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    • 7. 发明公开
    • Integrated electro-optical package and method of fabrication
    • Integrierte elektrooptische Packung und Herstellungsverfahren
    • EP0884782A1
    • 1998-12-16
    • EP97109441.2
    • 1997-06-11
    • MOTOROLA, INC.
    • Wei, ChengpingShi, Song Q.Lee, Hsing-Chung
    • H01L25/16H01L51/20
    • H01L27/3288H01L25/167H01L51/5243H01L51/5246H01L2224/16225
    • An integrated electro-optical package including a plurality of organic light emitting devices (LEDs) directly interconnected to external driver circuits utilizing a printed circuit board, having formed therein a plurality of plated through-hole vias and a method of fabricating the integrated electro-optical package. The organic LEDs are fabricated on a supporting substrate (12) and include vertical interconnections (24) to driver and control circuits (22) mounted on an uppermost surface of a printed circuit board (PCB) (20). The vertical interconnections are formed utilizing plated through-hole conductive vias formed in the printed circuit board, conductive leads, and conductive epoxy (26). A hermetic seal (28,29) is formed by positioning a sealing ring (28) formed on the printed circuit board in sealing contact with a sealing area on the surface of the substrate so as to hermetically seal the organic light emitting devices.
    • 一种集成电光学封装,包括使用印刷电路板直接互连到外部驱动器电路的多个有机发光器件(LED),其中形成有多个电镀通孔,以及制造集成电光学 包。 有机LED制造在支撑基板(12)上,并且包括安装在印刷电路板(PCB)(20)的最上表面上的驱动器和控制电路(22)的垂直互连(24)。 使用形成在印刷电路板,导电引线和导电环氧树脂(26)中的电镀通孔导电通孔形成垂直互连。 通过将形成在印刷电路板上的密封环(28)定位成与衬底表面上的密封区域密封接触来形成气密密封件(28,29),从而气密地密封有机发光器件。