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1. 发明授权

EP3017468B1 COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAID COATED BOND WIRES 有权
公开(公告)号：EP3017468B1
公开(公告)日：2020-09-02
申请号：EP14734743.9
申请日：2014-07-02
申请人： Rosenberger Hochfrequenztechnik GmbH & Co. KG
发明人： CAHILL, Sean S. , SANJUAN, Eric A.
IPC分类号： H01L23/49 , H01L23/66 , H01L23/31 , H01L23/50 , H01L23/00

2. 发明公开

EP3017470A1 ELECTRONIC DEVICE HAVING A LEAD WITH SELECTIVELY MODIFIED ELECTRICAL PROPERTIES 有权
标题翻译： ELEKTRONISCHE VORRICHTUNG MIT LEITUNG MIT SELEKTIV MODIFIZIERTEN ELEKTRISCHEN EIGENSCHAFTEN
公开(公告)号：EP3017470A1
公开(公告)日：2016-05-11
申请号：EP14735474.0
申请日：2014-07-02
申请人： Rosenberger Hochfrequenztechnik GmbH & Co. KG
发明人： CAHILL, Sean S. , SANJUAN, Eric A.
IPC分类号： H01L23/49 , H01L23/50 , H01L23/66
CPC分类号： H01L23/49541 , H01L21/4821 , H01L21/4846 , H01L23/49506 , H01L23/49827 , H01L23/49838 , H01L23/50 , H01L23/64 , H01L23/645 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2223/6611 , H01L2224/45541 , H01L2224/4555 , H01L2224/4556 , H01L2224/45565 , H01L2224/4569 , H01L2224/48011 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4903 , H01L2224/49052 , H01L2224/85444 , H01L2224/8592 , H01L2224/8593 , H01L2224/85931 , H01L2224/85935 , H01L2224/85939 , H01L2224/85947 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/30111 , H01L2924/20654 , H01L2224/45099 , H01L2924/00
摘要： A die package having a plurality of connection pads, a die substrate supporting a plurality of connection elements, a first lead having a first metal core with a first core diameter, and a dielectric layer surrounding the first metal core, the dielectric layer having a first dielectric thickness that varies along its length and/or the dielectric layer having an outer metal layer at least partially surrounding the dielectric layer, for selectively modifying the electrical characteristics of the lead.
摘要翻译：具有多个连接焊盘的模具封装，支撑多个连接元件的管芯基板，具有第一芯直径的第一金属芯的第一引线和围绕第一金属芯的介电层，该介电层具有第一电介质厚度沿其长度变化和/或具有至少部分围绕电介质层的外部金属层的电介质层，用于选择性地修改引线的电特性。

3. 发明公开

EP3017468A1 COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAID COATED BOND WIRES 有权
标题翻译：包膜芯片封装和方法绑定WIRES生产涂敷这种结合WIRES
公开(公告)号：EP3017468A1
公开(公告)日：2016-05-11
申请号：EP14734743.9
申请日：2014-07-02
申请人： Rosenberger Hochfrequenztechnik GmbH & Co. KG
发明人： CAHILL, Sean S. , SANJUAN, Eric A.
IPC分类号： H01L23/49 , H01L23/66 , H01L23/31 , H01L23/50 , H01L23/00
摘要： A bond wire having a metal core, a dielectric layer, and a ground connectable metallization, wherein the bond wire has one or more vapor barrier coatings. Further, the present invention relates to a die package with at least one bond wire according to the invention.
摘要翻译：具有金属核，电介质层，和接地连接的金属化，worin焊线接合线具有一个或多个蒸汽阻隔涂层。此外，本发明涉及具有至少一个键合线gemäß到本发明的包装。

4. 发明授权

EP3017466B1 MIXED IMPEDANCE BOND WIRE CONNECTIONS AND METHOD OF MAKING THE SAME 有权
公开(公告)号：EP3017466B1
公开(公告)日：2020-05-13
申请号：EP14747513.1
申请日：2014-07-02
申请人： Rosenberger Hochfrequenztechnik GmbH & Co. KG
发明人： CAHILL, Sean S. , SANJUAN, Eric A.
IPC分类号： H01L23/40 , H01L23/66 , H01L23/50 , H01L23/00 , H01L23/495 , H01L23/498

5. 发明公开

EP3017466A1 MIXED IMPEDANCE BOND WIRE CONNECTIONS AND METHOD OF MAKING THE SAME 有权
标题翻译： BINDUNGSDRAHTVERBINDUNGEN MIT GEMISCHTER IMPEDANZ UND VERFAHREN ZUR HERSTELLUNG DAVON
公开(公告)号：EP3017466A1
公开(公告)日：2016-05-11
申请号：EP14747513.1
申请日：2014-07-02
申请人： Rosenberger Hochfrequenztechnik GmbH & Co. KG
发明人： CAHILL, Sean S. , SANJUAN, Eric A.
IPC分类号： H01L23/40 , H01L23/66 , H01L23/50
摘要： A die package having mixed impedance leads where a first lead has a first metal core, and a dielectric layer surrounding the first metal core, and a second lead has a second metal core, and a second dielectric layer surrounding the second metal core, with the dielectric thicknesses differing from each other. A method of making a die package having leads with different impedances formed by connecting the die package to the die substrate connection pads via a first wirebond having a first metal core, depositing a dielectric layer on the wirebond metal core, metalizing the dielectric layer, connecting the die package to the die substrate connection pads via a second wirebond having a second metal core, depositing a dielectric layer on the second wirebond second metal core, and metalizing the dielectric layer on the second metal core, such that the first wirebond has a different impedance than the second wire bond.
摘要翻译：一种具有混合阻抗导线的管芯封装，其中第一引线具有第一金属芯和围绕第一金属芯的电介质层，第二引线具有第二金属芯和围绕第二金属芯的第二电介质层，介电厚度彼此不同。一种制造具有不同阻抗的引线的管芯封装的方法，所述管芯封装具有通过经由具有第一金属芯的第一引线键将管芯封装连接到管芯衬底连接焊盘而形成的引线，在引线键合金属芯上沉积介电层，使电介质层金属化，连接通过具有第二金属芯的第二引线键将所述管芯封装到所述管芯衬底连接焊盘，在所述第二引线键合第二金属芯上沉积介电层，以及使所述第二金属芯上的所述电介质层金属化，使得所述第一引线键具有不同的阻抗比第二线接合。

6. 发明授权

EP3017470B1 ELECTRONIC DEVICE HAVING A LEAD WITH SELECTIVELY MODIFIED ELECTRICAL PROPERTIES AND METHOD OF MANUFACTURING THE SAME 有权
公开(公告)号：EP3017470B1
公开(公告)日：2018-10-24
申请号：EP14735474.0
申请日：2014-07-02
申请人： Rosenberger Hochfrequenztechnik GmbH & Co. KG
发明人： CAHILL, Sean S. , SANJUAN, Eric A.
IPC分类号： H01L21/60 , H01L23/49 , H01L23/66 , H01L23/50
CPC分类号： H01L23/49541 , H01L21/4821 , H01L21/4846 , H01L23/49506 , H01L23/49827 , H01L23/49838 , H01L23/50 , H01L23/64 , H01L23/645 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2223/6611 , H01L2224/45541 , H01L2224/4555 , H01L2224/4556 , H01L2224/45565 , H01L2224/4569 , H01L2224/48011 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4903 , H01L2224/49052 , H01L2224/85444 , H01L2224/8592 , H01L2224/8593 , H01L2224/85931 , H01L2224/85935 , H01L2224/85939 , H01L2224/85947 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/30111 , H01L2924/20654 , H01L2224/45099 , H01L2924/00
摘要： A die package having a plurality of connection pads, a die substrate supporting a plurality of connection elements, a first lead having a first metal core with a first core diameter, and a dielectric layer surrounding the first metal core, the dielectric layer having a first dielectric thickness that varies along its length and/or the dielectric layer having an outer metal layer at least partially surrounding the dielectric layer, for selectively modifying the electrical characteristics of the lead.

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