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    • 7. 发明公开
    • SEMICONDUCTOR CONSTRUCTIONS, ELECTRONIC SYSTEMS, AND METHODS OF FORMING CROSS-POINT MEMORY ARRAYS
    • HALBLEITERKONSTRUKTIONEN,ELEKTRONISCHE SYSTEME UND VERFAHREN ZUR BILDUNG VON CROSSPOINT-SPEICHERARRAYS
    • EP2150978A1
    • 2010-02-10
    • EP08733169.0
    • 2008-04-08
    • Micron Technology, Inc.
    • MOULI, Chandra
    • H01L27/102G11C13/00H01L27/24H01L21/822H01L27/06
    • H01L27/1021G11C13/0002G11C2213/71G11C2213/72G11C2213/74H01L27/2418H01L27/2481
    • The present application concerns vertical stacks of memory units (14, 16, 18), with individual memory units each having a memory element (28), a wordline (22), a bitline (24) and at least one diode (26). The memory units may correspond to cross-point memory, and the diodes may correspond to band-gap engineered diodes containing two or more dielectric layers sandwiched between metal layers. Tunneling properties of the dielectric materials and carrier injection properties of the metals may be tailored to engineer desired properties into the diodes. The diodes may be placed between the bitlines and the memory elements, or may be placed between the wordlines and memory elements. Some embodiments include methods of forming cross-point memory arrays. The memory arrays may contain vertical stacks- of memory unit cells, with individual unit cells containing cross-point memory and at least one diode, and adjacent memory units being spaced from one another by a passivation material (20).
    • 一些实施例包括存储器单元的垂直堆叠,其中各个存储器单元各自具有存储元件,字线,位线和至少一个二极管。 存储单元可以对应于交叉点存储器,并且二极管可以对应于包含夹在金属层之间的两个或多个电介质层的带隙工程二极管。 介电材料的隧道性能和金属的载流子注入性能可以被调整为将所需的性质设计到二极管中。 二极管可以放置在位线和存储器元件之间,或者可以放置在字线和存储元件之间。 一些实施例包括形成交叉点存储器阵列的方法。 存储器阵列可以包含存储单元单元的垂直堆叠,其中单个单元单元包含交叉点存储器和至少一个二极管。