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1. 发明授权

EP1118259B1 MONTAGEVORRICHTUNG 有权
公开(公告)号：EP1118259B1
公开(公告)日：2005-01-19
申请号：EP00953167.4
申请日：2000-08-11
申请人： Micromont Entwicklungs- und Handels GmbH , Osram Opto Semiconductors GmbH & Co. OHG
发明人： FERARIC, Johann , WAITL, Günter
IPC分类号： H05K13/04 , H01L21/00
CPC分类号： H01L21/67144 , H01L21/68 , H05K13/0452 , Y10T29/4913 , Y10T29/49139 , Y10T29/5313 , Y10T29/53178
摘要： The invention relates to an assembly device (10), especially a fully automatic assembly device for producing microsystem technical products and for assembling components in the semiconductor industries. Said assembly device comprises an assembly table (12), at least one material transport system (32) that transports the products to be placed with components, and at least one transport system (16) that is mounted on the assembly table (12). The device is further provided with a component transport unit (28) with at least one assembly head (30). Said component transport unit(s) (28) is/are mounted on one or more carrier system(s) (20) that is/are displaced in parallel to the direction of transport of the products to be placed with components which products are in turn displaced by the material transport system(s) (32). The material transport system (32) consists of at least two individual transport systems (34, 36, 38, 40, 42, 44) that run parallel. Every individual transport system (34, 36, 38, 40, 42, 44) is provided with separately controlled drive systems (46, 48, 50, 52, 54, 56). The assembly device (10) has at least one information memory for receiving and processing component-specific data of a multitude of components in a component reservoir (58) and of data with respect to their position within the component reservoir (58). The component transport unit(s) (28) and/or the assembly table (12) are controlled on the basis of these data.

2. 发明公开

EP1312124A1 OPTOELEKTRONISCHES BAUELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG, MODUL UND VORRICHTUNG MIT EINEM SOLCHEN MODUL 有权
标题翻译：光电子器件和方法ITS，模块和设备符合这样的模块
公开(公告)号：EP1312124A1
公开(公告)日：2003-05-21
申请号：EP01971630.7
申请日：2001-08-22
申请人： Osram Opto Semiconductors GmbH & Co. OHG
发明人： BOGNER, Georg , BRUNNER, Herbert , LEX, Wolfgang , WAITL, Günter
IPC分类号： H01L33/00 , H01L31/0203 , H01L25/13 , H01L25/16
CPC分类号： H01L33/486 , H01L25/13 , H01L25/167 , H01L2224/48091 , H01L2924/01055 , H01L2924/01068 , H01L2924/12041 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to an optoelectronic component comprising a semiconductor chip (1), which is mounted on a flexible chip support (6). Strip conductors (3, 5) for electrically connecting the semiconductor chip (1) are configured on a first primary surface of said support and the latter also accommodates a housing frame (7), which is filled with a radiation-permeable medium, in particular a filler compound. The invention also relates to a display device, an illumination or backlighting device and to a method for producing components according to the invention.

3. 发明公开

EP1179219A1 LED-MODUL FÜR SIGNALEINRICHTUNGEN 有权
标题翻译： LED-MODULFÜRSIGNALEINRICHTUNGEN
公开(公告)号：EP1179219A1
公开(公告)日：2002-02-13
申请号：EP00943604.9
申请日：2000-05-15
申请人： Osram Opto Semiconductors GmbH & Co. OHG
发明人： WAITL, Günter , BLÜMEL, Simon
IPC分类号： H01L33/00 , H01L25/075 , F21K7/00 , G08G1/095
CPC分类号： B61L5/1836 , B61L2207/02 , E01F9/559 , E01F9/582 , E01F9/594 , F21V5/007 , F21V5/04 , F21W2111/02 , F21W2111/06 , F21Y2115/10
摘要： The invention relates to an LED module having a regular array of LEDs (10), wherein each LED (10) is provided with a lens (20) and the LEDs (10) are mounted on a plate (1). An optics support plate (2) is provided that contains a regular arrangement of light bundling optical devices (20; 30) corresponding to the LED array. The light bundling optical devices can be lenses (20) or optical channels with reflecting side walls which are integrated into the optics support plate (2).
摘要翻译：本发明涉及具有LED阵列（10）的LED模块，其中每个LED（10）设置有透镜（20），并且LED（10）安装在板（1）上。提供光学支撑板（2），其包含对应于LED阵列的光束装置（20; 30）的规则排列。光束装置可以是透镜（20）或具有集成到光学支撑板（2）中的反射侧壁的光学通道。

4. 发明公开

EP1118259A1 MONTAGEVORRICHTUNG 有权
公开(公告)号：EP1118259A1
公开(公告)日：2001-07-25
申请号：EP00953167.4
申请日：2000-08-11
申请人： SiMoTec GmbH , Osram Opto Semiconductors GmbH & Co. OHG
发明人： FERARIC, Johann , WAITL, Günter
IPC分类号： H05K13/04 , H01L21/00
CPC分类号： H01L21/67144 , H01L21/68 , H05K13/0452 , Y10T29/4913 , Y10T29/49139 , Y10T29/5313 , Y10T29/53178
摘要： The invention relates to an assembly device (10), especially a fully automatic assembly device for producing microsystem technical products and for assembling components in the semiconductor industries. Said assembly device comprises an assembly table (12), at least one material transport system (32) that transports the products to be placed with components, and at least one transport system (16) that is mounted on the assembly table (12). The device is further provided with a component transport unit (28) with at least one assembly head (30). Said component transport unit(s) (28) is/are mounted on one or more carrier system(s) (20) that is/are displaced in parallel to the direction of transport of the products to be placed with components which products are in turn displaced by the material transport system(s) (32). The material transport system (32) consists of at least two individual transport systems (34, 36, 38, 40, 42, 44) that run parallel. Every individual transport system (34, 36, 38, 40, 42, 44) is provided with separately controlled drive systems (46, 48, 50, 52, 54, 56). The assembly device (10) has at least one information memory for receiving and processing component-specific data of a multitude of components in a component reservoir (58) and of data with respect to their position within the component reservoir (58). The component transport unit(s) (28) and/or the assembly table (12) are controlled on the basis of these data.
摘要翻译：本发明涉及一种组装装置（10），尤其是一种用于生产微系统技术产品和组装半导体工业中的部件的全自动组装装置。所述组装装置包括组装台（12），至少一个传送待放置组件的产品的物料传送系统（32）以及至少一个安装在组装台（12）上的传送系统（16）。该装置还设置有具有至少一个组装头部（30）的部件运输单元（28）。所述部件运输单元（28）安装在一个或多个载体系统（20）上，所述载体系统（20）平行于待放置产品的部件的产品的运输方向由物料输送系统（32）转向。物料输送系统（32）由至少两个平行延伸的单独输送系统（34,36,38,40,42,44）组成。每个单独的运输系统（34,36,38,40,42,44）设有单独控制的驱动系统（46,48,50,52,54,56）。组装设备（10）具有至少一个信息存储器，用于接收和处理部件储存器（58）中的多个部件的部件特定数据和关于其在部件储存器（58）内的位置的数据。根据这些数据控制部件运输单元（28）和/或组装台（12）。

5. 发明授权

EP1141623B1 LICHTQUELLENELEMENT MIT SEITLICHER SCHRÄGER LICHTEINKOPPLUNG 有权
标题翻译：具有侧CANT光耦合光源元件
公开(公告)号：EP1141623B1
公开(公告)日：2006-09-27
申请号：EP99966896.5
申请日：1999-12-29
申请人： Osram Opto Semiconductors GmbH & Co. OHG
发明人： BACHL, Bernhard , SCHELLHORN, Franz , KIRCHBERGER, Günter , WAITL, Günter , BRUNNER, Herbert
IPC分类号： F21V8/00
CPC分类号： G02B6/0018 , G02B6/00 , G02B6/0001 , G02B6/0043 , G02B6/0068 , G02B6/4298 , G02F1/133615 , G09F9/35
摘要： The invention relates to a light source element (10), which can be used for back-lighting liquid crystal displays and which comprises a slanted light exit surface (51A) and/or light entry surface (5B). The optical waveguide (1, 21, 31), on the surface thereof, is enclosed by reflectors (4, 24, 34) in which appropriate opening areas (5B, 25B, 35B) can be formed if needed. The invention makes an arrangement of a multitude of light sources (5, 25, 35, 45) and/or a direct viewing possible, thus attaining a corresponding increase in luminance. The invention also relates to a method for producing a light source element comprising an integrated reflector.

6. 发明公开

EP1095411A1 STRAHLUNGAUSSENDENDES UND/ODER -EMPFANGENDES BAUELEMENT 有权
标题翻译： STRAHLUNGAUSSENDENDES UND / ODER-EMPFANGENDES BAUELEMENT
公开(公告)号：EP1095411A1
公开(公告)日：2001-05-02
申请号：EP99942731.3
申请日：1999-06-30
申请人： Osram Opto Semiconductors GmbH & Co. OHG
发明人： WAITL, Günter , BRUNNER, Herbert
IPC分类号： H01L33/00 , H01L31/0203
CPC分类号： H01L33/486 , H01L24/45 , H01L31/0203 , H01L33/62 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/01019 , H01L2924/01058 , H01L2924/01079 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a component which can emit and/or receive radiation. A radiation-emitting and/or receiving optoelectronic chip (1) is fixed on a chip-supporting part (2) of an electrical lead frame (3) and partial areas of the chip-supporting part (2) and of external electrical connection parts (4, 5) are surrounded by a radiopaque base body (8). Said base body has a trough (9) in which the chip (1) is situated and which is filled with a transparent window part (10). According to the invention, the chip-supporting part (2) is completely surrounded by the radiopaque base body (8) up to the area (6) where the chip (1) is fixed and the external electrical connection parts (4, 5) are completely surrounded by the radiopaque base body (8) up to the areas (7) where one or more electrical connection leads (11) to the chip (1) are fixed.
摘要翻译：设置容纳半导体芯片的壳体。外壳和芯片可用于发送和/或接收辐射。壳体的普遍应用可以在发光二极管中。壳体包括被冲压成两个电隔离部分的导体条。壳体还包括从壳体的顶部向内延伸的腔体。导体部分包括暴露在空腔底部的相应区域。半导体芯片被接合到一个暴露区域，并且引线将芯片连接到第二暴露区域。导体部分也终止在暴露的电极中，这允许芯片与外部装置的电连接。在空腔中形成窗口，并且形成空腔的壳体的壁可以由反射材料制成。电极保持未曝光到窗口，但是对于芯片周围的任何残留区域以及第一和第二暴露区域内的接合线。通过使暴露于窗口的导体的面积最小化，窗口和导体的不同热膨胀引起的分层被最小化和/或消除。类似地，通过覆盖容纳窗口的空腔的基部的反射壳体，内部辐射反射增加超过用暴露导体实现的反射。

7. 发明公开

EP1328976A1 LED-MODUL 有权
标题翻译： LED模块
公开(公告)号：EP1328976A1
公开(公告)日：2003-07-23
申请号：EP01987949.3
申请日：2001-10-09
申请人： Osram Opto Semiconductors GmbH & Co. OHG
发明人： MARCHL, Werner , SPÄTH, Werner , WAITL, Günter
IPC分类号： H01L27/15 , H01L33/00
CPC分类号： H01L25/0753 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/01019 , H01L2924/01068 , H01L2924/12041 , Y10S362/80 , H01L2924/00012
摘要： The invention relates to an LED module (1), comprising a support (2), which contains a semiconductor layer (5) and which has an even main surface on which a plurality of LED semiconductor bodies (11) are mounted. The LED semiconductor bodies (11) that are used preferably emit light of different central wavelengths during operation, so that the LED module (1) is suitable for producing mixed colour light and especially for producing white light.

8. 发明公开

EP1216266A1 TRANSPARENTE GIESSHARZMASSE FÜR SMT-FÄHIGE LED-ANWENDUNGEN MIT HOHER TEMPERATUR UND HOHEN HELLIGKEITEN ODER LEUCHTSTÄRKEN 有权
标题翻译：透明浇注树脂对具有高的高温亮度或LIGHT SELLING SMT-ENABLED LED应用
公开(公告)号：EP1216266A1
公开(公告)日：2002-06-26
申请号：EP00963869.3
申请日：2000-08-04
申请人： Osram Opto Semiconductors GmbH & Co. OHG
发明人： HÖHN, Klaus , WAITL, Günter , ARNDT, Karlheinz
IPC分类号： C08G59/42 , C08G59/38 , C08L63/04 , H01L33/00
CPC分类号： C08G59/38 , C08G59/42 , H01L23/293 , H01L33/56 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： The invention relates to a cast resin material which can be used as a material for assembling and encapsulating electronic and optoelectronic parts, modules and components. The inventive resin material can be used to cast optoelectronic parts made from epoxy compounds which are acid-anhydride curable, especially bisphenol-A-diglycidylether, and is characterized in that it contains poly-functional epoxynovolac resins, especially one epoxycresolnovalac. Said cast resin material exhibits a significantly higher glass transition temperature, is suitable for mass production processes, is not harmful to health and yields SMT-enabled products which can be used in car production.

9. 发明公开

EP1116419A1 LEUCHTSTOFFANORDNUNG WELLENLÄNGENKONVERTIERENDE VERGUSSMASSE UND LICHTQUELLE 有权
标题翻译：荧光安排波长铸造及光源
公开(公告)号：EP1116419A1
公开(公告)日：2001-07-18
申请号：EP00960304.4
申请日：2000-07-24
申请人： Osram Opto Semiconductors GmbH & Co. OHG , Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH
发明人： DEBRAY, Alexandra , WAITL, Günter , KUMMER, Franz , ZWASCHKA, Franz , ELLENS, Andries
IPC分类号： H05B33/14 , H01L33/00 , C09K11/80 , C09K11/78
CPC分类号： H01L33/502 , C09K11/7769 , C09K11/7774 , H01L33/504 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H05B33/14 , H01L2924/00014 , H01L2924/00012
摘要： The invention relates to a luminescent array that is excited by a radiation source using a luminescent material having a Ce activated garnet structure A3B5O12, whereby the first component A contains at least one element consisting of a Y, Lu, Sc, La, Gd, Sm and Tb group and the second component B represents at least one of elements Al, Ga or In and whereby several luminescent materials are mixed. The invention also relates to a corresponding wavelength converting sealing material and a corresponding light source array.

10. 发明公开

EP1042819A1 VERFAHREN ZUR HERSTELLUNG EINES OBERFLÄCHENMONTIERBAREN OPTOELEKTRONISCHEN BAUELEMENTES UND OBERFLÄCHENMONTIERBARES OPTOELEKTRONISCHES BAUELEMENT 有权
标题翻译：用于生产表面安装的光电器件和表面安装的光电器件
公开(公告)号：EP1042819A1
公开(公告)日：2000-10-11
申请号：EP98965124.5
申请日：1998-12-15
申请人： Osram Opto Semiconductors GmbH & Co. oHG
发明人： WAITL, Günter , LUTZ, Robert , BRUNNER, Herbert
IPC分类号： H01L33/00 , H01L31/0203
CPC分类号： H01L33/486 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L2224/48247 , H01L2224/48091 , H01L2924/00014
摘要： The invention relates to a method for producing a surface-mounted optoelectronic component. Said method consists of the following steps: preparation of a base element with the optoelectronic transmitter and/or receiver arranged in a recess of said base element, filling of the recess of the basic element with a transparent, hardening filling material, and application of the optical device onto the base element, whereby the optical device enters into contact with the filling material.
摘要翻译：一种用于制造表面安装的光电子器件包括以下步骤的方法：准备好一基体，在基体的凹部设置在所述光电发送器和/或接收器，填充所述基体的凹部有透明，固化的铸造化合物，以及将所述光学装置到基体上，从而使光学装置开始与铸化合物接触。

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