39/024 , B64C2201/027 , B64C2201/108 , B64C2201/128 , B64C2201/146 , B64D43/00 , B81B7/0087 , B81B2201/0242 , B81C99/003 , G01C25/005 , G01D3/036 , G01D18/008 , G01K13/00 , G05D1/0011 , G05D23/19
摘要： Systems and methods are provided for calibrating and regulating the temperature of a sensor. One or more temperature adjusting devices can be provided to regulate the temperature of the sensor. One or more of the temperature adjusting devices can be provided to perform a calibration to determine a relationship between sensor bias and sensor temperature. The one or more temperature adjusting devices can be built into the sensor.
摘要翻译：提供了用于校准和调节传感器（101）的温度的系统和方法。可以提供一个或多个温度调节装置（102）来调节传感器（101）的温度。可以提供一个或多个温度调节装置（102）以执行校准以确定传感器偏压和传感器温度之间的关系。一个或多个温度调节装置（102）可以内置在传感器（101）中。

2. 发明公开

EP2093184A2 MEMS device with temperature compensation 审中-公开
标题翻译： MEMS-Vorrichtung mit Temperaturausgleich
公开(公告)号：EP2093184A2
公开(公告)日：2009-08-26
申请号：EP09152338.1
申请日：2009-02-07
申请人： Honeywell International Inc.
发明人： Ridley, Jeff A. , Higashi, Robert , Detry, James F.
IPC分类号： B81B7/00
CPC分类号： B81B7/0087 , B81B2201/0242 , B81B2201/0278
摘要： A MEMS device includes a P-N device formed on a silicon pin, which is connected to a silicon sub-assembly, and where the P-N device is formed on a silicon substrate that is used to make the silicon pin before it is embedded into a first glass wafer. In one embodiment, forming the P-N device includes selectively diffusing an impurity into the silicon pin and configuring the P-N device to operate as a temperature sensor.
摘要翻译： MEMS器件包括形成在硅引脚上的PN器件，其连接到硅子组件，并且其中PN器件形成在硅衬底上，所述硅衬底在其被嵌入第一玻璃中之前用于制造硅销晶圆。在一个实施例中，形成P-N器件包括选择性地将杂质扩散到硅引脚中并将P-N器件配置为用作温度传感器。

3. 发明公开

EP1829819A3 Passive thermal isolation structure 审中-公开
标题翻译：被动式隔热结构
公开(公告)号：EP1829819A3
公开(公告)日：2009-06-24
申请号：EP06125198.9
申请日：2006-12-01
申请人： Honeywell International Inc.
发明人： Younger, Dan W. , Lust, Lisa M
IPC分类号： B81B7/00
CPC分类号： B81B7/0087 , B81B2201/032 , F28F13/00 , F28F2270/00 , G05D23/024
摘要： A thermal isolation structure for use in passively regulating the temperature of a microdevice is disclosed. The thermal isolation structure can include a substrate wafer and a cap wafer defining an interior cavity, and a number of double-ended or single-ended thermal bimorphs coupled to the substrate wafer and thermally actustable between an initial position and a deformed position. The thermal bimorphs can be configured to deform and make contact with the cap wafer at different temperatures, creating various thermal shorts depending on the temperature of the substrate wafer. When attached to a microdevice such as a MEMS device, the thermal isolation structure can be configured to maintain the attached device at a constant temperature or within a particular temperature range.

4. 发明公开

EP1829819A2 Passive thermal isolation structure 审中-公开
标题翻译：被动Wärmeisolationsstruktur
公开(公告)号：EP1829819A2
公开(公告)日：2007-09-05
申请号：EP06125198.9
申请日：2006-12-01
申请人： Honeywell International Inc.
发明人： Younger, Dan W. , Lust, Lisa M
IPC分类号： B81B7/00
CPC分类号： B81B7/0087 , B81B2201/032 , F28F13/00 , F28F2270/00 , G05D23/024
摘要： A thermal isolation structure for use in passively regulating the temperature of a microdevice is disclosed. The thermal isolation structure can include a substrate wafer and a cap wafer defining an interior cavity, and a number of double-ended or single-ended thermal bimorphs coupled to the substrate wafer and thermally actustable between an initial position and a deformed position. The thermal bimorphs can be configured to deform and make contact with the cap wafer at different temperatures, creating various thermal shorts depending on the temperature of the substrate wafer. When attached to a microdevice such as a MEMS device, the thermal isolation structure can be configured to maintain the attached device at a constant temperature or within a particular temperature range.
摘要翻译：公开了一种用于被动调节微型设备的温度的隔热结构。热隔离结构可以包括衬底晶片和限定内腔的帽晶片，以及耦合到衬底晶片并且在初始位置和变形位置之间可发热的多个双端或单端热双压电晶片。热双晶体可以被配置成在不同的温度下变形并与盖晶片接触，根据衬底晶片的温度产生各种热短路。当连接到诸如MEMS器件的微器件时，热隔离结构可以被配置为将连接的器件保持在恒定温度或特定温度范围内。

5. 发明公开

EP3234560A1 MICROFLUIDIC TEMPERATURE CONTROL 有权转让
标题翻译：微流体温度控制
公开(公告)号：EP3234560A1
公开(公告)日：2017-10-25
申请号：EP15880448.4
申请日：2015-01-30
申请人： Hewlett-Packard Development Company, L.P.
发明人： DOMINGUE, Chantelle Elizabeth , GIRI, Manish , BENGALI, Sadiq
IPC分类号： G01N27/06 , G01N27/07 , B81B1/00 , B81B5/00
CPC分类号： B01L3/5027 , B01L3/50273 , B01L7/00 , B01L7/52 , B01L2200/10 , B01L2200/147 , B01L2300/023 , B01L2300/0861 , B01L2300/1827 , B01L2400/0442 , B81B7/0087
摘要： A device includes a microfluidic channel structure on a substrate and a first resistive structure on the substrate to control the temperature of at least the substrate. The first resistive structure is separate from, and independent of the, microfluidic channel structure. In some instances, the device includes a second resistive structure.
摘要翻译：一种装置包括衬底上的微流体通道结构和衬底上的第一电阻结构以控制至少衬底的温度。第一电阻结构与微流体通道结构分开并且独立于微流体通道结构。在一些情况下，该装置包括第二电阻结构。

6. 发明授权

EP3056466B1 SYSTEMS AND METHODS FOR DEVICE TEMPERATURE STABILIZATION 有权
标题翻译：用于装置温度稳定的系统和方法
公开(公告)号：EP3056466B1
公开(公告)日：2017-06-21
申请号：EP16154154.5
申请日：2016-02-03
申请人： Honeywell International Inc.
发明人： HORNING, Robert D. , LODDEN, Grant H.
IPC分类号： B81B7/00 , H01L23/38 , H01L23/34 , H01L35/32 , H01L35/34 , H03K3/011
CPC分类号： H03K3/011 , B81B7/0087 , H01L23/34 , H01L23/38 , H01L35/32 , H01L35/34

7. 发明公开

EP3124963A1 GAS DETECTOR WITH A THERMALLY UNIFORM MEMS DIE 有权
标题翻译： GASDETEKTOR MIT EINER THERMISCH EINHEITLICHEN MEMS-FORM
公开(公告)号：EP3124963A1
公开(公告)日：2017-02-01
申请号：EP16181663.2
申请日：2016-07-28
申请人： Carrier Corporation
发明人： POTASEK, David P. , CHRISTENSON, John Carl , CHILDRESS, Marcus Allen
IPC分类号： G01N27/12
CPC分类号： B81B7/0096 , B81B7/0087 , B81B2201/0214 , G01N27/128
摘要： A microelectromechanical systems die including a thermally conductive substrate 16, at least one insulator film 18 disposed on the thermally conductive substrate 16, a sensor material 14 disposed on the at least one insulator film 18, and a heater 26 circumferentially disposed around the sensor material 14.
摘要翻译：包括导热基板16，设置在导热基板16上的至少一个绝缘膜18，设置在至少一个绝缘膜18上的传感器材料14和围绕传感器材料14周向设置的加热器26的微机电系统管芯。

8. 发明公开

EP3056466A1 SYSTEMS AND METHODS FOR DEVICE TEMPERATURE STABILIZATION 有权
标题翻译：西班牙语VERFAHREN ZUR VORRICHTUNGSTEMPERATURSTABILISIERUNG
公开(公告)号：EP3056466A1
公开(公告)日：2016-08-17
申请号：EP16154154.5
申请日：2016-02-03
申请人： Honeywell International Inc.
发明人： HORNING, Robert D. , LODDEN, Grant H.
IPC分类号： B81B7/00 , H01L23/38
CPC分类号： H03K3/011 , B81B7/0087 , H01L23/34 , H01L23/38 , H01L35/32 , H01L35/34
摘要： A temperature stabilized device and method for temperature stabilization are provided. The temperature stabilized device comprises a substrate having a first surface, at least one component mounted on the first surface of the substrate, and a first conformal layer comprising a thermoelectric material, with the first conformal layerover the at least one component. A first temperature control circuit is electrically coupled to the first conformal layer. The first temperature control circuit is configured to control a current through the first conformal layer. The current through the first conformal layer is controlled to maintain the at least one component at a target operating temperature.
摘要翻译：提供了温度稳定装置和温度稳定化方法。温度稳定装置包括具有第一表面的基底，安装在基底的第一表面上的至少一个部件和包含热电材料的第一共形层，其中第一共形层位于至少一个部件之上。第一温度控制电路电耦合到第一保形层。第一温度控制电路被配置为控制通过第一保形层的电流。控制通过第一保形层的电流以将至少一个组分保持在目标工作温度。

9. 发明授权

EP2902109B1 Method of manufacturing a device for thermal insulation of micro-reactors 有权转让
公开(公告)号：EP2902109B1
公开(公告)日：2018-10-31
申请号：EP15154853.4
申请日：2011-09-23
申请人： IMEC VZW , Katholieke Universiteit Leuven
发明人： Jones, Benjamin , Fiorini, Paolo , Tanaka, Hiroyuki
IPC分类号： B01L7/00 , B01L3/00 , B81C1/00 , B81B3/00 , B81B7/00
CPC分类号： B01L3/502707 , B01L3/502715 , B01L7/52 , B01L2200/147 , B01L2300/0816 , B01L2300/1805 , B01L2300/1883 , B81B3/0081 , B81B7/0087 , B81B2201/051
摘要： The present invention provides a micro-fluidic device (104), comprising: - a semiconductor substrate; - at least one micro-reactor (105) in said semiconductor substrate; - one or more micro-fluidic channels (101) in said semiconductor substrate, connected to said at least one micro-reactor (105); - a cover layer (106) bonded to the semiconductor substrate (900) for sealing the one or more micro-fluidic channels (101); and - at least one through-substrate trench (100) surrounding said at least one micro-reactor (105) and the one or more micro-fluidic channels (101).

10. 发明公开

EP3164776A4 SYSTEMS AND METHODS FOR THERMALLY REGULATING SENSOR OPERATION 有权转让
公开(公告)号：EP3164776A4
公开(公告)日：2017-12-06
申请号：EP15871312
申请日：2015-04-20
申请人： SZ DJI TECHNOLOGY CO LTD
发明人： PAN GUOXIU , SHI RENLI
IPC分类号： G01C25/00 , B81B7/00 , B81C99/00 , G01P21/00 , G05D1/00 , G05D23/19
CPC分类号： G01P21/00 , B64C39/00 , B64C39/024 , B64C2201/027 , B64C2201/108 , B64C2201/146 , B64D43/00 , B81B7/0087 , B81B2201/0242 , B81C99/003 , G01C25/005 , G01D18/00 , G01K13/00 , G05D1/0011 , G05D23/19
摘要： Systems and methods are provided for calibrating and regulating the temperature of a sensor. One or more temperature adjusting devices can be provided to regulate the temperature of the sensor. One or more of the temperature adjusting devices can be provided to perform a calibration to determine a relationship between sensor bias and sensor temperature. The one or more temperature adjusting devices can be built into the sensor.

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