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1. 发明公开

EP1141623A1 LICHTQUELLENELEMENT MIT SEITLICHER SCHRÄGER LICHTEINKOPPLUNG 有权
标题翻译：具有侧CANT光耦合光源元件
公开(公告)号：EP1141623A1
公开(公告)日：2001-10-10
申请号：EP99966896.5
申请日：1999-12-29
申请人： Osram Opto Semiconductors GmbH & Co. OHG
发明人： BACHL, Bernhard , SCHELLHORN, Franz , KIRCHBERGER, Günter , WAITL, Günter , BRUNNER, Herbert
IPC分类号： F21V8/00
CPC分类号： G02B6/0018 , G02B6/00 , G02B6/0001 , G02B6/0043 , G02B6/0068 , G02B6/4298 , G02F1/133615 , G09F9/35
摘要： The invention relates to a light source element (10), which can be used for back-lighting liquid crystal displays and which comprises a slanted light exit surface (51A) and/or light entry surface (5B). The optical waveguide (1, 21, 31), on the surface thereof, is enclosed by reflectors (4, 24, 34) in which appropriate opening areas (5B, 25B, 35B) can be formed if needed. The invention makes an arrangement of a multitude of light sources (5, 25, 35, 45) and/or a direct viewing possible, thus attaining a corresponding increase in luminance. The invention also relates to a method for producing a light source element comprising an integrated reflector.

2. 发明授权

EP0839400B1 HALBLEITERLASERCHIP UND INFRAROT-EMITTER-BAUELEMENT 失效
标题翻译：半导体激光器芯片和红外线发射器组件
公开(公告)号：EP0839400B1
公开(公告)日：2003-06-04
申请号：EP96923857.5
申请日：1996-07-16
申请人： Osram Opto Semiconductors GmbH & Co. OHG
发明人： BOGNER, Georg , BRUNNER, Herbert , HAAS, Heinz , LUFT, Johann , NIRSCHL, Ernst , SPAETH, Werner , STATH, Norbert , TEICH, Wolfgang
IPC分类号： H01S5/02 , H01S5/32
CPC分类号： H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2933/0091 , H01S5/02228 , H01S5/02244 , H01S5/02292 , H01S5/0425 , H01S5/3428 , H01L2924/00014
摘要： The invention relates to an infrared emitter component with a commercial light-emitting diode (LED) package (11) which has two electrode terminals (13, 14), one of which has a well-shaped reflector (12), and which has an optically transparent, electrically nonconductive encapsulating material (16). The invention provides that a semiconductor laser chip (1) is mounted in the well-shaped reflector (12) of the LED package. The semiconductor laser chip (1) has a quantum-well structure, especially with a strained-layer structure, for example MOVPE epitaxial layers with the layer sequence GaAlAs-InGaAs-GaAlAs. The optically transparent, electrically nonconductive material (16) of the LED package (11) may incorporate a diffuser material (17) which in terms of type and concentration is structured and introduced so as to produce, in conjunction with the semiconductor laser chip (1) encapsulated in the LED package (11), a radiation characteristic or an enlargement of the effective emission surface that is comparable to that of a commercial infrared LED.

3. 发明公开

EP1042819A1 VERFAHREN ZUR HERSTELLUNG EINES OBERFLÄCHENMONTIERBAREN OPTOELEKTRONISCHEN BAUELEMENTES UND OBERFLÄCHENMONTIERBARES OPTOELEKTRONISCHES BAUELEMENT 有权
标题翻译：用于生产表面安装的光电器件和表面安装的光电器件
公开(公告)号：EP1042819A1
公开(公告)日：2000-10-11
申请号：EP98965124.5
申请日：1998-12-15
申请人： Osram Opto Semiconductors GmbH & Co. oHG
发明人： WAITL, Günter , LUTZ, Robert , BRUNNER, Herbert
IPC分类号： H01L33/00 , H01L31/0203
CPC分类号： H01L33/486 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L2224/48247 , H01L2224/48091 , H01L2924/00014
摘要： The invention relates to a method for producing a surface-mounted optoelectronic component. Said method consists of the following steps: preparation of a base element with the optoelectronic transmitter and/or receiver arranged in a recess of said base element, filling of the recess of the basic element with a transparent, hardening filling material, and application of the optical device onto the base element, whereby the optical device enters into contact with the filling material.
摘要翻译：一种用于制造表面安装的光电子器件包括以下步骤的方法：准备好一基体，在基体的凹部设置在所述光电发送器和/或接收器，填充所述基体的凹部有透明，固化的铸造化合物，以及将所述光学装置到基体上，从而使光学装置开始与铸化合物接触。

4. 发明授权

EP1141623B1 LICHTQUELLENELEMENT MIT SEITLICHER SCHRÄGER LICHTEINKOPPLUNG 有权
标题翻译：具有侧CANT光耦合光源元件
公开(公告)号：EP1141623B1
公开(公告)日：2006-09-27
申请号：EP99966896.5
申请日：1999-12-29
申请人： Osram Opto Semiconductors GmbH & Co. OHG
发明人： BACHL, Bernhard , SCHELLHORN, Franz , KIRCHBERGER, Günter , WAITL, Günter , BRUNNER, Herbert
IPC分类号： F21V8/00
CPC分类号： G02B6/0018 , G02B6/00 , G02B6/0001 , G02B6/0043 , G02B6/0068 , G02B6/4298 , G02F1/133615 , G09F9/35
摘要： The invention relates to a light source element (10), which can be used for back-lighting liquid crystal displays and which comprises a slanted light exit surface (51A) and/or light entry surface (5B). The optical waveguide (1, 21, 31), on the surface thereof, is enclosed by reflectors (4, 24, 34) in which appropriate opening areas (5B, 25B, 35B) can be formed if needed. The invention makes an arrangement of a multitude of light sources (5, 25, 35, 45) and/or a direct viewing possible, thus attaining a corresponding increase in luminance. The invention also relates to a method for producing a light source element comprising an integrated reflector.

5. 发明授权

EP0852816B1 OPTOELEKTRONISCHES HALBLEITER-BAUELEMENT 失效
标题翻译：光电半导体器件
公开(公告)号：EP0852816B1
公开(公告)日：2002-06-19
申请号：EP96942999.2
申请日：1996-09-13
申请人： Osram Opto Semiconductors GmbH & Co. OHG
发明人： ARNDT, Karlheinz , BRUNNER, Herbert , SCHELLHORN, Franz , WAITL, Günther
IPC分类号： H01L31/0232 , H01L33/00
CPC分类号： H01L33/486 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/024 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： In a radiation-emitting and/or receiving semiconductor component, a radiation-emitting and/or receiving semiconductor chip (1) is secured on a chip carrier (2) in a conductor frame. The chip carrier (2) forms a trough (4) in the area in which the semiconductor chip (1) is secured. The inner surface (5) of the trough (4) is designed to form a reflector for the radiation emitted and/or received by the semiconductor chip (1).

6. 发明公开

EP1095411A1 STRAHLUNGAUSSENDENDES UND/ODER -EMPFANGENDES BAUELEMENT 有权
标题翻译： STRAHLUNGAUSSENDENDES UND / ODER-EMPFANGENDES BAUELEMENT
公开(公告)号：EP1095411A1
公开(公告)日：2001-05-02
申请号：EP99942731.3
申请日：1999-06-30
申请人： Osram Opto Semiconductors GmbH & Co. OHG
发明人： WAITL, Günter , BRUNNER, Herbert
IPC分类号： H01L33/00 , H01L31/0203
CPC分类号： H01L33/486 , H01L24/45 , H01L31/0203 , H01L33/62 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/01019 , H01L2924/01058 , H01L2924/01079 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a component which can emit and/or receive radiation. A radiation-emitting and/or receiving optoelectronic chip (1) is fixed on a chip-supporting part (2) of an electrical lead frame (3) and partial areas of the chip-supporting part (2) and of external electrical connection parts (4, 5) are surrounded by a radiopaque base body (8). Said base body has a trough (9) in which the chip (1) is situated and which is filled with a transparent window part (10). According to the invention, the chip-supporting part (2) is completely surrounded by the radiopaque base body (8) up to the area (6) where the chip (1) is fixed and the external electrical connection parts (4, 5) are completely surrounded by the radiopaque base body (8) up to the areas (7) where one or more electrical connection leads (11) to the chip (1) are fixed.
摘要翻译：设置容纳半导体芯片的壳体。外壳和芯片可用于发送和/或接收辐射。壳体的普遍应用可以在发光二极管中。壳体包括被冲压成两个电隔离部分的导体条。壳体还包括从壳体的顶部向内延伸的腔体。导体部分包括暴露在空腔底部的相应区域。半导体芯片被接合到一个暴露区域，并且引线将芯片连接到第二暴露区域。导体部分也终止在暴露的电极中，这允许芯片与外部装置的电连接。在空腔中形成窗口，并且形成空腔的壳体的壁可以由反射材料制成。电极保持未曝光到窗口，但是对于芯片周围的任何残留区域以及第一和第二暴露区域内的接合线。通过使暴露于窗口的导体的面积最小化，窗口和导体的不同热膨胀引起的分层被最小化和/或消除。类似地，通过覆盖容纳窗口的空腔的基部的反射壳体，内部辐射反射增加超过用暴露导体实现的反射。

7. 发明公开

EP1920470A1 OBERFLÄCHENMONTIERBARES OPTOELEKTRONISCHES HALBLEITERBAUELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG 有权转让
标题翻译： VERFAHREN ZU DESSEN HERSTELLUNG的OBERFLÄCHENMONTIBARESOPTOELEKTRONISCHES HALBLEITERBAUELEMENT
公开(公告)号：EP1920470A1
公开(公告)日：2008-05-14
申请号：EP06775910.0
申请日：2006-08-24
申请人： Osram Opto Semiconductors GmbH & Co. OHG
发明人： BRAUNE, Bert , BRUNNER, Herbert , HÖFER, Thomas , JÄGER, Harald , SCHWARZ, Raimund
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L24/97 , H01L25/167 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48228 , H01L2224/48247 , H01L2224/48465 , H01L2224/48472 , H01L2224/8592 , H01L2924/01055 , H01L2924/01065 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/12035 , H01L2924/12036 , H01L2924/12041 , H01L2924/12043 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Disclosed is a surface-mounted component comprising an optoelectronic semiconductor chip (1), a molded member (2) that is molded onto the semiconductor chip (1), an assembly area (3) which is formed at least in some points by a surface of the molded member (2), and at least one terminal point (4a, 4b) which is overlapped laterally by the molded member (2) or extends flush with the molded member (2). Also disclosed is a method for producing such a component.
摘要翻译：表面安装的光电子部件包括光电子半导体芯片（1），成形体（2），其成形在芯片上，安装表面（3）至少定位成穿过成形体的表面，至少通过切割产生的部件的一个连接点（4a，4b）和侧表面（2a，2b）。对于上述的生产过程也包括独立权利要求。

8. 发明公开

EP1716597A1 OPTOELEKTRONISCHES BAUELEMENT, VORRICHTUNG MIT EINER MEHRZAHL OPTOELEKTRONISCHER BAUELEMENTE UND VERFAHREN ZUR HERSTELLUNG EINES OPTOELEKTRONISCHEN BAUELEMENTS 有权转让
标题翻译：光电子器件，具有用于制造光电子器件光电元器件多个和方法的装置
公开(公告)号：EP1716597A1
公开(公告)日：2006-11-02
申请号：EP05706767.0
申请日：2005-02-18
申请人： Osram Opto Semiconductors GmbH & Co. OHG
发明人： WIRTH, Ralf , BRUNNER, Herbert , ILLEK, Stefan , EISSLER, Dieter
IPC分类号： H01L27/15 , H01L27/14 , H01L31/0224 , H01L33/00
CPC分类号： H01L31/022408 , H01L31/022416 , H01L33/0079 , H01L33/0095 , H01L33/382 , H01L2224/16225
摘要： Disclosed is an optoelectronic component (1) comprising a functional semiconductor area (2) with an active zone (400) and a lateral principal direction of extension. The functional semiconductor area is provided with at least one breakthrough (9, 27, 29) through the active zone while a connecting conductor material (8) which is electrically isolated (10) from the active zone at least in one subarea of the breakthrough is arranged in the region of the breakthrough. Also disclosed are a method for producing such an optoelectronic component and a device comprising a plurality of optoelectronic components. Said component and device can be produced entirely as a wafer combination.

9. 发明公开

EP1312124A1 OPTOELEKTRONISCHES BAUELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG, MODUL UND VORRICHTUNG MIT EINEM SOLCHEN MODUL 有权
标题翻译：光电子器件和方法ITS，模块和设备符合这样的模块
公开(公告)号：EP1312124A1
公开(公告)日：2003-05-21
申请号：EP01971630.7
申请日：2001-08-22
申请人： Osram Opto Semiconductors GmbH & Co. OHG
发明人： BOGNER, Georg , BRUNNER, Herbert , LEX, Wolfgang , WAITL, Günter
IPC分类号： H01L33/00 , H01L31/0203 , H01L25/13 , H01L25/16
CPC分类号： H01L33/486 , H01L25/13 , H01L25/167 , H01L2224/48091 , H01L2924/01055 , H01L2924/01068 , H01L2924/12041 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to an optoelectronic component comprising a semiconductor chip (1), which is mounted on a flexible chip support (6). Strip conductors (3, 5) for electrically connecting the semiconductor chip (1) are configured on a first primary surface of said support and the latter also accommodates a housing frame (7), which is filled with a radiation-permeable medium, in particular a filler compound. The invention also relates to a display device, an illumination or backlighting device and to a method for producing components according to the invention.

10. 发明授权

EP0878026B1 LEUCHTDIODENMATRIX 失效
公开(公告)号：EP0878026B1
公开(公告)日：2002-07-24
申请号：EP97907037.2
申请日：1997-01-31
申请人： Osram Opto Semiconductors GmbH & Co. OHG
发明人： GRAMANN, Wolfgang , SPÄTH, Werner , WAITL, Günther , BRUNNER, Herbert
IPC分类号： H01L25/075 , H01L33/00
CPC分类号： H01L33/38 , G09F9/33 , H01L24/32 , H01L25/0753 , H01L33/40 , H01L33/62 , H01L2924/09701 , H01L2924/10253 , H01L2924/00
摘要： The invention concerns an LED device (1) comprising at least one LED chip (2), wherein front contact plating (8) is disposed on a light outlet surface of a light-emitting body (5) and rear contact plating (6) is disposed on a side of the light-emitting body (5) lying opposite the light outlet surface. The LED chip (2) is disposed between a first (15) and a second strip conductor carrier (31), the first strip conductor (15) being transparent and comprising at least one first electrical conductor (16) which contacts the front contact plating (8), and the second strip conductor carrier (31) comprising at least one second electrical conductor (13) which contacts the rear contact plating (6). The LED device (1) according to the invention has inter alia the particular advantage that the size of the LED chip (2) is reduced with respect to conventional LED devices and hence the beam density can be increased.
摘要翻译：本发明涉及一种包括至少一个LED芯片（2）的LED器件（1），其中前接触镀层（8）设置在发光体（5）的光出口表面上并且后接触镀层（6）是设置在发光体（5）的与光出口表面相对的一侧上。所述LED芯片（2）设置在第一带状导体载体（15）和第二带状导体载体（31）之间，所述第一带状导体（15）是透明的并且包括至少一个第一导电体（16）（8），并且所述第二带状导体载体（31）包括与所述后接触镀层（6）接触的至少一个第二电导体（13）。根据本发明的LED装置（1）尤其具有特定的优点，即相对于常规的LED装置，LED芯片（2）的尺寸减小并且因此可以增加光束密度。

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