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1. 发明公开

EP3406115A1 COATED ELECTRICAL ASSEMBLY 审中-公开
公开(公告)号：EP3406115A1
公开(公告)日：2018-11-28
申请号：EP17701569.0
申请日：2017-01-19
申请人： Semblant Limited
发明人： SINGH, Shailendra Vikram , ARESTA, Gianfranco , BROOKS, Andrew Simon Hall , HENNIGHAN, Gareth
IPC分类号： H05K3/28 , B05D1/00
CPC分类号： H05K3/285 , B05D1/62 , B05D5/08 , H05K3/282 , H05K3/284 , H05K2201/0162 , H05K2201/09872 , H05K2203/086 , H05K2203/087 , H05K2203/095 , H05K2203/122 , H05K2203/1322
摘要： An electrical assembly which has a multi-layer conformal coating comprising three or more layers on at least one surface of the electrical assembly, wherein the lowest layer of the multi-layer conformal coating, which is in contact with the at least one surface of the electrical assembly, is obtainable by plasma deposition of a precursor mixture comprising (a) one or more organosilicon compounds, (b) optionally O2, N2O, NO2, H2, NH3 and/or N2, and (c) optionally He, Ar and/or Kr; the uppermost layer of the multi-layer conformal coating is obtainable by plasma deposition of a precursor mixture comprising (a) one or more organosilicon compounds, (b) optionally O2, N2O, NO2, H2, NH3 and/or N2, and (c) optionally He, Ar and/or Kr; and the multilayer coating comprises one or more layers which is obtainable by plasma deposition of a precursor mixture comprising (a) one or more hydrocarbon compounds of formula (A), (b) optionally NH3, N2O, N2, NO2, CH4, C2H6, C3H6 and/or C3H8, and (c) optionally He, Ar and/or Kr, Z1 represents C1-C3 alkyl or C2-C3 alkenyl; Z2 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; Z3 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; Z4 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; Z5 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; and Z6 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl.

2. 发明公开

EP3177127A3 HEAT DISSIPATION OVER REAR FRAME OF A DISPLAY 审中-公开
标题翻译：在显示器的后部框架上散热
公开(公告)号：EP3177127A3
公开(公告)日：2017-06-21
申请号：EP17151425.0
申请日：2012-10-11
申请人： Funai Electric Co., Ltd.
发明人： Yokawa, Akira , Kita, Yuki , Fujikawa, Akihiro , Fukumoto, Yasuyuki , Mori, Yasuhiro , Suzuki, Yuto , Horiuchi, Hirofumi , Tsuji, Hirohiko , Yamanaka, Takahito , Yonezawa, Hideo
IPC分类号： H05K7/20 , G02B6/00 , H05K1/02 , G02F1/13357 , G02F1/1333 , G06F1/16 , F21V8/00 , G06F1/20
CPC分类号： G02B6/0088 , G02B6/0068 , G02B6/0073 , G02B6/0085 , G02F1/133615 , G02F2001/133314 , G02F2001/133317 , G02F2001/133328 , G02F2001/133628 , G06F1/20 , H05K1/0209 , H05K7/20963 , H05K2201/0162 , H05K2201/09909
摘要： A display comprising: a display portion (2); a light guide member (12); a light source (6a, 6b, 6c) positioned near an end portion of said light guide member; a housing (4) positioned at a side of a surface of said light guide member; and a first heat radiation member (10) positioned between said light guide member and said housing and contacting with said light source ; wherein said first heat radiation member includes a first contacting portion contacting with a first portion of said surface near said end portion of said light guide member, a second contacting portion contacting with a second portion of said surface apart from said first portion and a third contacting portion (10c) positioned between said first contacting portion and said second contacting portion and contacting with said housing, a recess portion is arranged between said third contacting portion and said surface.
摘要翻译：一种显示器，包括：显示部分（2）;显示部分导光构件（12）; 位于所述导光部件的端部附近的光源（6a，6b，6c）位于所述导光构件的表面侧的壳体（4）和位于所述导光构件和所述壳体之间并与所述光源接触的第一热辐射构件（10）其中所述第一热辐射构件包括第一接触部分和第二接触部分，所述第一接触部分与靠近所述光导部件的所述端部的所述表面的第一部分接触，所述第二接触部分与所述表面的远离所述第一部分的第二部分接触，位于所述第一接触部与所述第二接触部之间且与所述壳体接触的部分（10c），所述第三接触部与所述表面之间设置有凹部。

3. 发明公开

EP3123842A1 HAFTFESTE SCHICHT AUF KERAMIK UND/ODER LÖTSTOPPLACK ALS SCHUTZLACK ODER VERGUSSMASSE 审中-公开
标题翻译： HAFTFESTE SCHICHT AUF KERAMIK UND / ODERLÖTSTOPPLACKALS SCHUTZLACK ODER VERGUSSMASSE
公开(公告)号：EP3123842A1
公开(公告)日：2017-02-01
申请号：EP15712613.7
申请日：2015-03-26
申请人： CeramTec GmbH
发明人： HEINRICH, Marco , GSCHWÄNDLER, Anton , HÄRTL, Katharina
IPC分类号： H05K1/03 , H01L33/00 , H05K3/00 , H05K3/28 , H05K3/34
CPC分类号： H05K3/285 , H01L25/167 , H01L33/52 , H01L2924/0002 , H01L2933/005 , H05K1/0306 , H05K3/284 , H05K2201/0162 , H05K2201/10106 , H05K2203/0759 , H01L2924/00
摘要： The present invention relates to a securely adhering layer on ceramic and/or soldering resist which comprises a potting compound or a protective lacquer. The potting compound or the protective lacquer in this case is a plastics-based compound. In addition, the present invention relates to a method for producing such a securely adhering layer, in which method i) a ceramic substrate is roughened in an etching bath, ii) the ceramic substrate thus roughened is metallized by means of a metal paste, iii) the ceramic carrier thus metallized is processed to form a small ceramic chip with a housed LED or to form an open LED chip, iv) the housed LED or the open LED chip is connected to further electronic components on the metallized ceramic carrier, and v) a potting compound or a protective lacquer, which is a plastics-based compound, is applied to the carrier ceramic thus populated. Finally, the present invention also relates to a structural part having such a securely adhering layer.
摘要翻译：本发明涉及一种在陶瓷和/或耐焊接剂上的可靠粘合层，其包括灌封化合物或保护漆。在这种情况下，灌封化合物或保护漆是塑料基化合物。另外，本发明涉及一种制造这种可靠的粘合层的方法，其中i）陶瓷衬底在蚀刻槽中粗糙化，ii）由此粗糙化的陶瓷衬底通过金属膏金属化，iii ）将如此金属化的陶瓷载体加工成具有容纳LED的小型陶瓷芯片或形成开放的LED芯片，iv）将所容纳的LED或开放式LED芯片连接到金属化陶瓷载体上的其他电子部件，v ）将作为塑料基化合物的灌封化合物或保护漆施加到如此填充的载体陶瓷上。最后，本发明还涉及具有这种可靠粘接层的结构部件。

4. 发明公开

EP2927278A4 RESIN COMPOSITION, PREPREG, LAMINATED PLATE, METAL FOIL-CLAD LAMINATED PLATE, AND PRINTED CIRCUIT BOARD 审中-公开
标题翻译：树脂组合物，预浸料，层合板，金属膜复合层合板和电路板的
公开(公告)号：EP2927278A4
公开(公告)日：2016-08-31
申请号：EP13857760
申请日：2013-11-27
申请人： MITSUBISHI GAS CHEMICAL CO
发明人： CHIBA TOMO , TAKAHASHI HIROSHI , SHIGA EISUKE , KATO YOSHIHIRO
IPC分类号： C08L63/00 , B32B15/092 , B32B15/14 , B32B15/20 , C08F283/12 , C08G73/06 , C08J5/24 , C08K3/00 , C08K5/315 , C08K5/3415 , C08K5/3445 , C08L51/08 , C08L55/00 , C08L61/04 , C08L61/06 , C08L79/08 , H05K1/03
CPC分类号： H05K1/0353 , B32B15/14 , B32B15/20 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2264/102 , B32B2307/202 , B32B2307/206 , B32B2307/3065 , B32B2307/714 , B32B2457/08 , C08F283/124 , C08G59/245 , C08G59/3218 , C08G73/0655 , C08J5/24 , C08J2363/00 , C08J2463/04 , C08J2479/00 , C08J2483/07 , C08K3/36 , C08K5/315 , C08L51/085 , C08L61/06 , C08L63/00 , C08L79/04 , C08L79/085 , C08L2203/20 , C08L2205/035 , H05K1/0366 , H05K1/0373 , H05K1/056 , H05K2201/012 , H05K2201/0162 , H05K2201/0209 , Y10T428/24802 , Y10T428/249921 , Y10T428/2962 , Y10T442/2951 , C08F220/10
摘要： An object of the present invention is to provide a resin composition that has a variety of properties required for a material for printed circuit boards such as high flame retardancy, and can attain a cured product having high moldability, high resistance against chemicals in a desmearing step, and a small coefficient of thermal expansion, a prepreg comprising the resin composition, a laminate including the prepreg, a metallic foil clad laminate including the prepreg, and a printed circuit board including the prepreg. A resin composition comprising an acrylic-silicone copolymer (A), a halogen-free epoxy resin (B), a cyanic acid ester compound (C) and/or a phenol resin (D), and an inorganic filler (E).

5. 发明公开

EP3046402A1 ADHESIVE COMPOSITION FOR PRINTED WIRING BOARDS, BONDING FILM, COVERLAY, COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD 审中-公开
标题翻译：粘接材料组合物用于组装的印刷电路板，KLEBEFOLIE，覆盖层覆铜层压板和组装的PCB
公开(公告)号：EP3046402A1
公开(公告)日：2016-07-20
申请号：EP14843692.6
申请日：2014-09-08
申请人： Sumitomo Electric Industries, Ltd. , Sumitomo Electric Printed Circuits, Inc.
发明人： YONEZAWA, Takayuki , KAIMORI, Shingo , SUGAWARA, Jun , ASAI, Shogo , UCHITA, Yoshifumi , KAKIMOTO, Masaya
IPC分类号： H05K3/28 , B32B15/08 , B32B27/00 , C09J7/00 , C09J7/02 , C09J179/08
CPC分类号： H05K1/056 , B32B7/12 , B32B15/08 , B32B15/20 , B32B27/20 , B32B27/281 , B32B27/38 , B32B2264/10 , B32B2307/202 , B32B2307/306 , B32B2307/7265 , B32B2457/08 , C08G73/1042 , C08G73/105 , C08G73/106 , C08G73/1082 , C08G77/455 , C08K3/34 , C08L63/00 , C09J7/10 , C09J179/08 , C09J183/10 , C09J2463/00 , C09J2479/08 , H05K3/386 , H05K3/4673 , H05K2201/0154 , H05K2201/0162 , C08L79/08
摘要： An object of the present invention is to provide an adhesive composition for a printed wiring board, the adhesive composition having a good heat resistance. Another object of the present invention is to provide a coverlay for a printed wiring board, a copper-clad laminate, and a printed wiring board, all of which use the adhesive composition for a printed wiring board. The present invention provides an adhesive composition for a printed wiring board, the adhesive composition containing a siloxane-modified polyimide that includes structural units represented by formulae (1) and (2) below, an epoxy resin, and an inorganic filler. The siloxane-modified polyimide has a weight-average molecular weight (Mw) of 25,000 or more and 150,000 or less. A content of the inorganic filler is 10 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass of the siloxane-modified polyimide. In formulae (1) and (2), Ar represents a tetravalent aromatic tetracarboxylic acid residue, m is 0.35 or more and 0.75 or less, and n is 0.25 or more and 0.65 or less. R 1 in formula (1) represents a divalent diamine siloxane residue, and R 2 in formula (2) represents a divalent aromatic diamine residue.
摘要翻译：本发明的一个目的是提供一种粘合剂组合物的印刷电路板中，具有良好的耐热性的粘合剂组合物。本发明的另一个目的是提供一种用于印刷电路板，覆铜层压板及印刷布线板中，所有这些都使用该粘合剂组合物的印刷电路板提供一个覆盖层。对本发明的粘合剂组合物提供的印刷电路板，粘合剂组合物含有硅氧烷改性的聚酰亚胺确实包括由（1）和（2）下面，环氧树脂和无机填料表示的结构单元式餐饮。该硅氧烷改性的聚酰亚胺具有25000以上且150,000以下的重均分子量（Mw）。无机填料的含量为10质量份以上100质量份，相对于100份以下的硅氧烷改性的聚酰亚胺的质量。在式（1）和（2）中，Ar darstellt四价芳香族四羧酸残基，m为0时35以上且0.75以下，并且n为12时25分以上且0.65以下。的R 1在式（1）表示的二价硅氧烷二胺残基，R 2在式（2）表示二价的芳香族二胺残基。

6. 发明公开

EP2910587A4 RESIN COMPOSITION, PRE-PREG, LAMINATE, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD 审中-公开
标题翻译：树脂组合物，预浸料，层压板，金属膜覆铜箔层压板和线路板
公开(公告)号：EP2910587A4
公开(公告)日：2016-06-22
申请号：EP13847148
申请日：2013-10-18
申请人： MITSUBISHI GAS CHEMICAL CO
发明人： CHIBA TOMO , TAKAHASHI HIROSHI , SHIGA EISUKE , OGASHIWA TAKAAKI
IPC分类号： C08G59/20 , B32B15/08 , C08J5/24 , C08K3/00 , C08L63/00 , H05K1/03
CPC分类号： C08L73/00 , B32B5/26 , B32B15/14 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2307/306 , B32B2307/3065 , B32B2457/08 , C08G59/24 , C08G59/4246 , C08G59/621 , C08G77/18 , C08G77/52 , C08J5/24 , C08J2363/00 , C08J2373/00 , C08J2383/06 , C08J2463/00 , C08J2473/00 , C08K3/34 , C08K3/36 , C08L63/00 , C08L63/06 , C08L83/06 , C08L83/14 , C08L2201/02 , C08L2203/206 , C08L2205/025 , H05K1/0353 , H05K2201/012 , H05K2201/0162 , H05K2201/0209 , H05K2201/0275 , H05K2201/029
摘要： An object of the present invention is to provide a resin composition that can attain cured products having high flame retardancy, high heat resistance, a small coefficient of thermal expansion, and high drilling processability, a prepreg having the resin composition, a laminate and a metal foil clad laminate having the prepreg, and a printed circuit board having the resin composition. A resin composition, having at least an epoxy silicone resin (A) prepared by reacting a linear polysiloxane (a) having a carboxyl group with a cyclic epoxy compound (b) having an epoxy group such that the epoxy group of the cyclic epoxy compound (b) is 2 to 10 equivalents based on the carboxyl group of the linear polysiloxane (a), a cyanic acid ester compound (B) and/or a phenol resin (C), and an inorganic filler (D).

7. 发明授权

EP2281316B1 OPTOELEKTRONISCHES HALBLEITERBAUTEIL 有权
标题翻译：光电半导体器件
公开(公告)号：EP2281316B1
公开(公告)日：2015-06-10
申请号：EP09753512.4
申请日：2009-04-20
申请人： OSRAM Opto Semiconductors GmbH , Shin-Etsu Chemical Co., Ltd.
发明人： JÄGER, Harald , SORG, Jörg, Erich , KASHIWAGI, Tsutomu , SHIOBARA, Toshio
IPC分类号： H01L33/48 , H05K1/03
CPC分类号： H01L33/483 , H01L2224/48091 , H01L2924/12044 , H01L2924/181 , H05K1/0366 , H05K2201/0162 , H01L2924/00014 , H01L2924/00 , H01L2924/00012

8. 发明公开

EP2531010A3 Light-emitting device and luminaire 审中-公开
标题翻译：一种发光器件和光
公开(公告)号：EP2531010A3
公开(公告)日：2014-11-26
申请号：EP12158298.5
申请日：2012-03-06
申请人： Toshiba Lighting & Technology Corporation
发明人： Uemura, Kozo , Shibusawa, Soichi , Hayashida, Yumiko , Nishimura, Kiyoshi , Kawashima, Seiko , Oyaizu, Tsuyoshi , Ogata, Masahiro , Matsuda, Shuhei , Tamai, Hiroki
IPC分类号： H05K3/28 , H01L33/56 , H01L33/60
CPC分类号： H05K3/284 , F21S8/04 , F21V19/0055 , F21Y2115/10 , H01L25/0753 , H01L33/56 , H01L33/60 , H01L2224/48091 , H01L2224/73265 , H05K1/0209 , H05K3/244 , H05K2201/0162 , H05K2201/099 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014 , H01L2924/00
摘要： According to one embodiment, a light-emitting device (1) includes a substrate (10), a reflecting layer (18) formed on the substrate, a light-emitting element (11) placed on the reflecting layer, and a sealing resin layer (12) that covers the reflecting layer and the light-emitting element. The oxygen permeability of the sealing resin layer is equal to or lower than 1200 cm 3 /(m 2 ·day·atm), and the ratio of the area of the reflecting layer covered by the sealing resin layer to the entire area on the resin substrate covered by the sealing resin layer is between 30% and 75% inclusive.

9. 发明公开

EP2614694A1 BESCHICHTUNGSVERFAHREN FÜR EIN OPTOELEKTRONISCHES CHIP-ON-BOARD-MODUL 审中-公开
标题翻译： BESCHICHTUNGSVERFAHRENFÜREIN OPTOELEKTRONISCHES CHIP-ON-BOARD-MODUL
公开(公告)号：EP2614694A1
公开(公告)日：2013-07-17
申请号：EP11763584.7
申请日：2011-08-29
申请人： Heraeus Noblelight GmbH
发明人： PEIL, Michael , OSWALD, Florin , MAIWEG, Harald
IPC分类号： H05K3/28 , B29C41/00 , H01L23/31 , H01L25/075 , H01L27/00 , H01L33/56 , F21K99/00
CPC分类号： H01L31/0203 , F21K9/00 , F21K9/90 , F21Y2115/10 , H01L21/56 , H01L23/3121 , H01L25/0753 , H01L25/13 , H01L31/02322 , H01L31/02325 , H01L33/507 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L2924/0002 , H01L2924/1815 , H01L2933/005 , H05K3/284 , H05K2201/0108 , H05K2201/0162 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151 , H05K2203/1316 , H01L2924/00
摘要： The invention relates to a method for coating an optoelectronic chip-on-board module (1, 11-11'''). The optoelectronic chip-on-board module (1, 11-11''') comprises a flat support (2, 2') fitted with one or several optoelectronic components (4). The optoelectronic chip-on-board module (1, 11-11''') can have in particular at least one optics (23) which can encompass at least a primary optics (24) and, optionally, at least a secondary optics (25). In the method, the optoelectronic chip-on-board module (1, 11-11''') is coated with a transparent, UV- and temperature-resistant coating (12) made of a silicone. The method is characterized by the following method steps: a) casting a liquid silicone (21, 22) into a mould (20) which is open at the top and has external dimensions which correspond to or exceed the external dimensions of the support (2, 2'), b) introducing the support (2, 2') into the mould (20), wherein the optoelectronic component (4) or the optoelectronic components (4) are completely immersed in the silicone (21) and a surface of the support (2, 2') comes into contact with the entire surface of the silicone (21), or the support (2, 2') is at least partially immersed in the silicone (21), c) curing and cross-linking the silicone (21) with the optoelectronic components (4) and the support (2, 2'), and d) removing the support (2, 2') having the coating (12) from the cured silicone (21) from the mould (20).
摘要翻译：提出了一种用于涂覆光电芯片组件的方法，该光电芯片组件包括平坦的衬底，所述平坦衬底填充有一个或多个具有至少一个主要光学布置和可选的至少一个次级光学布置的光电子部件。通过以下步骤，通过以下步骤将由硅树脂制成的透明，耐紫外线和耐温涂层涂覆在光电芯片模块上：（a）将液体硅胶浇铸到朝向顶部打开的模具中，并具有相应的外部尺寸达到或超过衬底的外部尺寸; （b）将基板插入模具中，其中光电组件完全浸入硅树脂中，并且基板的表面完全接触硅树脂或基板至少部分地以完全表面接触的方式浸入硅树脂中; （c）固化和交联硅氧烷与光电子部件和基底; 和（d）用固化的硅氧烷涂层从模具中除去基材。

10. 发明公开

EP2230889A4 METHOD FOR PRODUCING WIRING BOARD AND WIRING BOARD 审中-公开
标题翻译：一种用于生产电路板和电路板的
公开(公告)号：EP2230889A4
公开(公告)日：2013-06-12
申请号：EP08792292
申请日：2008-08-07
申请人： AIN CO LTD
发明人： TAKEUCHI KOJI , MATSUDA MASAMI , ONO KAORU , HOSODA MAKOTO
IPC分类号： H05K1/05 , H01L23/12 , H01L23/36 , H01L33/00 , H05K1/02
CPC分类号： H05K1/056 , H01L2924/0002 , H05K1/0274 , H05K2201/0162 , H05K2201/0209 , H05K2201/0281 , H05K2201/10106 , H05K2201/2054 , Y10T428/24917 , Y10T428/249994 , Y10T428/25 , Y10T428/252 , Y10T428/254 , Y10T428/31663 , H01L2924/00
摘要： The present invention provides a wiring board giving good heat dissipation over a long period of use. The present invention also provides a method for producing a wiring board, including coating a surface of a metal substrate 2, which is made of an aluminium plate, with a composition 3 containing a substance having a polysiloxane structure and inorganic particles having insulating and heat-dissipating properties ( Fig. 1(B) ), curing the composition 3, then bonding a copper foil 4 to the cured composition 3A ( Fig. 1(C) ), and partially removing the copper foil 4, thereby forming a wiring layer 5 ( Fig. 1(D) ).

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