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1. 发明公开

EP3356289A1 SIMPLIFIED MEMS DEVICE FABRICATION PROCESS 审中-公开
公开(公告)号：EP3356289A1
公开(公告)日：2018-08-08
申请号：EP16852577.2
申请日：2016-09-29
申请人： Mems Drive Inc.
发明人： GUTIERREZ, Roman , TANG, Tony , LIU, Xiaolei , NG, Matthew , WANG, Guiqin
IPC分类号： B81C1/00
CPC分类号： B81C1/00476 , B81B2201/033 , B81C1/00619 , B81C99/0095 , B81C2201/0132 , B81C2201/056
摘要： A simplified MEMS fabrication process and MEMS device is provided that allows for cheaper and lighter-weight MEMS devices to be fabricated. The process comprises etching a plurality of holes or other feature patterns into a MEMS device, and then etching away the underlying wafer such that, after the etching process, the MEMS device is the required thickness and the individual die are separated, avoiding the extra steps of wafer thinning and die dicing. By etching trenches into the substrate wafer and filling them with a MEMS base material, sophisticated taller MEMS devices with larger force may be made.

2. 发明公开

EP3140563A1 LOW STIFFNESS FLEXURE 审中-公开
标题翻译： FLEXUR MIT GERINGER STEIFIGKEIT
公开(公告)号：EP3140563A1
公开(公告)日：2017-03-15
申请号：EP15789553.3
申请日：2015-04-02
申请人： Mems Drive Inc.
发明人： LIU, Xiaolei , GUTIERREZ, Roman , WANG, Guiqin , MAI, Benson , NG, Matthew
IPC分类号： F16F1/18
CPC分类号： B81B3/0051 , B81B3/007 , B81B2203/0163 , Y10T74/20
摘要： A flexure includes a support first end connected to a first frame; a support second end connected to a second frame; and a buckled section connecting the first support end to the second support end. The length of the flexure is substantially greater than its width, and the width of the flexure is substantially greater than its thickness. During operation, the flexure is maintained in a buckled state where the flexure's stiffness is significantly less than in the unbuckled state. In one implementation, a stage includes a flexure array joining a first frame and a second frame, where: the first frame and the second frame are substantially on a plane; the flexure array is substantially on the plane prior to buckling by the flexures of the flexure array; and the flexure array is bent substantially out of the plane after buckling by the flexures.
摘要翻译：挠性件包括连接到第一框架的支撑件第一端; 支撑第二端连接到第二框架; 以及将所述第一支撑端连接到所述第二支撑端的弯曲部。挠曲的长度明显大于其宽度，并且挠曲件的宽度基本上大于其厚度。在操作期间，挠曲保持在弯曲状态，其中挠曲刚度显着小于未弯曲状态。在一个实施方案中，舞台包括连接第一框架和第二框架的挠曲阵列，其中：第一框架和第二框架基本上在平面上; 弯曲阵列在由挠曲阵列的挠曲弯曲之前基本上在平面上; 并且挠曲阵列在由弯曲部弯曲之后基本上弯曲成平面。

3. 发明公开

EP3356288A1 MEMS GRID FOR MANIPULATING STRUCTURAL PARAMETERS OF MEMS DEVICES 有权
公开(公告)号：EP3356288A1
公开(公告)日：2018-08-08
申请号：EP16852584.8
申请日：2016-09-29
申请人： Mems Drive Inc.
发明人： GUTIERREZ, Roman , TANG, Tony , LIU, Xiaolei , WANG, Guiqin , NG, Matthew
IPC分类号： B81B7/04 , B81B5/00 , B81B3/00
CPC分类号： H01L21/76816 , B81B3/0045 , B81B7/0029 , B81B2203/0353 , B81C1/00674 , B81C1/00682 , B81C2201/0112 , B81C2201/0135 , H01L21/768 , H01L21/76898 , H01L23/485 , H01L2924/00 , H01L2924/00014 , H01L2924/0002 , H01L2924/1461 , H01L2924/181
摘要： A system and method for manipulating the structural characteristics of a MEMS device include etching a plurality of holes into the surface of a MEMS device, wherein the plurality of holes comprise one or more geometric shapes determined to provide specific structural characteristics desired in the MEMS device.

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