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    • 1. 发明公开
    • METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING EPITAXIAL WAFER
    • 用于生产发光NITRIDHALBLEITERELEMENTS及其制造方法的外延晶片
    • EP2352182A1
    • 2011-08-03
    • EP09821994.2
    • 2009-10-19
    • Sumitomo Electric Industries, Ltd.
    • SUMITOMO TakamichiAKITA KatsushiKYONO TakashiYOSHIZUMI Yusuke
    • H01L33/32H01L21/205H01S5/343
    • H01L21/0254B82Y20/00H01L21/02389H01L21/02433H01L21/02458H01L21/02579H01L21/0262H01L33/0062H01L33/007H01L33/06H01L33/16H01L33/32H01S5/34333
    • Provided is a method of fabricating a nitride semiconductor light emitting device, and this method can reduce degradation of a well layer during formation of a p-type gallium nitride based semiconductor region and a barrier layer. After growth of a gallium nitride based semiconductor region 13, a barrier layer 2 1 a is grown on a substrate 11. The barrier layer 21a is formed at a growth temperature TB during a period from a time t1 to t2. The growth temperature TB (= T2) is in the range of not less than 760 Celsius degrees and not more than 800 Celsius degrees. At the time t2, the growth of the barrier layer 21a is completed. After the growth of the barrier layer 21a, a well layer 23a is grown on the substrate 11 without interruption of growth. The well layer 23a is formed at a growth temperature TW (= T2) during a period from the time t2 to t3. The growth temperature TW is the same as the growth temperature TB and can be in the range of not less than 760 Celsius degrees and not more than 800 Celsius degrees. An indium composition of the well layer 23a is not less than 0.15. Next, the growth of the well layer and barrier layer is repeatedly carried out without interruption of growth.
    • 本发明提供一种制造氮化物半导体发光器件的方法,并且该方法可以在形成p型氮化镓基半导体区域和势垒层的过程中减少阱层的劣化。 氮化镓基半导体区域13,阻挡层2 1一个生长在衬底11的势垒层21a上在从时间t1至t2的期间的生长温度TB形成生长之后。 生长温度TB(= T2)为不小于摄氏760度以上,摄氏800度的范围内和。 在时刻t2,势垒层21a的生长结束。 势垒层21a的生长之后,阱层23a被在基板11生长没有生长的中断。 阱层23a被在从时间t2到t3的期间的生长温度TW(= T2)形成。 生长温度TW是相同的生长温度TB,并且可以是在不低于摄氏760度以上,摄氏800度的范围内和。 阱层23a的铟组成不小于0:15以下。 接着,将阱层和势垒层的生长重复执行,而不中断生长。
    • 6. 发明公开
    • METHOD FOR PRODUCING SEMICONDUCTOR LIGHT-EMITTING ELEMENT
    • VERFAHREN ZUR HERSTELLUNG EINES LICHTEMITTIERENDEN HALBLEITERELEMENTS
    • EP2485283A1
    • 2012-08-08
    • EP10820428.0
    • 2010-09-22
    • Sumitomo Electric Industries, Ltd.
    • KYONO TakashiENYA YoheiYOSHIZUMI YusukeAKITA KatsushiUENO MasakiSUMITOMO TakamichiADACHI MasahiroTOKUYAMA Shinji
    • H01L33/32H01S5/343
    • H01S5/3202B82Y20/00H01L33/0075H01L33/16H01S5/0014H01S5/34333
    • A method of making a semiconductor light-emitting device is provided, and this method enables the selection of an appropriate orientation of piezoelectric polarization in an active layer. In Step S104, the measurement of photoluminescence of the substrate product, which is formed by growing n-type and p-type gallium nitride based semiconductor layers and an light emitting layer using the selected one or more tilting angles, is carried out while an electrical bias is applied to the substrate product in order to obtain dependence of the photoluminescence of the substrate product on the bias. In Step S105, the estimation of the direction of the piezoelectric polarization in the light-emitting layer at each of the selected tilt angle of the substrate primary surface is carried out from the observed bias dependence. In Step S106, either of the tilting angle on the primary surface or on the back side surface is selected based on the estimation to determine the orientation of a growth substrate for forming the semiconductor light emitting device. A semiconductor laminate for the semiconductor light emitting device is grown on the primary surface of growth substrate.
    • 提供了一种制造半导体发光器件的方法,并且该方法能够在有源层中选择压电极化的适当取向。 在步骤S104中,通过使用所选择的一个或多个倾斜角度生长n型和p型氮化镓基半导体层和发光层形成的衬底产物的光致发光测量,同时电 为了获得衬底产物的光致发光对偏压的依赖性,将偏置施加到衬底产物。 在步骤S105中,从观察到的偏置依赖性进行基板主面的所选择的倾斜角度的发光层中的压电极化的方向的估计。 在步骤S106中,基于估计来选择主表面或背面表面上的倾斜角,以确定用于形成半导体发光器件的生长衬底的取向。 在生长衬底的主表面上生长用于半导体发光器件的半导体层压体。
    • 10. 发明公开
    • GROUP III NITRIDE SEMICONDUCTOR OPTICAL ELEMENT
    • 优化GRUPPE-III-NITRID-HALBLEITERBAUELEMENT
    • EP2472606A1
    • 2012-07-04
    • EP10781399.0
    • 2010-02-26
    • Sumitomo Electric Industries, Ltd.
    • UENO MasakiYOSHIZUMI YusukeENYA YoheiKYONO TakashiAKITA KatsushiSUMITOMO TakamichiADACHI MasahiroTOKUYAMA Shinji
    • H01L33/32H01S5/343
    • H01S5/34333B82Y20/00H01L33/16H01L33/32H01L33/325H01S5/3202
    • A group III nitride semiconductor optical device 11a has a group III nitride semiconductor substrate 13 having a main surface 13a forming a finite angle with a reference plane Sc orthogonal to a reference axis Cx extending in a c-axis direction of the group III nitride semiconductor and an active layer 17 of a quantum-well structure, disposed on the main surface 13a of the group III nitride semiconductor substrate 13, including a well layer 28 made of a group III nitride semiconductor and a plurality of barrier layers 29 made of a group III nitride semiconductor. The main surface 13a exhibits semipolarity. The active layer 17 has an oxygen content of at least 1 × 10 17 cm -3 but not exceeding 8 × 10 17 cm -3 . The plurality of barrier layers 29 contain an n-type impurity other than oxygen by at least 1 × 10 17 cm -3 but not exceeding 1 × 10 19 cm -3 in an upper near-interface area 29u in contact with a lower interface 28Sd of the well layer 28 on the group III nitride semiconductor substrate side.
    • III族氮化物半导体光学器件11a具有III族氮化物半导体衬底13,其具有与III族氮化物半导体的c轴方向上延伸的参考轴Cx正交的参考平面Sc形成有限角度的主表面13a; 设置在III族氮化物半导体衬底13的主表面13a上的量子阱结构的有源层17,包括由III族氮化物半导体制成的阱层28和由III族组成的多个势垒层29 氮化物半导体。 主表面13a具有半极性。 有源层17的氧含量至少为1×10 17 cm -3,但不超过8×10 17 cm -3。 多个阻挡层29在与下部界面28Sd接触的上侧近界面区域29u中含有除了氧以外的至少1×10 17 cm -3但不超过1×10 19 cm -3的n型杂质 的III族氮化物半导体衬底侧的阱层28。