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1. 发明公开

EP1976008A3 Inkjet Printed Wirings, Encapsulant and Shielding 审中-公开
标题翻译：印有喷墨布线，封装和屏蔽
公开(公告)号：EP1976008A3
公开(公告)日：2012-10-17
申请号：EP08152080.1
申请日：2008-02-28
申请人： Xerox Corporation
发明人： Gulvin, Peter M. , Nystrom, Peter J. , Meyers, John P.
IPC分类号： H01L23/552 , H01L21/60 , H01L23/66
CPC分类号： H01L24/82 , H01L23/3185 , H01L23/552 , H01L23/66 , H01L24/24 , H01L2224/24011 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/76155 , H01L2224/82007 , H01L2224/82102 , H01L2224/82104 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/12044 , H01L2924/3011 , H01L2924/3025 , H01L2924/00
摘要： A method of connecting a chip (220) to a package (210) in a semiconductor device (200) includes printing an encapsulant (250) to a predetermined thickness on at least a portion of the chip and package and printing a layer of conductive material (260) on the encapsulant in a predetermined pattern between the chip and package. The printed conductive material conforms to an upper surface of the encapsulant such that the encapsulant defines a distance from the printed conductive material to the chip and package. The method further includes printing a second layer of encapsulant (270) over the printed conductive material curing at least the second layer of encapsulant.

2. 发明公开

EP1211219A3 Process for manufacturing micromechanical and microoptomechanical structures with backside metalization 有权
标题翻译：一种用于制备具有背侧金属化的微机械和microoptomechanical结构过程
公开(公告)号：EP1211219A3
公开(公告)日：2004-06-16
申请号：EP01128160.7
申请日：2001-11-27
申请人： MICROSCAN SYSTEMS INCORPORATED , XEROX CORPORATION
发明人： Scharf, Bruce R. , Kubby, Joel A. , Lin, Chuang-Chia , Tran, Alex T. , Zosel, Andrew J. , Gulvin, Peter M. , Chen, Jingkuang
IPC分类号： B81B3/00
CPC分类号： B81C1/00484 , B81B2201/042 , B81B2203/0118 , B81C1/00666 , B81C2201/0142
摘要： The present invention provides a micromechanical or microoptomechanical structure produced by a process comprising defining the structure in a single-crystal silicon layer separated by an insulator layer from a substrate layer; selectively etching the single crystal silicon layer; depositing and etching a polysilicon layer on the insulator layer, with remaining polysilicon forming mechanical elements of the structure; metalizing a backside of the structure; and releasing the formed structure.

3. 发明公开

EP1970345A2 Method and system for a composite polymer for printed MEMS 审中-公开
标题翻译： Verfahren und Systemfürein Verbundpolymerfürgedruckte MEMS
公开(公告)号：EP1970345A2
公开(公告)日：2008-09-17
申请号：EP08151793.0
申请日：2008-02-22
申请人： Xerox Corporation
发明人： Gulvin, Peter M.
IPC分类号： B81C1/00
CPC分类号： B81C1/00373 , H05K3/1241 , H05K3/4664
摘要： An embodiment generally relates to a method for creating a composite material for micro-electro mechanical systems. The method includes determining a layout for a micro-electro mechanical system device and alternating depositing drops of polymer and drops of conductor to create an interwoven matrix based on the layout. The method also includes forming the micro-electro mechanical system device based on the layout.
摘要翻译：一个实施方案一般涉及一种用于产生微机电系统的复合材料的方法。该方法包括确定微电子机械系统装置的布局并且交替地沉积聚合物和液滴的导体以基于布局创建交织矩阵。该方法还包括基于布局形成微机电系统装置。

4. 发明授权

EP1243550B1 Micro-fabricated shielded conductors 有权
标题翻译：微制造屏蔽导线
公开(公告)号：EP1243550B1
公开(公告)日：2006-06-14
申请号：EP02006203.0
申请日：2002-03-19
申请人： Xerox Corporation
发明人： Gulvin, Peter M. , Chen, Jingkuang
IPC分类号： B81B7/00 , B81C1/00
CPC分类号： B41J2/1639 , B41J2/16 , B41J2/1629 , B41J2/1631 , B41J2/1642 , B41J2/1645 , B41J2002/14403 , B81B7/0006

5. 发明公开

EP1213260A3 Process for manufacturing micromechanical and microoptomechanical structures with pre-applied patterning 有权
标题翻译：一种用于制备具有附接的样品的微机械和microoptomechanical结构过程
公开(公告)号：EP1213260A3
公开(公告)日：2004-06-16
申请号：EP01128169.8
申请日：2001-11-27
申请人： MICROSCAN SYSTEMS INCORPORATED , XEROX CORPORATION
发明人： Scharf, Bruce R. , Gulvin, Peter M. , Chen, Jingkuang , Kubby, Joel A. , Lin, Chuang-Chia , Tran, Alex T.
IPC分类号： B81B3/00
CPC分类号： B81C1/00666 , B81B2201/047 , B81B2203/0118
摘要： The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a pattern on a single crystal silicon layer separated by an insulator layer from a substrate layer; defining a structure in the single-crystal silicon layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; and releasing the formed structure.

6. 发明公开

EP1213259A3 Process for manufacturing micromechanical and microoptomechanical structures with single crystal silicon exposure step 有权
标题翻译：一种用于制备微机械和microoptomechanical结构，包括硅单晶的曝光的步骤的过程
公开(公告)号：EP1213259A3
公开(公告)日：2004-06-16
申请号：EP01128161.5
申请日：2001-11-27
申请人： MICROSCAN SYSTEMS INCORPORATED , XEROX CORPORATION
发明人： Zosel, Andrew J. , Gulvin, Peter M. , Chen, Jingkuang , Kubby, Joel A. , Lin, Chuang-Chia , Tran, Alex T.
IPC分类号： B81B3/00
CPC分类号： B81C1/00666 , B81B2203/058 , B81C2201/014 , B81C2201/0164 , B81C2201/056 , G02B26/0833
摘要： The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.

7. 发明授权

EP1974922B1 Highly Integrated Wafer Bonded MEMS Devices with Release-Free Membrane Manufacture for High Density Print Heads 有权
标题翻译：高度集成免税膜制备晶片键合的MEMS器件用于具有高密度的打印头
公开(公告)号：EP1974922B1
公开(公告)日：2013-05-15
申请号：EP08151995.1
申请日：2008-02-27
申请人： Xerox Corporation
发明人： Nystrom, Peter J. , Gulvin, Peter M. , Browne, Paul W.
IPC分类号： B41J2/16 , B41J2/14
CPC分类号： B41J2/14314 , B41J2/16 , B41J2/1623 , B41J2/1629 , B41J2/1632 , B41J2/1639

8. 发明公开

EP1974922A1 Highly Integrated Wafer Bonded MEMS Devices with Release-Free Membrane Manufacture for High Density Print Heads 有权
标题翻译：高度集成免税膜制备晶片键合的MEMS器件用于具有高密度的打印头
公开(公告)号：EP1974922A1
公开(公告)日：2008-10-01
申请号：EP08151995.1
申请日：2008-02-27
申请人： Xerox Corporation
发明人： Nystrom, Peter J. , Gulvin, Peter M. , Browne, Paul W.
IPC分类号： B41J2/16 , B41J2/14
CPC分类号： B41J2/14314 , B41J2/16 , B41J2/1623 , B41J2/1629 , B41J2/1632 , B41J2/1639
摘要： A method of fabricating a MEMS inkjet type print head (100) and the resulting device is disclosed. The method includes providing a driver component (110) and separately providing an actuatable membrane component (112), the actuatable membrane component (112) being formed in the absence of an acid etch removing a sacri6cial layer. The separately provided actuatable membrane component (112) is bonded to the driver component (110) and a nozzle plate (114) is attached to the actuatable membrane component (112) subsequent to the bonding. Separately fabricating the components removes the need for hydrofluoric acid etch removal of a sacrificial layer previously required for forming the actuatable membrane with respect to the driver component.
摘要翻译：制造MEMS的喷墨型的打印头（100）的方法和所得到的装置是游离缺失盘。该方法包括提供一个驱动器部件（110）和致动在膜部件（112）分开设置，可致动的膜成分（112）中不存在酸蚀刻除去sacri6cial层的形成。单独设置的致动膜成分（112）结合到所述驱动器组件（110）和一个喷嘴板（114）附连到后续于接合可致动膜成分（112）。另外单独制造的组件不再需要为氢氟酸蚀刻去除以前需要用于相对于驱动部件形成所述致动膜的牺牲层的。

9. 发明授权

EP1226944B1 Fabrication method 有权
标题翻译：制造工艺
公开(公告)号：EP1226944B1
公开(公告)日：2005-08-10
申请号：EP02250367.6
申请日：2002-01-18
申请人： Xerox Corporation
发明人： Gulvin, Peter M. , Eklund, Elliott A.
IPC分类号： B41J2/14 , H04R19/00 , H04R7/08 , F04B43/04
CPC分类号： B81B3/007 , B41J2/14314 , B41J2/16 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1639 , B41J2/1642 , B81B2201/052 , B81B2203/0127 , F04B43/043 , H04R7/08

10. 发明公开

EP1460462A1 Mems optical latching switch 有权
标题翻译： Verriegelbarer optischer Mems Schalter
公开(公告)号：EP1460462A1
公开(公告)日：2004-09-22
申请号：EP04006723.3
申请日：2004-03-19
申请人： Xerox Corporation
发明人： Kubby, Joel A. , Feinberg, Kathleen A. , German, Kristine A. , Gulvin, Peter M. , Ma, Jun , Lin, Pinyen
IPC分类号： G02B6/35
CPC分类号： G02B6/3508 , G02B6/356 , G02B6/358 , G02B2006/12145
摘要： An optical micro-electro-mechanical system (MEMS) switch is disclosed. In a preferred embodiment the optical MEMS switch is used as an M x N optical signal switching system. The optical MEMS switch comprises a plurality of optical waveguides formed on a cantilever beam platform for switching optical states wherein the state of the optical switch is changed by a system of drive and latch actuators. The optical MEMS device utilizes a latching mechanism in association with a thermal drive actuator for aligning the cantilever beam platform. In use the optical MEMS device may be integrated with other optical components to form planar light circuits (PLCs). When switches and PLCs are integrated together on a silicon chip, compact higher functionality devices, such as Reconfigurable Optical Add-Drop Multiplexers (ROADMs), may be fabricated.
摘要翻译：公开了一种光学微机电系统（MEMS）开关。在优选实施例中，光学MEMS开关用作M×N光信号切换系统。光学MEMS开关包括形成在悬臂梁平台上的多个光波导，用于切换光学状态，其中光开关的状态由驱动和闩锁致动器的系统改变。光学MEMS器件利用与用于对准悬臂梁平台的热驱动致动器相关联的闭锁机构。在使用中，光学MEMS器件可以与其他光学部件集成以形成平面光电路（PLC）。当开关和PLC集成在硅芯片上时，可以制造紧凑的更高功能的器件，例如可重构光插座多路复用器（ROADM）。

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