专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP3315559A1 ORGANIC SILICONE RESIN ALUMINUM BASE COPPER CLAD LAMINATE AND PREPARATION METHOD THEREOF 审中-公开
标题翻译：有机硅树脂铝基铜基层压板及其制备方法
公开(公告)号：EP3315559A1
公开(公告)日：2018-05-02
申请号：EP15901587.4
申请日：2015-11-18
申请人： Shengyi Technology Co., Ltd.
发明人： TANG, Guofang , YE, Suwen
IPC分类号： C08L83/07 , C08L83/05 , C08K3/22 , H05K1/05 , B32B15/08
CPC分类号： B32B15/08 , B32B15/20 , B32B27/283 , B32B2307/302 , B32B2457/08 , C08K3/22 , H05K1/05
摘要： The present invention relates to an organic silicone resin aluminum base copper clad laminate and preparation method thereof. The aluminum base copper clad laminate comprises sequentially a copper foil layer, an insulation layer and an aluminum plate layer, wherein, the insulation layer is prepared from an organic silicone resin composition, and the organic silicone resin composition comprises the following components in parts by weight: 100 parts of an organic silicone resin, 40-100 parts of a vinyl-terminated silicone oil, 0.0001-0.5 parts of a catalyst, and 0.00001-0.1 parts of an inhibitor. By adopting an organic silicone resin as a substrate polymer, the electrical insulation and heat resistance functions of the aluminum base copper clad laminate are improved. Moreover, the vinyl-terminated silicone oil as reactive diluent can effectively reduce brittleness of a silicone resin, improving the toughness of the organic silicone resin composition. The aluminum base copper clad laminate has advantageous electrical insulation, heat-conduction, high-temperature resistance and resistance to long-term aging.
摘要翻译：本发明涉及一种有机硅树脂铝基覆铜箔层压板及其制备方法。该铝基覆铜层压板依次包括铜箔层，绝缘层和铝板层，其中，所述绝缘层由有机硅树脂组合物制备而成，所述有机硅树脂组合物包含以下重量份数的组分：100份有机硅树脂，40-100份乙烯基封端的硅油，0.0001-0.5份催化剂和0.00001-0.1份抑制剂。通过采用有机硅树脂作为基材聚合物，改善了铝基覆铜箔层压板的电绝缘和耐热功能。而且，作为反应性稀释剂的乙烯基封端的硅油可以有效地降低有机硅树脂的脆性，提高有机硅树脂组合物的韧性。该铝基覆铜箔层压板具有有利的电绝缘性，导热性，耐高温性和抗长期老化性。

2. 发明公开

EP3239243A1 CERAMIZED SILICONE RESIN COMPOSITION AND PRE-PREG AND LAMINATE THAT USE THE COMPOSITION 有权
标题翻译： CERAMIZED有机硅树脂组合物和PRE-PREG和层压板使用的组成
公开(公告)号：EP3239243A1
公开(公告)日：2017-11-01
申请号：EP15871610.0
申请日：2015-06-01
申请人： Shengyi Technology Co. Ltd.
发明人： YE, Suwen , TANG, Guofang
IPC分类号： C08L83/04 , C08K13/02 , C08K3/34 , B32B15/08
CPC分类号： C08L83/04 , B32B15/08 , C08K3/34 , C08K3/346 , C08K13/02
摘要： The present invention relates to a ceramized silicone resin composition and a pre-preg and a laminate that use the composition. The ceramized silicone resin composition comprises: 50-100 parts of a condensation-type silicone resin, 0.0001-2 parts of a catalyst, 5-80 parts of a ceramic-forming filler, and 0.01-50 parts of a flux. The pre-preg and the laminate manufactured using the ceramized silicone resin composition, when used in a sustained high temperature, can transform into complex ceramized structure thereby providing ceramic properties, thus providing great fireproof and flame retardant effects; also, manufacturing of the laminate is similar to that of a regular FR-4 laminate, where the process is easy to operate. The ceramized silicone resin composition, the pre-preg, and the laminate have the advantages of being halogen-free, low smoke, low toxicity, flame retardant, and fireproof, provide a novel concept and a novel method in terms of flame retardancy and fire resistance, accelerate the research progress in laminate passive fire protection technology, and have broad prospects in the field of fire protection and fire resistance.
摘要翻译：陶瓷化有机硅树脂组合物和使用该组合物的预浸渍体和层压体技术领域本发明涉陶瓷化有机硅树脂组合物包含50-100份缩合型有机硅树脂，0.0001-2份催化剂，5-80份陶瓷形成填料和0.01-50份助熔剂。使用陶瓷化有机硅树脂组合物制成的预浸料和层压制品当在持续高温下使用时，可以转变成复杂的陶瓷结构，从而提供陶瓷性质，因此提供了很好的防火和阻燃效果; 此外，层压板的制造与常规FR-4层压板的制造类似，其中该工艺易于操作。陶瓷化有机硅树脂组合物，预浸料和层压板具有无卤，低烟，低毒，阻燃，防火等优点，为阻燃和防火提供了新的理念和新方法阻燃，加速层压被动防火技术的研究进展，在防火，防火领域具有广阔的应用前景。

3. 发明公开

EP3239245A1 ORGANIC SILICON RESIN COMPOSITION, WHITE PREPREG AND WHITE LAMINATE USING SAME 有权
标题翻译：有机硅树脂组合物，白色预浸料和白色层压板使用相同
公开(公告)号：EP3239245A1
公开(公告)日：2017-11-01
申请号：EP15871613.4
申请日：2015-06-01
申请人： Shengyi Technology Co. Ltd.
发明人： TANG, Guofang , YE, Suwen , SUN, Peng
IPC分类号： C08L83/04 , C08K3/10 , C08K3/22 , C08K3/36 , H01L23/29
CPC分类号： C08L83/04 , B32B15/08 , C08J5/12 , C08K3/01 , C08K3/10 , C08K3/22 , C08K3/36 , C08K5/00 , C08K5/098 , C08K5/17 , C08K5/5398 , C08K5/5399 , C08K5/5415 , C08K2003/2227 , C08K2003/2237 , C08K2003/2241 , C08K2003/2296 , C08L83/06 , C09J183/04 , H01L23/29 , H01L2924/0002 , H01L2924/00 , C08L83/00
摘要： Provided are an organic silicon resin composition, prepreg and laminate using the same. The organic silicon resin composition glue solution contains a condensation silicon resin, a catalyst, an auxiliary agent, a white filler and a solvent as necessary components, and is impregnated in a reinforced material such as a sheet-like fiberglass fiber base material and then dried to prepare the prepreg. The prepreg has a net structure via crosslinking of the silicon resin using a condensation reaction. Since the organic silicon resin has ultrahigh heat resistance and yellowing resistance, the present invention applies the silicon resin to a white LED copper-clad laminate instead of a traditional organic resin, satisfying the demand for high heat resistance, and replacing the ceramic substrate to be a new heat-dissipating substrate base material.
摘要翻译：本发明提供一种有机硅树脂组合物，半固化片以及使用其的层压体。有机硅树脂组合物胶溶液含有作为必要成分的缩合硅树脂，催化剂，助剂，白色填充剂和溶剂，浸渍在片状玻璃纤维基材等增强材料中，然后干燥准备预浸料。预浸料坯通过使用缩合反应交联硅树脂而具有网状结构。由于有机硅树脂具有超高的耐热性和耐黄变性，因此本发明将硅树脂应用于白色LED覆铜层压板而不是传统的有机树脂，满足了对高耐热性的要求，并且将陶瓷基板替换为一种新的散热衬底基材。

4. 发明公开

EP3239246A1 HALOGEN-FREE PHOSPHORUS-FREE SILICON RESIN COMPOSITION, AND PREPREG, LAMINATED BOARD, COPPER-CLAD PLATE USING SAME, AND PRINTED CIRCUIT BOARD 审中-公开
标题翻译：无卤素无磷硅树脂组合物，以及预浸剂，层压板，使用它的铜层板和印刷电路板
公开(公告)号：EP3239246A1
公开(公告)日：2017-11-01
申请号：EP15871662.1
申请日：2015-07-06
申请人： Shengyi Technology Co. Ltd.
发明人： SU, Xiaosheng , YE, Suwen , TANG, Guofang
IPC分类号： C08L83/07 , C08L83/05 , C08J3/09 , B32B27/04 , B32B15/08 , H05K1/03
CPC分类号： H05K1/0353 , B32B15/08 , B32B15/082 , B32B27/04 , B32B27/20 , B32B2307/3065 , B32B2457/08 , C08J3/09 , H05K1/03
摘要： Provided are a halogen-free phosphorus-free silicon resin composition, and prepreg and laminated board using the same, and printed circuit board, the silicon resin composition comprising the following components in parts by solid weight: 50-90 parts of an organic silicon resin, 20-80 parts of a vinyl-terminated silicon oil, 0.1-5 parts of a viscosity enhancing agent, 0-60 parts of a filler, 0.0001-0.5 parts of a catalyst, and 0.00001-0.1 parts of an inhibitor, a mole ratio between Si-H in a cross-linking agent and Si-Vi in the organic silicon resin being 1.0-1.7. The resin body of the resin composition is a thermosetting silicon resin, and the laminated board prepared thereby has good heat and flame resistance and an extremely low dielectric constant (Dk) and dielectric loss (Df).
摘要翻译：本发明提供一种无卤无磷硅树脂组合物以及使用其的预浸料坯和层压板以及印刷电路板，所述硅树脂组合物以固体重量份包含以下组分：50-90份有机硅树脂，20-80份乙烯基封端的硅油，0.1-5份粘度增强剂，0-60份填料，0.0001-0.5份催化剂和0.00001-0.1份抑制剂，摩尔交联剂中的Si-H与有机硅树脂中的Si-Vi之比为1.0-1.7。树脂组合物的树脂体是热固性硅树脂，由此制备的层压板具有良好的耐热性和阻燃性以及极低的介电常数（Dk）和介电损耗（Df）。

5. 发明公开

EP3239244A1 ORGANIC SILICONE RESIN COMPOSITION AND PRE-PREG, LAMINATE, COPPER-CLAD LAMINATE, AND ALUMINUM SUBSTRATE THAT USE THE COMPOSITION 有权
标题翻译：有机硅树脂组合物和使用该组合物的预浸渍，层压，铜层合层合物和铝基底
公开(公告)号：EP3239244A1
公开(公告)日：2017-11-01
申请号：EP15871611.8
申请日：2015-06-01
申请人： Shengyi Technology Co. Ltd.
发明人： YE, Suwen , TANG, Guofang
IPC分类号： C08L83/04 , C08K5/098 , C08K3/36 , B32B27/04
CPC分类号： C08L83/06 , B32B27/04 , B32B38/08 , B32B2307/304 , B32B2307/3065 , C08G77/08 , C08G77/16 , C08G77/18 , C08G77/80 , C08J5/24 , C08K3/013 , C08K3/36 , C08K5/098 , C08L83/04 , C09D183/06 , H05K1/036 , H05K1/0373 , H05K2201/0162 , H05K2201/0358 , H05K2201/068 , C08K5/5415
摘要： The present invention relates to an organic silicone resin composition and a prepreg, a laminate, and an aluminum substrate that use the composition. The organic silicone resin composition comprises in terms of parts by weight: 100 parts of a condensation-type silicone resin, 0.0001-2 parts of a catalyst, and 0.001-10 parts of an additive. The organic silicone resin composition has the advantages of high heat resistance, halogen-free and phosphorus-free flame retardancy, improved peel strength with copper foil, and low coefficient of expansion, and is applicable in manufaturing the pre-preg, the laminate, and the aluminum substrate for used in a high-performance printed circuit.
摘要翻译：有机硅树脂组合物和使用该组合物的预浸料坯，层叠体和铝基板技术领域本发明涉有机硅树脂组合物按重量份数包含：100份缩合型有机硅树脂，0.0001-2份催化剂和0.001-10份添加剂。有机硅树脂组合物具有高耐热性，无卤素和无磷阻燃性，与铜箔的剥离强度提高和低膨胀系数的优点，并且可用于制造预浸料，层压板和用于高性能印刷电路的铝基板。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式