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1. 发明授权

EP2902109B1 Method of manufacturing a device for thermal insulation of micro-reactors 有权转让
公开(公告)号：EP2902109B1
公开(公告)日：2018-10-31
申请号：EP15154853.4
申请日：2011-09-23
申请人： IMEC VZW , Katholieke Universiteit Leuven
发明人： Jones, Benjamin , Fiorini, Paolo , Tanaka, Hiroyuki
IPC分类号： B01L7/00 , B01L3/00 , B81C1/00 , B81B3/00 , B81B7/00
CPC分类号： B01L3/502707 , B01L3/502715 , B01L7/52 , B01L2200/147 , B01L2300/0816 , B01L2300/1805 , B01L2300/1883 , B81B3/0081 , B81B7/0087 , B81B2201/051
摘要： The present invention provides a micro-fluidic device (104), comprising: - a semiconductor substrate; - at least one micro-reactor (105) in said semiconductor substrate; - one or more micro-fluidic channels (101) in said semiconductor substrate, connected to said at least one micro-reactor (105); - a cover layer (106) bonded to the semiconductor substrate (900) for sealing the one or more micro-fluidic channels (101); and - at least one through-substrate trench (100) surrounding said at least one micro-reactor (105) and the one or more micro-fluidic channels (101).

2. 发明公开

EP3164776A4 SYSTEMS AND METHODS FOR THERMALLY REGULATING SENSOR OPERATION 有权转让
公开(公告)号：EP3164776A4
公开(公告)日：2017-12-06
申请号：EP15871312
申请日：2015-04-20
申请人： SZ DJI TECHNOLOGY CO LTD
发明人： PAN GUOXIU , SHI RENLI
IPC分类号： G01C25/00 , B81B7/00 , B81C99/00 , G01P21/00 , G05D1/00 , G05D23/19
CPC分类号： G01P21/00 , B64C39/00 , B64C39/024 , B64C2201/027 , B64C2201/108 , B64C2201/146 , B64D43/00 , B81B7/0087 , B81B2201/0242 , B81C99/003 , G01C25/005 , G01D18/00 , G01K13/00 , G05D1/0011 , G05D23/19
摘要： Systems and methods are provided for calibrating and regulating the temperature of a sensor. One or more temperature adjusting devices can be provided to regulate the temperature of the sensor. One or more of the temperature adjusting devices can be provided to perform a calibration to determine a relationship between sensor bias and sensor temperature. The one or more temperature adjusting devices can be built into the sensor.

3. 发明授权

EP3095755B1 MONOLITHIC FABRICATION OF THERMALLY ISOLATED MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICES 有权
标题翻译：热分离微电子机械系统（MEMS）器件的整体制造
公开(公告)号：EP3095755B1
公开(公告)日：2017-07-26
申请号：EP16168459.2
申请日：2016-05-04
申请人： Honeywell International Inc.
发明人： REINKE, John , LODDEN, Grant
IPC分类号： B81B7/00 , B81C1/00
CPC分类号： B81B7/0019 , B81B3/0081 , B81B7/0087 , B81B2201/0228 , B81B2201/025 , B81C1/0069 , H02N1/00
摘要： A method for fabricating a thermally isolated microelectromechanical system (MEMS) structure is provided. The method includes processing a first wafer of a first material with a glass wafer to form a composite substrate including at least one sacrificial structure of the first material and glass; forming a MEMS device in a second material; forming at least one temperature sensing element on at least one of: the composite substrate; and the MEMS device; and etching away the at least one sacrificial structure of the first material in the composite substrate to form at least one thermally isolating glass flexure. The MEMS device is thermally isolated on a thermal isolation stage by the at least one thermally isolating glass flexure. The at least one temperature sensing element in on a respective at least one of: the thermal isolation stage; and the MEMS device.
摘要翻译：提供了一种用于制造热隔离微机电系统（MEMS）结构的方法。该方法包括用玻璃晶片处理第一材料的第一晶片以形成包括第一材料和玻璃的至少一个牺牲结构的复合衬底; 以第二材料形成MEMS器件; 在至少一个复合衬底上形成至少一个温度传感元件; 和MEMS器件; 以及蚀刻掉复合衬底中的第一材料的至少一个牺牲结构以形成至少一个热隔离玻璃弯曲部。 MEMS器件通过至少一个热绝缘玻璃挠曲件在热绝缘台上热隔离。所述至少一个温度感测元件位于热隔离级中的相应的至少一个上：和MEMS器件。

4. 发明公开

EP3164776A1 SYSTEMS AND METHODS FOR THERMALLY REGULATING SENSOR OPERATION 有权转让
标题翻译：用于热调节传感器操作的系统和方法
公开(公告)号：EP3164776A1
公开(公告)日：2017-05-10
申请号：EP15871312.3
申请日：2015-04-20
申请人： SZ DJI Technology Co., Ltd.
发明人： PAN, Guoxiu , SHI, Renli
IPC分类号： G05D23/30 , G01C25/00 , B64C39/00
CPC分类号： G01P21/00 , B64C39/024 , B64C2201/027 , B64C2201/108 , B64C2201/128 , B64C2201/146 , B64D43/00 , B81B7/0087 , B81B2201/0242 , B81C99/003 , G01C25/005 , G01D3/036 , G01D18/008 , G01K13/00 , G05D1/0011 , G05D23/19
摘要： Systems and methods are provided for calibrating and regulating the temperature of a sensor. One or more temperature adjusting devices can be provided to regulate the temperature of the sensor. One or more of the temperature adjusting devices can be provided to perform a calibration to determine a relationship between sensor bias and sensor temperature. The one or more temperature adjusting devices can be built into the sensor.
摘要翻译：提供了用于校准和调节传感器（101）的温度的系统和方法。可以提供一个或多个温度调节装置（102）来调节传感器（101）的温度。可以提供一个或多个温度调节装置（102）以执行校准以确定传感器偏压和传感器温度之间的关系。一个或多个温度调节装置（102）可以内置在传感器（101）中。

5. 发明公开

EP2093184A2 MEMS device with temperature compensation 审中-公开
标题翻译： MEMS-Vorrichtung mit Temperaturausgleich
公开(公告)号：EP2093184A2
公开(公告)日：2009-08-26
申请号：EP09152338.1
申请日：2009-02-07
申请人： Honeywell International Inc.
发明人： Ridley, Jeff A. , Higashi, Robert , Detry, James F.
IPC分类号： B81B7/00
CPC分类号： B81B7/0087 , B81B2201/0242 , B81B2201/0278
摘要： A MEMS device includes a P-N device formed on a silicon pin, which is connected to a silicon sub-assembly, and where the P-N device is formed on a silicon substrate that is used to make the silicon pin before it is embedded into a first glass wafer. In one embodiment, forming the P-N device includes selectively diffusing an impurity into the silicon pin and configuring the P-N device to operate as a temperature sensor.
摘要翻译： MEMS器件包括形成在硅引脚上的PN器件，其连接到硅子组件，并且其中PN器件形成在硅衬底上，所述硅衬底在其被嵌入第一玻璃中之前用于制造硅销晶圆。在一个实施例中，形成P-N器件包括选择性地将杂质扩散到硅引脚中并将P-N器件配置为用作温度传感器。

6. 发明公开

EP1829819A3 Passive thermal isolation structure 审中-公开
标题翻译：被动式隔热结构
公开(公告)号：EP1829819A3
公开(公告)日：2009-06-24
申请号：EP06125198.9
申请日：2006-12-01
申请人： Honeywell International Inc.
发明人： Younger, Dan W. , Lust, Lisa M
IPC分类号： B81B7/00
CPC分类号： B81B7/0087 , B81B2201/032 , F28F13/00 , F28F2270/00 , G05D23/024
摘要： A thermal isolation structure for use in passively regulating the temperature of a microdevice is disclosed. The thermal isolation structure can include a substrate wafer and a cap wafer defining an interior cavity, and a number of double-ended or single-ended thermal bimorphs coupled to the substrate wafer and thermally actustable between an initial position and a deformed position. The thermal bimorphs can be configured to deform and make contact with the cap wafer at different temperatures, creating various thermal shorts depending on the temperature of the substrate wafer. When attached to a microdevice such as a MEMS device, the thermal isolation structure can be configured to maintain the attached device at a constant temperature or within a particular temperature range.

7. 发明公开

EP1829819A2 Passive thermal isolation structure 审中-公开
标题翻译：被动Wärmeisolationsstruktur
公开(公告)号：EP1829819A2
公开(公告)日：2007-09-05
申请号：EP06125198.9
申请日：2006-12-01
申请人： Honeywell International Inc.
发明人： Younger, Dan W. , Lust, Lisa M
IPC分类号： B81B7/00
CPC分类号： B81B7/0087 , B81B2201/032 , F28F13/00 , F28F2270/00 , G05D23/024
摘要： A thermal isolation structure for use in passively regulating the temperature of a microdevice is disclosed. The thermal isolation structure can include a substrate wafer and a cap wafer defining an interior cavity, and a number of double-ended or single-ended thermal bimorphs coupled to the substrate wafer and thermally actustable between an initial position and a deformed position. The thermal bimorphs can be configured to deform and make contact with the cap wafer at different temperatures, creating various thermal shorts depending on the temperature of the substrate wafer. When attached to a microdevice such as a MEMS device, the thermal isolation structure can be configured to maintain the attached device at a constant temperature or within a particular temperature range.
摘要翻译：公开了一种用于被动调节微型设备的温度的隔热结构。热隔离结构可以包括衬底晶片和限定内腔的帽晶片，以及耦合到衬底晶片并且在初始位置和变形位置之间可发热的多个双端或单端热双压电晶片。热双晶体可以被配置成在不同的温度下变形并与盖晶片接触，根据衬底晶片的温度产生各种热短路。当连接到诸如MEMS器件的微器件时，热隔离结构可以被配置为将连接的器件保持在恒定温度或特定温度范围内。

8. 发明公开

EP3095755A1 MONOLITHIC FABRICATION OF THERMALLY ISOLATED MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICES 有权
标题翻译：单片机HISTELLUNG VON THERMISCH ISOLIERTEN VORRICHTUNGEN MIT MIKROELEKTROMECHANISCHEN SYSTEMEN（MEMS）
公开(公告)号：EP3095755A1
公开(公告)日：2016-11-23
申请号：EP16168459.2
申请日：2016-05-04
申请人： Honeywell International Inc.
发明人： REINKE, John , LODDEN, Grant
IPC分类号： B81B7/00 , B81C1/00
CPC分类号： B81B7/0019 , B81B3/0081 , B81B7/0087 , B81B2201/0228 , B81B2201/025 , B81C1/0069 , H02N1/00
摘要： A method for fabricating a thermally isolated microelectromechanical system (MEMS) structure is provided. The method includes processing a first wafer of a first material with a glass wafer to form a composite substrate including at least one sacrificial structure of the first material and glass; forming a MEMS device in a second material; forming at least one temperature sensing element on at least one of: the composite substrate; and the MEMS device; and etching away the at least one sacrificial structure of the first material in the composite substrate to form at least one thermally isolating glass flexure. The MEMS device is thermally isolated on a thermal isolation stage by the at least one thermally isolating glass flexure. The at least one temperature sensing element in on a respective at least one of: the thermal isolation stage; and the MEMS device.
摘要翻译：提供了一种用于制造热隔离微机电系统（MEMS）结构的方法。该方法包括用玻璃晶片处理第一材料的第一晶片以形成包括第一材料和玻璃的至少一个牺牲结构的复合衬底; 在第二材料中形成MEMS器件; 在所述复合衬底中的至少一个上形成至少一个温度感测元件; 和MEMS器件; 并且蚀刻所述复合衬底中的所述第一材料的所述至少一个牺牲结构以形成至少一个热隔离玻璃弯曲部。 MEMS器件通过至少一个隔热玻璃弯曲件在热隔离台上热隔离。所述至少一个温度感测元件位于以下各自中的至少一个中：热隔离级; 和MEMS器件。

9. 发明公开

EP2943434A2 SENSOR WITH AN EMBEDDED THERMISTOR FOR PRECISE LOCAL TEMPERATURE MEASUREMENT 有权
标题翻译：传感器MIT EINEM EINGEBETTETEN THERMISTORFÜRPRÄZISELOKALE TEMPERATURMESSUNG
公开(公告)号：EP2943434A2
公开(公告)日：2015-11-18
申请号：EP13815302.8
申请日：2013-12-10
申请人： Robert Bosch GmbH
发明人： GRAHAM, Andrew , FEYH, Ando , O'BRIEN, Gary
IPC分类号： B81B7/00 , G01K7/22
CPC分类号： G01K7/226 , B81B7/008 , B81B7/0087 , B81B2201/0264 , B81B2207/03 , Y10T29/49085
摘要： A resistive temperature sensor (thermistor) for a microelectromechanical system (MEMS) device provides local temperatures of MEMS sensors and other MEMS devices for temperature compensation. Local accurate temperatures of the sensors and other devices provide for temperature compensation of such sensors or devices. By incorporating the thermistor structure into a MEMS device, an accurate temperature is sensed and measured adjacent to or within the structural layers of the device. In one embodiment, the thermistor is located within a few micrometers of the primary device.
摘要翻译：用于微机电系统（MEMS）器件的电阻式温度传感器（热敏电阻）提供MEMS传感器和其他MEMS器件的温度补偿的局部温度。传感器和其他设备的本地准确温度可提供这种传感器或设备的温度补偿。通过将热敏电阻结构结合到MEMS器件中，在器件的结构层附近或内部感测和测量精确的温度。在一个实施例中，热敏电阻位于主要装置的几微米内。

10. 发明公开

EP2916154A1 Projector 审中-公开
标题翻译：放映机
公开(公告)号：EP2916154A1
公开(公告)日：2015-09-09
申请号：EP15157490.2
申请日：2015-03-04
申请人： Funai Electric Co., Ltd.
发明人： Kobyashi, Tomohiro
IPC分类号： G02B7/18 , G02B26/08
CPC分类号： G02B26/0841 , B81B7/0083 , B81B7/0087 , B81B2201/042 , G02B7/181 , G02B26/105 , G02B27/0149 , G02B2027/0154 , H04N9/3135
摘要： This projector (100) includes a light source portion (71a, 71b, 71c) applying a laser beam, an oscillating mirror element (1, 2) scanning light and a conductive member (5, 6) supporting the oscillating mirror element, and makes the conductive member generate heat by applying power to the conductive member.
摘要翻译：该投影仪（100）具备：照射激光的光源部（71a，71b，71c），扫描光的振动反射镜元件（1,2），支撑该振动反射镜元件的导电部件（5,6）导电构件通过向导电构件施加电力而产生热量。

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