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1. 发明公开

EP1829819A3 Passive thermal isolation structure 审中-公开
标题翻译：被动式隔热结构
公开(公告)号：EP1829819A3
公开(公告)日：2009-06-24
申请号：EP06125198.9
申请日：2006-12-01
申请人： Honeywell International Inc.
发明人： Younger, Dan W. , Lust, Lisa M
IPC分类号： B81B7/00
CPC分类号： B81B7/0087 , B81B2201/032 , F28F13/00 , F28F2270/00 , G05D23/024
摘要： A thermal isolation structure for use in passively regulating the temperature of a microdevice is disclosed. The thermal isolation structure can include a substrate wafer and a cap wafer defining an interior cavity, and a number of double-ended or single-ended thermal bimorphs coupled to the substrate wafer and thermally actustable between an initial position and a deformed position. The thermal bimorphs can be configured to deform and make contact with the cap wafer at different temperatures, creating various thermal shorts depending on the temperature of the substrate wafer. When attached to a microdevice such as a MEMS device, the thermal isolation structure can be configured to maintain the attached device at a constant temperature or within a particular temperature range.

2. 发明公开

EP1829819A2 Passive thermal isolation structure 审中-公开
标题翻译：被动Wärmeisolationsstruktur
公开(公告)号：EP1829819A2
公开(公告)日：2007-09-05
申请号：EP06125198.9
申请日：2006-12-01
申请人： Honeywell International Inc.
发明人： Younger, Dan W. , Lust, Lisa M
IPC分类号： B81B7/00
CPC分类号： B81B7/0087 , B81B2201/032 , F28F13/00 , F28F2270/00 , G05D23/024
摘要： A thermal isolation structure for use in passively regulating the temperature of a microdevice is disclosed. The thermal isolation structure can include a substrate wafer and a cap wafer defining an interior cavity, and a number of double-ended or single-ended thermal bimorphs coupled to the substrate wafer and thermally actustable between an initial position and a deformed position. The thermal bimorphs can be configured to deform and make contact with the cap wafer at different temperatures, creating various thermal shorts depending on the temperature of the substrate wafer. When attached to a microdevice such as a MEMS device, the thermal isolation structure can be configured to maintain the attached device at a constant temperature or within a particular temperature range.
摘要翻译：公开了一种用于被动调节微型设备的温度的隔热结构。热隔离结构可以包括衬底晶片和限定内腔的帽晶片，以及耦合到衬底晶片并且在初始位置和变形位置之间可发热的多个双端或单端热双压电晶片。热双晶体可以被配置成在不同的温度下变形并与盖晶片接触，根据衬底晶片的温度产生各种热短路。当连接到诸如MEMS器件的微器件时，热隔离结构可以被配置为将连接的器件保持在恒定温度或特定温度范围内。

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