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    • 3. 发明公开
    • ELECTRONIC PAPER AND METHOD FOR PRODUCING SAME
    • ELEKTRONISCHES PAPIER UND HERSTELLUNGSVERFAHRENDAFÜR
    • EP2570847A1
    • 2013-03-20
    • EP11780341.1
    • 2011-04-14
    • Panasonic Corporation
    • HIRANO, KoichiNAKAGAWA, MasamiNAKATANI, Seiichi
    • G02F1/167G02F1/17G09F9/00G09F9/37G09F9/40
    • G09F9/372G02F1/167G02F2001/1676G02F2201/18G09F9/301G09F15/0075
    • Provided is an electronic paper that permits a high-quality, large area to be easily created. Also provided is a method for producing the electronic paper. The electronic paper comprises: a first substrate upon which first electrodes are formed and a second substrate upon which second electrodes are formed, said first substrate and second substrate disposed so as to face each other; and a plurality of cell spaces constituting pixels between said first substrate and second substrate. The first substrate comprises a plurality of first sheet members, each having a first electrode formed thereon. By disposing a cover substrate on said first sheet members, each with a partition wall therebetween, a plurality of subsheet formations comprising the plurality of cell spaces partitioned by the partition walls are formed, and the first electrodes are connected in between adjacent subsheet formations.
    • 提供了允许容易地创建高质量,大面积的电子纸。 还提供了一种用于生产电子纸的方法。 电子纸包括:形成有第一电极的第一基板和形成第二电极的第二基板,所述第一基板和第二基板彼此相对配置; 以及在所述第一基板和第二基板之间构成像素的多个单元空间。 第一基板包括多个第一片构件,每个第一片构件具有形成在其上的第一电极。 通过将覆盖基板设置在所述第一板状部件上,每个板状部件之间具有隔壁,形成由分隔壁隔开的多个电池单元的多个子片状结构,并且第一电极连接在相邻的子片层之间。
    • 4. 发明公开
    • FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
    • 灵活的HBABLEITERBAUELEMENT UND HERSTELLUNGSVERFAHRENDAFÜR
    • EP2312620A1
    • 2011-04-20
    • EP09804694.9
    • 2009-07-30
    • Panasonic Corporation
    • HIRANO, KoichiNAKATANI, SeiichiOGAWA, TatsuoICHIRYU, TakashiSAZUKI, Takeshi
    • H01L21/336H01L21/20H01L29/417H01L29/423H01L29/49H01L29/786
    • H01L29/78651H01L27/1218H01L27/124H01L27/1266H01L29/41733H01L29/42384H01L29/78603H01L29/7869
    • There is provided a method for manufacturing a flexible semiconductor device characterized by comprising (i) a step of forming an insulating film on the upper surface of metal foil, (ii) a step of forming an extraction electrode pattern on the upper surface of the metal foil, (iii) a step of forming a semiconductor layer on the insulating film in such a manner that the semiconductor layer is in contact with the extraction electrode pattern, (iv) a step of forming a sealing resin layer on the upper surface of the metal foil in such a manner that the sealing resin layer covers the semiconductor layer and the extraction electrode pattern, and (v) a step of forming electrodes by etching the metal foil, wherein the metal foil is used as a support for the insulating film, the extraction electrode pattern, the semiconductor layer, and the sealing resin layer formed in (i) to (iv) and used as a constituent material for the electrodes in (v). A TFT element can be fabricated by a simple process because the metal foil serving as the support need not be finally stripped off. Further, a high-temperature process can be introduced to the fabrication of the insulating film and the semiconductor layer because the metal foil is used as the support, whereby the TFT characteristic is improved.
    • 提供了一种制造柔性半导体器件的方法,其特征在于包括:(i)在金属箔的上表面上形成绝缘膜的步骤,(ii)在金属的上表面上形成引出电极图案的步骤 箔,(iii)以使得半导体层与引出电极图案接触的方式在绝缘膜上形成半导体层的步骤,(iv)在所述绝缘膜的上表面上形成密封树脂层的步骤 金属箔以密封树脂层覆盖半导体层和引出电极图案,以及(v)通过蚀刻金属箔形成电极的步骤,其中金属箔用作绝缘膜的支撑体, (i)至(iv)中形成的并用作(v)中的电极的构成材料的引出电极图案,半导体层和密封树脂层。 由于作为支撑体的金属箔不需要最终被剥离,所以可以通过简单的工艺制造TFT元件。 此外,由于使用金属箔作为支撑体,因此可以引入绝缘膜和半导体层的制造的高温处理,由此提高TFT特性。