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    • 3. 发明公开
    • Integrated electro-optical package
    • 集成电光学封装
    • EP0675541A1
    • 1995-10-04
    • EP95103832.2
    • 1995-03-16
    • MOTOROLA, INC.
    • Nelson, Ronald J.Stafford, John W.Harvey, Thomas B., III
    • H01L25/16G09F9/33
    • G09F9/33H01L25/167H01L2224/48091H01L2224/48227H01L2224/48464H01L2924/12044H01L2924/00014H01L2924/00
    • An integrated electro-optical package (50) including an optically transparent substrate (10) with a large array (20) of light emitting devices (12) formed thereon and cooperating to generate a complete real image. The light emitting devices (12) are positioned in rows and columns and connected to pads (33) adjacent outer edges of the substrate (10). A driver substrate (55) having mounting pads, bump bonded (58) to the pads (33) on the substrate (10). A plurality of driver circuits (57) connected to the light emitting devices (12) through terminals on the driver substrate (55). A lens (60) mounted to the substrate (10) over the array (20) of light emitting devices (12) and on a side opposite to magnify the real image and produce an easily viewable virtual image.
    • 一种集成电光封装(50),其包括光学透明衬底(10),所述光学透明衬底(10)上形成有大阵列(20)的发光器件(12)并且协作以产生完整的实像。 发光器件(12)以行和列排列并连接到与衬底(10)的外边缘相邻的衬垫(33)。 具有安装垫的驱动器基板(55)凸块结合(58)到基板(10)上的垫(33)。 多个驱动器电路(57)通过驱动器基板(55)上的端子连接到发光器件(12)。 在发光器件(12)的阵列(20)上和与放大真实图像相反的一侧上安装到衬底(10)上的透镜(60)并产生容易观看的虚像。