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    • 1. 发明公开
    • Method for producing a wafer lens
    • Verfahren zur Herstellung eine Wafer-Linse
    • EP2759395A1
    • 2014-07-30
    • EP14165519.1
    • 2009-03-12
    • Konica Minolta Opto, Inc.
    • Okazaki, NaokoHosoe, ShigeruSaito, Masashi
    • B29D11/00G02B1/04G02B3/00B29C35/02B29C35/08
    • B29D11/00365B29C35/02B29C35/0805B29C2035/0827B29C2035/0833B29D11/00307B29D11/00442G02B3/0031
    • The present invention aims to improve shape precision of a molded body when a plurality of molded bodies, which are projections or recesses made of a curable resin, are formed on both sides of a glass substrate. Disclosed is a method for producing a molded body, which comprises a step of preparing a first mold having a plurality of negative molding surfaces having shapes corresponding to a plurality of moldilig parts; a step of applying a curable resin onto a surface of the first mold on which the molding surfaces are formed; and a step of curing the applied curable resin. The curing step includes a photocuring step wherein curing of the curable resin is carried out by irradiating the resin with light, and a heat curing step wherein the curable resin partly cured by the photocuring step is further cured by being subjected to a heat treatment.
    • 本发明旨在提高在玻璃基板的两面形成作为由固化性树脂构成的突起或凹部的多个成型体的成型体的形状精度。 本发明公开了一种成形体的制造方法,其特征在于,包括具有多个成型面的第一模具的制造方法,所述第一模具具有与多个模具部分对应的形状的多个负模制面; 将可固化树脂施加到其上形成有模制表面的第一模具的表面上的步骤; 以及固化所施加的可固化树脂的步骤。 固化步骤包括光固化步骤,其中通过用光照射树脂来进行固化树脂的固化,以及热固化步骤,其中通过光固化步骤部分固化的可固化树脂通过进行热处理进一步固化。
    • 4. 发明公开
    • METHOD FOR MANUFACTURING LENS MODULE, AND LENS MODULE
    • 琳琅满目的柠檬
    • EP2682797A1
    • 2014-01-08
    • EP12752308.2
    • 2012-02-27
    • FUJIFILM Corporation
    • MATSUNO RyoYONEYAMA SatoshiKOIKE TakashiHASEGAWA Kazuhide
    • G02B7/02
    • G02B7/021B29D11/00307G02B3/0062G02B3/0075G02B13/0085
    • A lens module capable of preventing a deterioration of optical properties and a method for manufacturing thereof are provided. Optical axes of lens portions of superimposed lens arrays are aligned. Substrate portions of the other lens arrays of the superimposed lens arrays except the lowermost lens array are cut by a first cutting portion. Subsequently, thermosetting resins are supplied from a gap between cut surfaces of the cut substrate portion so as to fill a gap between the substrate portions of the superimposed lens arrays with the thermosetting resins and to cause the thermosetting resins to integrally cover the cut surfaces of the substrate portion and a surface of the substrate portion of the uppermost lens array. Thereafter, the thermosetting resins are cured, and an individual lens module is separated by cutting the substrate portion of the lowermost lens array using a second cutting portion.
    • 提供了能够防止光学特性劣化的透镜模块及其制造方法。 重叠透镜阵列的透镜部分的光轴对齐。 除最低透镜阵列之外的重叠透镜阵列的其他透镜阵列的基板部分被第一切割部分切割。 随后,从切割的基板部分的切割表面之间的间隙提供热固性树脂,以便填充叠加的透镜阵列的基板部分与热固性树脂之间的间隙,并使热固性树脂一体地覆盖 衬底部分和最上面的透镜阵列的衬底部分的表面。 此后,固化热固性树脂,并且通过使用第二切割部分切割最下面的透镜阵列的基板部分来分离单独的透镜模块。
    • 5. 发明公开
    • WAFER LENS PRODUCTION METHOD
    • HERSTELLUNGSVERFAHRENFÜRWAFER-LINSEN
    • EP2639033A1
    • 2013-09-18
    • EP11840602.4
    • 2011-11-09
    • Konica Minolta, Inc.
    • EGURO, KouichiSARUYA, Nobuhiro
    • B29C39/24G02B3/00B29L11/00
    • B29D11/0073B29C35/0888B29C39/10B29C2035/0827B29D11/00192B29D11/00307B29L2011/00G02B3/0031G02B3/0056
    • The purpose of the present invention is to provide a wafer lens production method capable of simply and precisely molding an optical surface while preventing damage to a substrate caused by mold release, when molding a lens surface or other optical surface on both surfaces of the substrate. A second molding surface (103a) is released from a second metal mold (42) be-fore a first molding surface (102a) is completely released from a first metal mold (41) and, as a result, a releasing force is applied at the same time to both the first and second molding surfaces (102a, 103a) of the substrate (101) in a state such that an uneven force could not be readily applied, enabling the prevention of damage to the substrate (101) at mold release even for comparative-ly thin substrates (101). In addition, the mold release occurs with the sections of the first and second molding surfaces (102a, 103a) that have not been released remaining in each, thereby enabling the simple and efficient production of a precise wafer lens (100) without requiring the provision of a separate step for protecting first and second optical surfaces (11d, 12d) on the opposite side at mold release.
    • 本发明的目的是提供一种晶片透镜制造方法,其能够简单且精确地模制光学表面,同时当在基板的两个表面上模制透镜表面或其他光学表面时,防止由脱模引起的基板损坏。 在第一模制表面(102a)从第一金属模(41)完全释放之前,第二模制表面(103a)从第二金属模(42)释放,结果释放力 同时在基板(101)的第一和第二模制表面(102a,103a)处于不能容易地施加不均匀力的状态下,能够防止在脱模时损坏基板(101) 即使是比较薄的基板(101)。 此外,由于第一和第二成型面(102a,103a)的未被释放的部分残留在其中,因此能够简单而有效地生产精确的晶片透镜(100),而不需要提供 用于在脱模时在相对侧上保护第一和第二光学表面(11d,12d)的单独步骤。