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1. 发明公开

EP3214647A1 HEAT-DISSIPATING STRUCTURE 审中-公开
标题翻译：散热结构
公开(公告)号：EP3214647A1
公开(公告)日：2017-09-06
申请号：EP15856013.6
申请日：2015-04-13
申请人： Shindengen Electric Manufacturing Co., Ltd.
发明人： IKEDA Kosuke , MORINAGA Yuji , MATSUZAKI Osamu
IPC分类号： H01L23/36 , H01L25/07 , H01L25/18 , H05K7/20
CPC分类号： H05K7/20409 , F28F13/08 , F28F2013/005 , H01L23/36 , H01L23/3672 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2924/0002 , H01R12/7082 , H05K7/005 , H05K7/1053 , H05K7/209 , H01L2924/00
摘要： A heat sink according to one embodiment of the present invention includes: a base portion having a first surface and a second surface which oppose each other; at least one heat dissipating fin extending vertically from the first surface, each of the at least one heat dissipating fin having an insertion groove extending from an end portion thereof toward the base portion, and a first fin portion and a second fin portion which are separated by the insertion groove; and a connector included in the base portion, the connector being above the insertion groove in plan view, and the connector being configured to electrically connect a first heat generating component to be inserted into the insertion groove from a side of the first surface and a second heat generating component to be disposed on a side of the second surface.
摘要翻译：根据本发明的一个实施例的散热器包括：具有彼此相对的第一表面和第二表面的基部; 从第一表面竖直延伸的至少一个散热片，所述至少一个散热片中的每一个散热片具有从其端部朝向基部延伸的插入槽以及分离的第一散热片部分和第二散热片部分通过插入槽; 以及连接器，所述连接器包括在所述基部中，所述连接器在俯视图中位于所述插入槽的上方，并且所述连接器被构造成将从所述第一表面的一侧电连接到所述插入槽中的第一发热部件和第二表面发热元件设置在第二表面的一侧。

2. 发明公开

EP3214646A1 HEAT-DISSIPATING STRUCTURE 无效
标题翻译：散热结构
公开(公告)号：EP3214646A1
公开(公告)日：2017-09-06
申请号：EP14904817.5
申请日：2014-10-29
申请人： Shindengen Electric Manufacturing Co., Ltd.
发明人： IKEDA Kosuke , MORINAGA Yuji , MATSUZAKI Osamu
IPC分类号： H01L23/36 , H01L25/07 , H01L25/18 , H05K7/20
CPC分类号： H05K1/021 , H01L23/3672 , H01L25/07 , H01L25/18 , H01L2924/0002 , H05K1/18 , H05K3/0061 , H05K7/209 , H05K2201/066 , H05K2201/10015 , H05K2201/10022 , H05K2201/10166 , H05K2201/10174 , H05K2201/10189 , H01L2924/00
摘要： The present invention provides a heat dissipating structure with high heat dissipation performance while reducing the electric resistance. A heat dissipating structure includes: a heat sink (2) having a base portion (6), and a plurality of heat dissipating fins (7) provided upright on a first surface (6a) of the base portion (6); a first heat generating component (3) provided on a side of the first surface (6a) of the base portion (6) while being in contact with at least one heat dissipating fin (7) of the plurality of heat dissipating fins (7); a circuit board (4) joined to a second surface (6b), opposite to the first face (6a), of the base portion (6) while being electrically connected to the first heat generating component (3); a second heat generating component (5) provided on the circuit board (4), the second heat generating component (5) generating a smaller amount of heat than the first heat generating component (3); and a connector (20) electrically connecting the first heat generating component (3) and the second heat generating component (5). The connector (20) has a first outlet (22a, 22b) into which a first connecting terminal (21 a, 21b) on a side of the first heat generating component (3) is insertable, and a second outlet (24) into which a second connecting terminal (23) on a side of the second heat generating component (5) is insertable.
摘要翻译：本发明提供了一种具有高散热性能同时降低电阻的散热结构。散热结构包括：散热器（2），其具有基部（6）和立设在基部（6）的第一表面（6a）上的多个散热片（7）;散热片在与所述多个散热翅片（7）中的至少一个散热翅片（7）接触的同时设置在所述基部（6）的所述第一表面（6a）的一侧上的第一发热部件（3） ; 电连接到与所述基部（6）的所述第一面（6a）相对的第二表面（6b），同时电连接到所述第一发热元件（3）的电路板（4）; 设置在所述电路板（4）上的第二发热部件（5），所述第二发热部件（5）产生的热量小于所述第一发热部件（3）的热量; 和电连接第一发热部件（3）和第二发热部件（5）的连接器（20）。连接器20具有能够插入第一发热部件3侧的第一连接端子21a，21b的第一插座22a和插入该插座20b的第二插座24，第二发热元件（5）一侧上的第二连接端子（23）是可插入的。

3. 发明公开

EP3208838A1 SEMICONDUCTOR MODULE 有权
标题翻译：半导体模块
公开(公告)号：EP3208838A1
公开(公告)日：2017-08-23
申请号：EP14889184.9
申请日：2014-10-16
申请人： Shindengen Electric Manufacturing Co., Ltd.
发明人： IKEDA Kosuke , MORINAGA Yuji , MATSUZAKI Osamu
IPC分类号： H01L23/36 , H01L25/07 , H01L25/18
CPC分类号： H01L25/0657 , H01L23/3735 , H01L23/492 , H01L23/49531 , H01L23/49833 , H01L24/37 , H01L24/40 , H01L25/065 , H01L25/074 , H01L2224/32135 , H01L2224/32141 , H01L2224/32145 , H01L2224/32151 , H01L2224/37147 , H01L2224/37599 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2225/06506 , H01L2225/06562 , H01L2225/06572 , H01L2225/06589 , H01L2924/00014
摘要： A first circuit board having thermal conductivity; a second circuit board having thermal conductivity and disposed opposing the first circuit board; a first semiconductor element joined to an opposing surface of the first circuit board opposing the second circuit board; a second semiconductor element joined to an opposing surface of the second circuit board opposing the first circuit board; and a connector electrically connecting the first semiconductor element and the second semiconductor element. The connector includes a portion which is sandwiched between the first semiconductor element and the second circuit board without through the second semiconductor element, and which is in contact with the first semiconductor element and the second circuit board.
摘要翻译：具有导热性的第一电路板; 具有导热性且与所述第一电路板相对设置的第二电路板; 第一半导体元件，所述第一半导体元件接合到所述第一电路板的与所述第二电路板相对的相对表面; 第二半导体元件，其接合到所述第二电路板的与所述第一电路板相对的相对表面; 以及电连接第一半导体元件和第二半导体元件的连接器。连接器包括被夹在第一半导体元件和第二电路板之间而不经过第二半导体元件并且与第一半导体元件和第二电路板接触的部分。

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