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1. 发明授权

EP2865507B1 INJECTION MOULDING DEVICE AND METHOD 有权
标题翻译：注射成型装置和方法
公开(公告)号：EP2865507B1
公开(公告)日：2016-05-25
申请号：EP13807730.0
申请日：2013-06-06
申请人： Calsonic Kansei Corporation
发明人： KOBUNE, Yoshihito , KANEMASA, Akihito , SUGIMOTO, Kenjiro , SHIMADA, Kunio
IPC分类号： B29C45/43 , B29C45/76 , B29C45/80 , B29C45/84 , B29C33/46 , F16K37/00 , G01M3/28
CPC分类号： B29C45/43 , B29C33/46 , B29C45/80 , B29C45/84 , B29C2045/822 , B29C2945/76167

2. 发明公开

EP2931491A2 PNEUMATICALLY DRIVEN, PIN VELOCITY CONTROLLED INJECTION MOLDING APPARATUS AND METHOD 有权
标题翻译：气动驱动的笔速控注射装置和方法
公开(公告)号：EP2931491A2
公开(公告)日：2015-10-21
申请号：EP13857660.8
申请日：2013-12-13
申请人： Synventive Molding Solutions, Inc.
发明人： ANTUNES, Sergio Ribeiro De Oliveira , ZHUANG, Rui Tan , MOSS, Mark , LEE, Christopher , FENG, Ling , GALATI, Vito
IPC分类号： B29C45/28 , B29C45/76 , B29C45/77
CPC分类号： B29C45/281 , B29C2045/822
摘要： An injection molding apparatus comprising: a pneumatically driven actuator having a piston mounted within a fluid sealed chamber for slidable axial movement along or against an interior surface of the fluid sealed chamber via a non-elastomeric engagement or with a non-elastomeric material disposed between the piston and the interior surface of the fluid sealed chamber, the piston forming first and second drive chambers within the fluid sealed chamber, each drive chamber having respective fluid flow ports, a source of pressurized gas that generates gas flow at a selected maximum pressure or flow rate, a gas metering mechanism, a controller interconnected to the gas metering mechanism, the controller controllabiy moving the gas metering mechanism to selectable positions that correspond to reduced pressures or reduced flow rates during the course of pin travel from the fully downstream gate closed position to the fully upstream gate open position.

3. 发明公开

EP2961586A1 FAST ACTING REDUCED VELOCITY PIN CONTROL 失效
标题翻译：与降低的速度快表演针控制
公开(公告)号：EP2961586A1
公开(公告)日：2016-01-06
申请号：EP14711879.8
申请日：2014-02-28
申请人： Synventive Molding Solutions, Inc.
发明人： ANTUNES, Sergio, Ribeiro de Oliveira , TAN, Zuang, Rui , MOSS, Mark , LEE, Christopher , GALATI, Vito
IPC分类号： B29C45/28 , B29C45/76 , B29C45/77
CPC分类号： B29C45/28 , B29C45/2806 , B29C45/281 , B29C45/76 , B29C45/77 , B29C2045/822 , B29C2945/76006 , B29C2945/76083 , B29C2945/76277 , B29C2945/76381 , B29C2945/76545 , B29C2945/76933 , B29C2945/76946 , B29C2945/76969
摘要： Apparatus and method for performing an injection molding cycle comprising: a manifold, a pneumatic actuator driven by a pneumatic valve assembly, the actuator driving a valve pin between a gate closed position and a maximum injection fluid flow position, the pneumatic valve assembly having a spool supported within a cylinder in a manner enabling driven translational movement within the cylinder, a controller that instructs the pneumatic valve assembly to drive the valve pin either upstream or downstream at one or more selected reduced velocities relative to a maximum.

4. 发明公开

EP2865507A4 RESIN CAST DEVICE AND RESIN CAST METHOD 有权
标题翻译：树脂浇注设备和树脂浇注工艺
公开(公告)号：EP2865507A4
公开(公告)日：2015-04-29
申请号：EP13807730
申请日：2013-06-06
申请人： CALSONIC KANSEI CORP
发明人： KOBUNE YOSHIHITO , KANEMASA AKIHITO , SUGIMOTO KENJIRO , SHIMADA KUNIO
IPC分类号： B29C45/43 , B29C33/46 , B29C45/76 , B29C45/80 , B29C45/84 , F16K37/00 , G01M3/28
CPC分类号： B29C45/43 , B29C33/46 , B29C45/80 , B29C45/84 , B29C2045/822 , B29C2945/76167

5. 发明授权

EP2961586B1 FAST ACTING REDUCED VELOCITY PIN CONTROL 失效
标题翻译：快速动作降低速度引脚控制
公开(公告)号：EP2961586B1
公开(公告)日：2018-05-02
申请号：EP14711879.8
申请日：2014-02-28
申请人： Synventive Molding Solutions, Inc.
发明人： ANTUNES, Sergio, Ribeiro de Oliveira , TAN, Zuang, Rui , MOSS, Mark , LEE, Christopher , GALATI, Vito
IPC分类号： B29C45/28 , B29C45/76 , B29C45/77 , B29C45/82
CPC分类号： B29C45/28 , B29C45/2806 , B29C45/281 , B29C45/76 , B29C45/77 , B29C2045/822 , B29C2945/76006 , B29C2945/76083 , B29C2945/76277 , B29C2945/76381 , B29C2945/76545 , B29C2945/76933 , B29C2945/76946 , B29C2945/76969
摘要： Apparatus and method for performing an injection molding cycle comprising: a manifold, a pneumatic actuator driven by a pneumatic valve assembly, the actuator driving a valve pin between a gate closed position and a maximum injection fluid flow position, the pneumatic valve assembly having a spool supported within a cylinder in a manner enabling driven translational movement within the cylinder, a controller that instructs the pneumatic valve assembly to drive the valve pin either upstream or downstream at one or more selected reduced velocities relative to a maximum.

6. 发明公开

EP3209476A1 PROPORTIONAL CONTROL VALVES MOUNTED IN AN INJECTION MOLDING SYSTEM 有权
标题翻译：比例控制阀安装在注塑系统中
公开(公告)号：EP3209476A1
公开(公告)日：2017-08-30
申请号：EP16702477.7
申请日：2016-01-21
申请人： Synventive Molding Solutions, Inc.
发明人： GALATI, Vito , TAN, Zhuang, Rui
IPC分类号： B29C45/82 , B29C45/28 , B29C45/27
CPC分类号： B29C45/2738 , B29C45/2703 , B29C45/281 , B29C45/82 , B29C2045/2817 , B29C2045/2872 , B29C2045/822 , B29C2945/76545 , B29C2945/76692 , B29C2945/76785 , B29C2945/76829
摘要： An injection molding apparatus (10) comprising: a heated manifold (16), one or more fluid driven actuators (210a, 210b) each interconnected to a corresponding valve pin (211a, 211b), a housing comprised of one or more metal plates (202a, 202b, 204a, 204b, 206) arranged to form a manifold chamber (208), each of the fluid driven actuators (210a, 210b) being mounted within or at least about one foot from within the manifold chamber (208), each fluid driven actuator being fluid drive interconnected to a proportional control valve (213a, 213b, 213c) that is mounted either within the manifold chamber (208) or having fluid flow ports (213p1, 213p2) that are interconnected within about one foot of corresponding fluid flow ports (210p1, 210p2) of a corresponding fluid driven actuator (210a, 210b).
摘要翻译： 1。一种注射成型设备（10），包括：加热的歧管（16），各自互连到对应的阀销（211a，211b）的一个或多个流体驱动致动器（210a，210b），由一个或多个金属板（208）中的每一个流体驱动致动器（210a，210b）安装在歧管腔室（208）内或至少约一英尺处，每个流体驱动致动器（210a，202b，204a，204b，206）流体驱动的致动器是流体驱动器，其与安装在歧管腔室（208）内或具有流体流动端口（213p1,213p2）的比例控制阀（213a，213b，213c）相互连接，所述流体流动端口在大约一英尺的相应流体（210a，210b）的流动端口（210p1,210p2）。

7. 发明授权

EP2954550B1 SEMICONDUCTOR DIE ENCAPSULATION OR CARRIER-MOUNTING METHOD, AND CORRESPONDING SEMICONDUCTOR DIE ENCAPSULATION OR CARRIER-MOUNTING APPARATUS 有权
标题翻译：半导体模封装或载运方法，以及相应的半导体模封装或载运装置
公开(公告)号：EP2954550B1
公开(公告)日：2017-06-28
申请号：EP14703936.6
申请日：2014-02-05
申请人： Boschman Technologies B.V.
发明人： DE BEIJER, Johannes Cornelis , RUTTEN, Michiel Hendrikus Antonius Wilhelmus , HUIZING, Ger , HOEDEMAKER, Mike Louis Theodoor
IPC分类号： H01L21/67 , B29C45/02
CPC分类号： H01L21/67126 , B29C45/14065 , B29C45/14336 , B29C45/14655 , B29C45/2628 , B29C45/82 , B29C2045/822 , H01L21/561 , H01L21/67092 , H01L21/67144 , H01L21/67253 , H01L22/10 , H01L23/3107 , H01L23/495 , H01L23/498 , H01L24/97

8. 发明公开

EP2976203A1 PNEUMATICALLY CONTROLLED REDUCED VELOCITY VALVE 有权
标题翻译：与减速气动控制的阀门
公开(公告)号：EP2976203A1
公开(公告)日：2016-01-27
申请号：EP14722899.3
申请日：2014-03-18
申请人： Synventive Molding Solutions, Inc.
发明人： ANTUNES, Sergio, Ribeiro De Oliveira , TAN, Zhuang, Rui , MOSS, Mark , LEE, Christopher , FENG, Ling , GALATI, Vito
IPC分类号： B29C45/28 , B29C45/76 , B29C45/77
CPC分类号： B29C45/2806 , B29C45/76 , B29C45/77 , B29C2045/0032 , B29C2045/2865 , B29C2045/2872 , B29C2045/822 , B29C2945/76006 , B29C2945/76083 , B29C2945/76277 , B29C2945/76381 , B29C2945/76545 , B29C2945/76943
摘要： Apparatus and method for performing an injection molding cycle comprising: a manifold, a pneumatic actuator driven by a pneumatic valve assembly, the actuator driving a valve pin between a gate closed position and a maximum injection fluid flow position, the pneumatic valve assembly controllably driving the valve pin in a continuous downstream direction at one or more selectable reduced downstream velocities that are less than the one or more maximum velocities, and, driving the valve pin from the fully upstream position in a continuous downstream direction at the one or more selectable reduced downstream velocities over either a selected portion or the entirety of the selected stroke length.

9. 发明公开

EP2954550A1 SEMICONDUCTOR DIE ENCAPSULATION OR CARRIER-MOUNTING METHOD, AND CORRESPONDING SEMICONDUCTOR DIE ENCAPSULATION OR CARRIER-MOUNTING APPARATUS 有权
标题翻译：程序的案件，安装或为组合体的情况的半导体芯片及相关设备或半导体芯片的支持支持
公开(公告)号：EP2954550A1
公开(公告)日：2015-12-16
申请号：EP14703936.6
申请日：2014-02-05
申请人： Boschman Technologies B.V.
发明人： DE BEIJER, Johannes Cornelis , RUTTEN, Michiel Hendrikus Antonius Wilhelmus , HUIZING, Ger , HOEDEMAKER, Mike Louis Theodoor
IPC分类号： H01L21/67 , B29C45/02
CPC分类号： H01L21/67126 , B29C45/14065 , B29C45/14336 , B29C45/14655 , B29C45/2628 , B29C45/82 , B29C2045/822 , H01L21/561 , H01L21/67092 , H01L21/67144 , H01L21/67253 , H01L22/10 , H01L23/3107 , H01L23/495 , H01L23/498 , H01L24/97
摘要： A semiconductor die encapsulation or carrier-mounting method comprises the steps of providing a first tool part for holding multiple semiconductor dies and providing the semiconductor dies on the first tool part; providing a second tool part, one of the first and second tool parts comprising displaceable insert members to allow applying a pressure by each displaceable insert member on a surface area of a semiconductor die; and bringing together the first and second tool parts such as to define a space between the first and second tool parts, the semiconductor products being arranged in the space. The displaceable insert members apply a pressure onto the surface area of the semiconductor dies. The pressure applied by the displaceable insert members is monitored and regulated to a predetermined pressure. Subsequently, the first and second tool parts are separated and the processed semiconductor dies are removed.

10. 发明公开

EP2865507A1 RESIN CAST DEVICE AND RESIN CAST METHOD 有权
标题翻译：树脂铸造装置和树脂铸造方法
公开(公告)号：EP2865507A1
公开(公告)日：2015-04-29
申请号：EP13807730.0
申请日：2013-06-06
申请人： Calsonic Kansei Corporation
发明人： KOBUNE, Yoshihito , KANEMASA, Akihito , SUGIMOTO, Kenjiro , SHIMADA, Kunio
IPC分类号： B29C45/43 , B29C45/76 , B29C45/80 , B29C45/84 , B29C33/46 , F16K37/00 , G01M3/28
CPC分类号： B29C45/43 , B29C33/46 , B29C45/80 , B29C45/84 , B29C2045/822 , B29C2945/76167
摘要： Provided are a resin molding device and a resin molding method for easily removing a thin and soft resin molded product from a mold with a good finish by sensing an operation failure of an air ejector reliably. An air ejector (22) of a resin molding device (20) comprises air passages (24a, 24b), air outlets (26a, 26b) through which air is injected, movable valves (27a, 27b) biased by bias members (29a, 29b) to close the air outlets (26a, 26b), accommodation spaces (28a, 28b) in which the movable valves (27a, 27b) are movably contained, an air supply path (32) through which air is supplied from an air supply source (33), and a pressure sensor (35) to detect air pressure. After completing the mold removal, the air is supplied via the air supply path to the air passages at an air pressure smaller than the bias force of the bias members, and the air pressure is detected by the pressure sensor.
摘要翻译：本发明提供一种树脂成形装置和树脂成形方法，通过可靠地检测空气喷射器的动作不良，能够容易地从表面良好的模具中将薄且柔软的树脂成形体除去。树脂成形装置20的空气喷射器22由空气通路24a，24b，注入空气的空气出口26a，26b，由偏置构件29a，29b偏置的可动阀27a，（26a，26b）关闭空气出口（26a，29b），可移动地容纳可移动阀（27a，27b）的容纳空间（28a，28b），空气供应通道（32）源（33）和检测气压的压力传感器（35）。在完成模具移除之后，空气通过空气供应路径以小于偏置构件的偏置力的空气压力供应到空气通道，并且空气压力由压力传感器检测。

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